Shielded SMD Power Inductors featuring closed magnetic circuit LanTu Micro SDRI129-470MT ideal for power supplies
Product Overview
The SDRI129 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high performance in demanding applications. Featuring a closed magnetic circuit for reduced leakage, high saturation current, and low DCR, these inductors offer high accuracy dimensions suitable for automatic mounting. They are available in various package sizes and inductance ranges, complying with RoHS, Halogen Free, and REACH standards. Ideal for power supplies in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Series: SDRI129 Series
- Type: Shielded SMD Power Inductors
- Magnetic Circuit Design: Closed magnetic circuit
- Certifications: RoHS, Halogen Free, REACH Compliance
- Mounting Type: SMD (Surface Mount Device)
- Packaging Options: Bulk Package (T), Tape & Reel (B)
Technical Specifications
General Specifications:
| Item | Specification | Details |
|---|---|---|
| Operating Temperature | -40 to +125 | (Including coils self-temperature rise) |
| Test Equipment (Inductance) | HP4284A, HP4285A or equivalent | LCR meter |
| Test Equipment (Current) | HP4284A+42841A or equivalent | Saturation and RMS current measurement |
| Test Equipment (DCR) | Chroma 16502 or equivalent | DC Resistance measurement |
| External Dimensions (LWH) | 12.5 12.5 10.0 mm | For SDRI129 series |
Product Identification:
| Part | Description |
|---|---|
| SDRI 129 | Type (Shielded SMD Power Inductors, Closed magnetic circuit) |
| 220 | Inductance Value (e.g., 22 uH) |
| M | Inductance Tolerance (e.g., 20%) |
| T | Packing (Tape & Reel) |
Inductance Tolerance Codes:
| Code | Tolerance |
|---|---|
| J | 5% |
| K | 10% |
| L | 15% |
| M | 20% |
| P | 25% |
| N | 30% |
Electrical Characteristics (Selected Models):
| Part No. | Inductance L(H) @0A | Tolerence | Test Freq | DCR () Max | Saturation Current Isat (A) Max | Temperature Rise Current Irms (A) Max |
|---|---|---|---|---|---|---|
| SDRI129-1R0N | 1.0 | 30% | 100KHz | 0.0060 | 19.90 | 11.60 |
| SDRI129-2R2N | 2.2 | 30% | 100KHz | 0.0090 | 12.20 | 10.30 |
| SDRI129-100M | 10 | 20% | 100KHz | 0.018 | 7.12 | 6.95 |
| SDRI129-220M | 22 | 20% | 1KHz | 0.038 | 5.12 | 4.95 |
| SDRI129-470M | 47 | 20% | 1KHz | 0.072 | 3.60 | 3.45 |
| SDRI129-101M | 100 | 20% | 1KHz | 0.126 | 2.31 | 2.45 |
| SDRI129-221M | 220 | 20% | 1KHz | 0.246 | 1.64 | 1.72 |
| SDRI129-471M | 470 | 20% | 1KHz | 0.471 | 1.06 | 1.25 |
| SDRI129-102M | 1000 | 20% | 1KHz | 1.220 | 0.70 | 0.78 |
| SDRI129-222M | 2200 | 20% | 1KHz | 2.580 | 0.43 | 0.52 |
Definitions:
- Saturation Current: DC current at which inductance drops 25% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
Packaging Details:
| Part No. | Tape Dimension (W x P x H) mm | Reel Dimensions (A x B x C x D) mm | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|
| SDRI129 | 24 x 16 x 11.5 | 24.4 | 100 | 400 | 3200 |
Cover Tape Peel Off Condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing (Summary):
| Item | Requirements | Test Methods & Remarks |
|---|---|---|
| Terminal Strength (SMT/DIP) | Meets specified force and duration requirements without loose terminals. | Based on GB/T 2423.60-2008, JIS C 5321:1997 |
| Resistance to Flexure | No visible mechanical damage. | Based on JIS C 5321:1997 |
| Dropping Test | No case deformation, no short/open. | Based on GB/T 2423.7-2018 |
| Solderability | 75% wetting coverage, 95% solder coverage on terminals. | Based on GB/T 2423.28-2005 |
| Vibration Test | No visible mechanical damage; Inductance change: 10%; Q factor change: 20%. | Based on GB/T 2423.10-2019 |
| Thermal Shock | No visible mechanical damage; Inductance change: 10% (Mn-Zn: 30%); Q factor change: 20%. | Based on GB/T 2423.22-2012 (Method Na) |
| Low Temperature Storage | No visible mechanical damage; Inductance change: 10% (Mn-Zn: 30%); Q factor change: 20%. | Based on GB/T 2423.1-2008 (Method Ab) |
| High Temperature Storage | No visible mechanical damage; Inductance change: 10% (Mn-Zn: 30%); Q factor change: 20%. | Based on GB/T 2423.2-2008 (Method Bb) |
| Damp Heat (Steady States) | No visible mechanical damage; Inductance change: 10% (Mn-Zn: 30%); Q factor change: 20%. | Based on GB/T 2423.3-2016 |
| Heat Endurance of Reflow Soldering | No significant defects; L/L 10% (Mn-Zn: 30%); Q/Q 30%; DCR/DCR 10%. | Based on GJB 360B-2009 |
| Resistance to Solvent Test | No case deformation, appearance change, or marking obliteration. | Based on IEC 68-2-45:1993 |
| Overload Test | No smoke, smell, or fire during test; characteristics normal after test. | Based on JIS C5311-6.13 |
| Voltage Resistance Test | No breakdown during test; characteristics normal after test. | Based on MIL-STD-202G Method 301 |
Recommended Reflow Soldering Curve:
Refer to the provided graph for recommended reflow conditions. Users should adjust and confirm conditions based on their specific equipment and environment.
Reminders for Using These Products:
- Storage: Within 12 months, under 5~40C and 35~65% RH. Terminal solderability may deteriorate beyond this period.
- Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals to prevent reduced solderability. Handle with care to prevent damage from dropping.
- Soldering: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C. Post-mounting soldering corrections must be within specifications to avoid performance degradation or reduced lifespan.
- Thermal Design: Account for self-heating when power is applied.
- Layout: For non-magnetic shielded types, careful coil placement on the PCB is necessary to prevent malfunctions due to magnetic interference.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is required.
- Magnetic Fields: Keep away from magnets or magnetic objects.
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