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Shielded SMD Power Inductors featuring closed magnetic circuit LanTu Micro SDRI129-470MT ideal for power supplies

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Product Description

Product Overview

The SDRI129 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high performance in demanding applications. Featuring a closed magnetic circuit for reduced leakage, high saturation current, and low DCR, these inductors offer high accuracy dimensions suitable for automatic mounting. They are available in various package sizes and inductance ranges, complying with RoHS, Halogen Free, and REACH standards. Ideal for power supplies in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Product Series: SDRI129 Series
  • Type: Shielded SMD Power Inductors
  • Magnetic Circuit Design: Closed magnetic circuit
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Mounting Type: SMD (Surface Mount Device)
  • Packaging Options: Bulk Package (T), Tape & Reel (B)

Technical Specifications

General Specifications:

Item Specification Details
Operating Temperature -40 to +125 (Including coils self-temperature rise)
Test Equipment (Inductance) HP4284A, HP4285A or equivalent LCR meter
Test Equipment (Current) HP4284A+42841A or equivalent Saturation and RMS current measurement
Test Equipment (DCR) Chroma 16502 or equivalent DC Resistance measurement
External Dimensions (LWH) 12.5 12.5 10.0 mm For SDRI129 series

Product Identification:

Part Description
SDRI 129 Type (Shielded SMD Power Inductors, Closed magnetic circuit)
220 Inductance Value (e.g., 22 uH)
M Inductance Tolerance (e.g., 20%)
T Packing (Tape & Reel)

Inductance Tolerance Codes:

Code Tolerance
J 5%
K 10%
L 15%
M 20%
P 25%
N 30%

Electrical Characteristics (Selected Models):

Part No. Inductance L(H) @0A Tolerence Test Freq DCR () Max Saturation Current Isat (A) Max Temperature Rise Current Irms (A) Max
SDRI129-1R0N 1.0 30% 100KHz 0.0060 19.90 11.60
SDRI129-2R2N 2.2 30% 100KHz 0.0090 12.20 10.30
SDRI129-100M 10 20% 100KHz 0.018 7.12 6.95
SDRI129-220M 22 20% 1KHz 0.038 5.12 4.95
SDRI129-470M 47 20% 1KHz 0.072 3.60 3.45
SDRI129-101M 100 20% 1KHz 0.126 2.31 2.45
SDRI129-221M 220 20% 1KHz 0.246 1.64 1.72
SDRI129-471M 470 20% 1KHz 0.471 1.06 1.25
SDRI129-102M 1000 20% 1KHz 1.220 0.70 0.78
SDRI129-222M 2200 20% 1KHz 2.580 0.43 0.52

Definitions:

  • Saturation Current: DC current at which inductance drops 25% from its value without current.
  • Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
  • Rated DC Current: The lesser value of Isat or Irms.

Packaging Details:

Part No. Tape Dimension (W x P x H) mm Reel Dimensions (A x B x C x D) mm REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
SDRI129 24 x 16 x 11.5 24.4 100 400 3200

Cover Tape Peel Off Condition:

  • Cover tape peel force: 10 to 120g
  • Noodle strip peeling angle: 165 to 180

Reliability Testing (Summary):

Item Requirements Test Methods & Remarks
Terminal Strength (SMT/DIP) Meets specified force and duration requirements without loose terminals. Based on GB/T 2423.60-2008, JIS C 5321:1997
Resistance to Flexure No visible mechanical damage. Based on JIS C 5321:1997
Dropping Test No case deformation, no short/open. Based on GB/T 2423.7-2018
Solderability 75% wetting coverage, 95% solder coverage on terminals. Based on GB/T 2423.28-2005
Vibration Test No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. Based on GB/T 2423.10-2019
Thermal Shock No visible mechanical damage; Inductance change: 10% (Mn-Zn: 30%); Q factor change: 20%. Based on GB/T 2423.22-2012 (Method Na)
Low Temperature Storage No visible mechanical damage; Inductance change: 10% (Mn-Zn: 30%); Q factor change: 20%. Based on GB/T 2423.1-2008 (Method Ab)
High Temperature Storage No visible mechanical damage; Inductance change: 10% (Mn-Zn: 30%); Q factor change: 20%. Based on GB/T 2423.2-2008 (Method Bb)
Damp Heat (Steady States) No visible mechanical damage; Inductance change: 10% (Mn-Zn: 30%); Q factor change: 20%. Based on GB/T 2423.3-2016
Heat Endurance of Reflow Soldering No significant defects; L/L 10% (Mn-Zn: 30%); Q/Q 30%; DCR/DCR 10%. Based on GJB 360B-2009
Resistance to Solvent Test No case deformation, appearance change, or marking obliteration. Based on IEC 68-2-45:1993
Overload Test No smoke, smell, or fire during test; characteristics normal after test. Based on JIS C5311-6.13
Voltage Resistance Test No breakdown during test; characteristics normal after test. Based on MIL-STD-202G Method 301

Recommended Reflow Soldering Curve:

Refer to the provided graph for recommended reflow conditions. Users should adjust and confirm conditions based on their specific equipment and environment.

Reminders for Using These Products:

  • Storage: Within 12 months, under 5~40C and 35~65% RH. Terminal solderability may deteriorate beyond this period.
  • Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals to prevent reduced solderability. Handle with care to prevent damage from dropping.
  • Soldering: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C. Post-mounting soldering corrections must be within specifications to avoid performance degradation or reduced lifespan.
  • Thermal Design: Account for self-heating when power is applied.
  • Layout: For non-magnetic shielded types, careful coil placement on the PCB is necessary to prevent malfunctions due to magnetic interference.
  • Cleaning: Do not rinse coils; contact the manufacturer if cleaning is required.
  • Magnetic Fields: Keep away from magnets or magnetic objects.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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