Unshielded DIP Power Inductors - SPK Series

Product Overview

Product Attributes

• Brand: LT-
• Manufacturer: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Product Series: SPK Series
• Type: Unshielded DIP Power Inductor, Spike suppression coil
• Certifications: RoHS, Halogen Free, REACH Compliance
• Packaging Options: Tape packaging for auto-insertion, Bulk Package (B), Tape (TF)
• Environmental Protection: Encapsulated by UL heat shrink tube

Technical Specifications

General Features:

• Low cost
• High power, High saturation, Low resistance
• Unshielded power inductor
• Various package sizes and wide inductance range

Applications:

• TVs and Audio equipment
• Telecommunication devices
• Noise filters
• Chargers, fast charge
• DC/DC converters

Environmental Data:

• Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment:

• Inductance: HP4284A, HP4285A or equivalent LCR meter
• Saturation & RMS Current: HP4284+42841A or equivalent
• Self-Resonant Frequency (SRF): HM 9461 or equivalent
• Quality Factor (Q): HP4285A or equivalent
• DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification:

Inductance Tolerance Options: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%

Shape and Dimensions (mm):

Electrical Characteristics (Examples):

Current Definitions:

• Saturation Current (Isat): DC current at which inductance drops 10% from its value without current.
• Temperature Rise Current (Irms): The actual value of DC current when the temperature rise is T 40 (Ta=25).
• Rated DC Current: The less value of Isat or Irms.

Note: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

Packaging:

Reminders for Using These Products:

• Storage: Within 12 months, under conditions of 5~40C and 35~65% RH.
• Environment: Avoid gas corrosive environments (salt, acid, alkali, etc.).
• Handling: Avoid touching electrodes directly with bare hands. Handle carefully to prevent damage.
• Bending: Do not bend terminals with excessive stress.
• Cleaning: Do not rinse coils; contact manufacturer if cleaning is necessary.
• Magnetism: Do not expose to magnets or magnetic fields.
• Soldering: Preheat components before soldering. Ensure temperature difference between solder and chip does not exceed 150C. Soldering corrections after mounting should be within specified conditions.
• Self-heating: Account for self-heating when designing for thermal management.
• Layout: For non-magnetic shield types, careful PCB layout is required to prevent malfunction due to magnetic interference.