Surface mount unshielded SMD power inductors LanTu Micro SCD5845-100MT with low DC resistance and high rated current
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Product Description
Unshielded SMD Power Inductors - SCD5845 Series
Product Overview
The SCD5845 Series are unshielded SMD power inductors designed for surface mounting applications. These low-cost inductors feature a silver-plated type construction, offering small size with high rated current and low DC resistance. They are suitable for various electronic devices including VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters. The series is compliant with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Series: SCD5845
- Type: Unshielded SMD Power Inductors
- Construction: Silver plated type
- Certifications: RoHS, Halogen Free, REACH Compliance
- Packaging Options: Bulk Package (B), Tape & Reel (T)
Technical Specifications
General Specifications:
| Item | Description |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Test Equipment - L | HP4284A, HP4285A LCR meter or equivalent |
| Test Equipment - Isat & Irms | HP4284+42841A or equivalent |
| Test Equipment - SRF | Agilent E4991A or equivalent |
| Test Equipment - DCR | Chroma 16502 or equivalent |
Product Model Identification: SCD 5845 [Inductance] M T
Example: SCD5845-100M T means 10uH inductance, M tolerance (20%), Tape & Reel packaging.
External Dimensions (LWH): 5.84.5 mm
Inductance Tolerance Options: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Electrical Characteristics (Electrical specifications at 25):
| Part No. | Inductance L(H) @0A | Test Freq | Tole | SRF Min (MHz) | DCR Typ () | Saturation Current Isat Max (A) | Temperature Rise Current Irms Max (A) | |
|---|---|---|---|---|---|---|---|---|
| SCD5845-1R0M | 1.0 | 100KHz | M | 20 | 7.96MHz | 0.013 | 6.00 | 5.40 |
| SCD5845-1R5M | 1.5 | 100KHz | M | 85 | 7.96MHz | 0.017 | 5.00 | 4.70 |
| SCD5845-3R3M | 3.3 | 100KHz | M | 47 | 7.96MHz | 0.031 | 4.00 | 3.70 |
| SCD5845-4R7M | 4.7 | 100KHz | M | 38 | 7.96MHz | 0.052 | 3.50 | 3.10 |
| SCD5845-6R8M | 6.8 | 100KHz | M | 31 | 7.96MHz | 0.059 | 3.00 | 2.40 |
| SCD5845-8R2M | 8.2 | 100KHz | M | 27 | 7.96MHz | 0.062 | 2.50 | 2.00 |
| SCD5845-100M | 10 | 100KHz | M | 35 | 2.52MHz | 0.075 | 1.60 | 1.44 |
| SCD5845-120M | 12 | 100KHz | M | 35 | 2.52MHz | 0.088 | 1.45 | 1.40 |
| SCD5845-150M | 15 | 100KHz | M | 35 | 2.52MHz | 0.105 | 1.35 | 1.30 |
| SCD5845-180M | 18 | 100KHz | M | 35 | 2.52MHz | 0.117 | 1.26 | 1.23 |
| SCD5845-220M | 22 | 100KHz | M | 35 | 2.52MHz | 0.153 | 1.12 | 1.11 |
| SCD5845-270M | 27 | 100KHz | M | 35 | 2.52MHz | 0.169 | 1.04 | 0.97 |
| SCD5845-330M | 33 | 100KHz | M | 35 | 2.52MHz | 0.208 | 0.96 | 0.88 |
| SCD5845-390M | 39 | 100KHz | M | 35 | 2.52MHz | 0.215 | 0.85 | 0.80 |
| SCD5845-470M | 47 | 100KHz | M | 35 | 2.52MHz | 0.355 | 0.80 | 0.72 |
| SCD5845-560M | 56 | 100KHz | M | 35 | 2.52MHz | 0.377 | 0.72 | 0.68 |
| SCD5845-680M | 68 | 100KHz | M | 35 | 2.52MHz | 0.390 | 0.68 | 0.61 |
| SCD5845-820M | 82 | 100KHz | M | 35 | 2.52MHz | 0.416 | 0.64 | 0.58 |
| SCD5845-101M | 100 | 100KHz | M | 40 | 1KHz | 0.611 | 0.56 | 0.52 |
| SCD5845-121M | 120 | 100KHz | M | 40 | 1KHz | 0.754 | 0.52 | 0.48 |
| SCD5845-151M | 150 | 100KHz | M | 40 | 1KHz | 0.845 | 0.44 | 0.40 |
| SCD5845-181M | 180 | 100KHz | M | 40 | 1KHz | 1.040 | 0.40 | 0.38 |
| SCD5845-221M | 220 | 100KHz | M | 40 | 1KHz | 1.450 | 0.36 | 0.35 |
| SCD5845-331M | 330 | 100KHz | M | 40 | 1KHz | 1.760 | 0.34 | 0.28 |
| SCD5845-471M | 470 | 100KHz | M | 40 | 1KHz | 2.990 | 0.32 | 0.24 |
| SCD5845-681M | 680 | 100KHz | M | 40 | 1KHz | 3.900 | 0.29 | 0.20 |
| SCD5845-102M | 1000 | 100KHz | M | 40 | 1KHz | 5.800 | 0.26 | 0.19 |
Definitions:
- Saturation Current (Isat): DC current at which inductance drops 10% from its value without current.
- Temperature Rise Current (Irms): The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat or Irms.
Packaging Details:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SCD5845 | 12 | 8 | 7.5 | 16.4 | 100 | 13 | 330 | 1500 | 4500 | 18,000 |
Cover tape peel off condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on terminal cross-sectional area. Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force based on terminal diameter (0.35mm to >1.25mm). Duration: 10sec. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high (1 angle, 3 ridges, 6 surfaces, twice in each direction). |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Frequency: 10 to 55 Hz (total amplitude 1.5mm). Applied for 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature cycling between -55~40 and 85~125. Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, then dry for 5Min, brushing 10 times. |
| Overload test | During test no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test no breakdown. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Recommended reflow soldering curve:
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm according to their specific environment and equipment.
Reminders for Using These Products:
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Exceeding storage time may degrade terminal solderability.
- Environment: Avoid use or storage in environments with gas corrosion (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability. Handle products carefully to prevent damage from dropping.
- Terminals: Do not bend terminals excessively to avoid wire fracture.
- Cleaning: Do not clean coils. Contact the manufacturer if cleaning is necessary.
- Magnetism: Do not expose products to magnets or magnetic fields.
- Preheating: Preheating is required before soldering. The temperature difference between solder and chip should not exceed 150C.
- Soldering Correction: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is applied; ensure sufficient thermal design margin.
- Layout: For non-magnetic shield types, careful coil placement on the circuit board is necessary to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina