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power supply components LanTu Micro SDRI125-151MT shielded SMD inductors with RoHS and REACH compliance

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Product Description

Shielded SMD Power Inductors - SDRI125 Series

Product Overview

The SDRI125 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high performance in demanding applications. These inductors feature a closed magnetic circuit design to minimize leakage flux, high saturation current, and low DC resistance. Their highly accurate dimensions ensure suitability for automatic mounting processes. Available in various package sizes and a wide inductance range, these inductors comply with RoHS, Halogen Free, and REACH standards. They are ideal for power supplies in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.

Product Attributes

  • Brand: LANTU
  • Manufacturer: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SDRI125
  • Type: Shielded SMD Power Inductors
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Magnetic Circuit Design: Closed magnetic circuit
  • Mounting Type: SMD (Surface Mount Device)
  • Packaging Options: Bulk Package (B), Tape & Reel (T)

Technical Specifications

General Specifications:

Item Specification
Operating Temperature -40 to +125 (Including coils self-temperature rise)
Test Equipment (Inductance) HP4284A, HP4285A LCR meter or equivalent
Test Equipment (Current) HP4284+42841A or equivalent
Test Equipment (Q Factor) HP4285A or equivalent
Test Equipment (DCR) Chroma 16502 or equivalent

Product Identification Example: SDRI 125 470 M T

Part Description
SDRI Type (Shielded SMD Power Inductors)
125 External Dimensions (LWH) in mm (12.312.36.0)
470 Inductance (47 H)
M Inductance Tolerance (M: 20%)
T Packing (Tape & Reel)

Electrical Characteristics (SDRI125 Series):

Part No. Inductance (H) @ 0A Tolerance Test Freq. (L) Q Factor Min. Test Freq. (Q) DCR () Max. Saturation Current (A) Max. Temperature Rise Current (A) Max.
SDRI125-1R0N 1.0 30% 100KHz 20 1MHz 0.010 15.80 8.00
SDRI125-2R2N 2.2 30% 100KHz 20 1MHz 0.014 13.50 7.80
SDRI125-2R4N 2.4 30% 100KHz 20 1MHz 0.014 12.00 7.50
SDRI125-3R3N 3.3 30% 100KHz 20 1MHz 0.017 10.50 6.80
SDRI125-4R7N 4.7 30% 100KHz 30 1MHz 0.020 9.50 5.60
SDRI125-5R8N 5.8 30% 100KHz 30 1MHz 0.021 8.60 5.20
SDRI125-8R2N 8.2 30% 100KHz 30 1MHz 0.023 7.00 4.40
SDRI125-100N 10 30% 100KHz 35 1MHz 0.025 6.50 4.00
SDRI125-120M 12 20% 100KHz 35 1MHz 0.027 6.00 3.50
SDRI125-150M 15 20% 100KHz 35 1MHz 0.030 5.40 3.30
SDRI125-180M 18 20% 100KHz 35 1MHz 0.034 4.90 3.00
SDRI125-220M 22 20% 100KHz 35 1MHz 0.036 4.70 2.80
SDRI125-270M 27 20% 100KHz 35 1MHz 0.051 4.00 2.30
SDRI125-330M 33 20% 100KHz 35 1MHz 0.057 3.58 2.10
SDRI125-390M 39 20% 100KHz 35 1MHz 0.068 3.30 2.00
SDRI125-470M 47 20% 100KHz 35 1MHz 0.075 3.20 1.80
SDRI125-560M 56 20% 100KHz 35 1MHz 0.110 2.80 1.70
SDRI125-680M 68 20% 100KHz 35 1MHz 0.120 2.50 1.50
SDRI125-820M 82 20% 100KHz 35 1MHz 0.140 2.30 1.40
SDRI125-101M 100 20% 100KHz 40 0.796MHz 0.160 1.90 1.30
SDRI125-121M 120 20% 100KHz 40 0.796MHz 0.170 1.80 1.10
SDRI125-151M 150 20% 100KHz 40 0.796MHz 0.230 1.70 1.00
SDRI125-181M 180 20% 100KHz 40 0.796MHz 0.290 1.60 0.90
SDRI125-221M 220 20% 100KHz 40 0.796MHz 0.400 1.45 0.80
SDRI125-271M 270 20% 100KHz 40 0.796MHz 0.460 1.20 0.75
SDRI125-331M 330 20% 100KHz 40 0.796MHz 0.510 1.15 0.68
SDRI125-391M 390 20% 100KHz 40 0.796MHz 0.690 1.10 0.65
SDRI125-471M 470 20% 100KHz 40 0.796MHz 0.770 0.94 0.58
SDRI125-561M 560 20% 100KHz 40 0.796MHz 0.860 0.90 0.54
SDRI125-681M 680 20% 100KHz 40 0.796MHz 1.200 0.70 0.48
SDRI125-821M 820 20% 100KHz 40 0.796MHz 1.340 0.55 0.40
SDRI125-102M 1000 20% 100KHz 40 0.796MHz 1.530 0.44 0.35

Definitions:

  • Saturation Current: DC current at which inductance drops 30% from its value without current.
  • Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
  • Rated DC Current: The lesser value of Isat or Irms.

Dimensions (mm):

Part No. A (Max) B (Max) C (Max) D E F G H
SDRI125 12.5 12.5 6.0 5.0 7.6 2.9 7.0 5.4

Recommended Land Pattern (mm):

A B C D E F G H
12.5 12.5 6.0 5.0 7.6 2.9 7.0 5.4

Packaging Specifications:

Item Dimensions (mm)
Tape Dimension W 24
Tape Dimension P 16
Tape Dimension H 11.5
Reel Dimension A 24.4
Reel Dimension B 100
Reel Dimension C 13
Reel Dimension D 330

Packing Quantity:

Part No. REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
SDRI125 500 1000 4000

Cover Tape Peel Off Condition:

  • Cover tape peel force: 10 to 120g
  • Noodle strip peeling angle: 165 to 180

Reliability Testing:

Item Requirements Test Methods and Remarks
Terminal Strength (SMT) Meet requirements without any loose terminal Pulling test based on terminal area; Solder paste thickness: 0.12mm; Keep time: 101s; Speed: 1.0mm/s.
Terminal Strength (DIP) Meet requirements without any loose terminal Applied force based on terminal diameter (5N to 40N); Duration: 10sec.
Resistance to Flexure No visible mechanical damage; Inductance change within 10% (Mn-Zn: Within 30%) Flexure: 2mm; Speed: 0.5mm/sec; Keep time: 30 sec.
Dropping No case deformation or change in appearance; No short and no open. Drop packaged products from 1m height in 1 angle, 3 ridges and 6 surfaces, twice in each direction.
Solderability Terminals must have 95% minimum solder coverage; Wetting shall exceed 75% coverage Solder temperature: 2402; Duration: 3 sec.
Vibration No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20% Frequency 10 to 55 Hz; Amplitude 1.5mm; Duration 2 hours in each 3 mutually perpendicular directions.
Thermal Shock No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20% 100 cycles of temperature cycling between high (85~125) and low (-55~40); Transforming interval: Max. 20 sec.
Low temperature Storage No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20% Temperature: -55~-402; Duration: 962 hours.
High temperature Storage No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20% Temperature: 125~852; Duration: 962 hours.
Damp Heat (Steady States) No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20% Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours.
Heat endurance of Reflow soldering No significant defects in appearance; L/L10% (Mn-Zn: L/L30%); Q/Q30%; DCR/DCR10% Peak temperature: 260+0/-5; Performed twice.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking Dip into IPA solvent for 50.5Min, dry for 5Min, then brush 10 times.
Overload test During the test no smoke, no peculiar smell, no fire; The characteristic is normal after test Apply twice rated current for 5 minutes.
Voltage resistance test During the test no breakdown; The characteristic is normal after test DC1000V, Current: 1mA, Time: 1Min.

Recommended Reflow Soldering Curve:

The recommended reflow conditions are set according to soldering equipment. Users should adjust and confirm according to their specific environment/equipment.

Reminders for Using These Products:

  • Storage period is within 12 months. Storage conditions: 5~40C, 35-65% RH.
  • Do not use or store in environments with gas corrosion (salt, acid, alkali, etc.).
  • Avoid direct contact with terminals due to hand oils affecting solderability.
  • Handle products carefully to prevent damage from dropping or improper removal.
  • Do not bend terminals excessively to avoid wire fracture.
  • Do not rinse coils; contact the manufacturer if cleaning is necessary.
  • Do not expose products to magnets or magnetic fields.
  • Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance degradation, or lifespan reduction.
  • Allow for sufficient thermal design margin due to self-heating when power is on.
  • For non-magnetic shielded types, carefully lay out coils on the PCB to prevent malfunction due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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