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Low Resistance Unshielded Power Inductor LanTu Micro SCD4532-4R7MT for VTRs LCD Televisions and More

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Product Description

Unshielded SMD Power Inductors - SCD4532 Series

Product Overview

The SCD4532 Series Unshielded SMD Power Inductors are low-cost, unshielded power inductors designed for surface mounting. They feature a small size with high rated current and low DC resistance, making them suitable for a variety of electronic devices. These inductors comply with RoHS, Halogen Free, and REACH standards. Applications include power supplies for VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SCD4532
  • Type: Unshielded Power Inductor
  • Design: Silver plated type, Low cost design
  • Mounting: Suitable for surface mounting equipment
  • Certifications: RoHS, Halogen Free and REACH Compliance
  • Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Technical Specifications

Product Identification Format: SCD 4532 - [Inductance] [Tolerance] [Packing]
Example: SCD4532-100M T (10 uH, 20% tolerance, Tape & Reel)

General Dimensions

Part No External Dimensions (LWH) (mm) A (mm) B (mm) C (mm) D (mm) H (mm) I (mm) J (mm)
SCD4532 4.53.2 4.50.3 4.00.3 3.20.3 1.2 4.5 1.75 1.5

Electrical Characteristics

Part No Inductance (H) @ 0A Tolerance Test Freq (KHz) SRF Min (MHz) DCR Typ () DCR Max () Saturation Current Isat Max (A) Temperature Rise Current Irms Max (A)
SCD4532-1R0M 1.0 M (20%) 100 120 (at 7.96MHz) 0.0487 - 3.85 2.56
SCD4532-1R4M 1.4 M (20%) 100 95 (at 7.96MHz) 0.0562 - 3.40 2.52
SCD4532-1R8M 1.8 M (20%) 100 75 (at 7.96MHz) 0.0637 - 2.90 1.95
SCD4532-2R2M 2.2 M (20%) 100 62 (at 7.96MHz) 0.0712 - 2.80 1.75
SCD4532-2R7M 2.7 M (20%) 100 53 (at 7.96MHz) 0.0787 - 2.75 1.58
SCD4532-3R3M 3.3 M (20%) 100 47 (at 7.96MHz) 0.0862 - 2.48 1.44
SCD4532-3R9M 3.9 M (20%) 100 41 (at 7.96MHz) 0.0937 - 2.30 1.33
SCD4532-4R7M 4.7 M (20%) 100 38 (at 7.96MHz) 0.1087 - 2.00 1.15
SCD4532-5R6M 5.6 M (20%) 100 33 (at 7.96MHz) 0.1257 - 1.95 0.99
SCD4532-6R8M 6.8 M (20%) 100 31 (at 7.96MHz) 0.1312 - 1.60 0.95
SCD4532-8R2M 8.2 M (20%) 1SCD4532-101M 100 M (20%) 100 7.2 (at 1KHz) 1.5200 - 0.45 0.26
SCD4532-121M 120 M (20%) 100 6.5 (at 1KHz) 1.7500 - 0.44 0.24
SCD4532-151M 150 M (20%) 100 5.8 (at 1KHz) 2.0000 - 0.42 0.22
SCD4532-181M 180 M (20%) 100 5.0 (at 1KHz) 3.2000 - 0.38 0.19
SCD4532-221M 220 M (20%) 100 4.3 (at 1KHz) 3.4000 - 0.36 0.18
SCD4532-331M 330 M (20%) 100 3.5 (at 1KHz) 5.3000 - 0.28 0.15
SCD4532-391M 390 M (20%) 100 3.0 (at 1KHz) 5.9000 - 0.24 0.13
SCD4532-471M 470 M (20%) 100 2.6 (at 1KHz) 6.8000 - 0.21 0.12
SCD4532-561M 560 M (20%) 100 2.0 (at 1KHz) 8.4000 - 0.20 0.10

Note: Saturation Current: DC current at which inductance drops 10% from its value without current. Temperature Rise Current: the actual value of DC current when the temperature rise is T 40 (Ta=25). Rated DC Current: The lesser value of Isat or Irms. Part temperature should be verified in the end application.

Packaging Specifications

Part No. Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
SCD4532 12 8 5.5 12.4 100 13 330 2000 8000 32,000

Tape & Reel Specifications: Cover tape peel force shall be 10 to 120g. Noodle strip peeling angle 165 to 180.

Recommended Reflow Soldering Curve

The recommended reflow conditions are set according to soldering equipment. Users should adjust and confirm according to their specific environment/equipment.

Reminders for Using These Products

  • Storage period is within 12 months under conditions (temperature: 5~40C, humidity: 35 to 65% RH or less).
  • Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
  • Avoid direct contact with terminals due to oil secretions.
  • Handle products carefully to prevent damage.
  • Do not bend terminals with excessive stress.
  • Do not rinse coils; contact the manufacturer if cleaning is necessary.
  • Do not expose products to magnets or magnetic fields.
  • Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering corrections after mounting should be within specified conditions to avoid overheating.
  • Allow sufficient margin for thermal design due to self-heating when power is on.
  • For non-magnetic shield types, careful PCB layout is needed to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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