Low buzz noise magnetic resin shielded LanTu Micro SNR5030-5R6NT power inductor for telecommunications
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The LANTU SNR5030 Series are automatic assembly compatible, magnetic resin shielded SMD power inductors designed for high-current, low-DCR applications. These inductors feature a closed magnetic circuit design that minimizes leakage flux and EMI, while the magnetic resin shielding significantly reduces buzz noise to ultra-low levels. Their compact size saves PCB real estate and power. They are widely used in LED backlights, flat-screen TVs, notebooks, desktop computers, servers, graphics cards, portable gaming devices, automotive products, telecommunications equipment, and DC-DC converters.
Product Attributes
- Brand: LANTU (SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.)
- Series: SNR5030
- Construction: Magnetic Resin Shielded, Automatic Assembly
- Certifications: RoHS, Halogen Free, REACH Compliance
- Core Material: Ferrite Core (Metallized electrodes on core)
- Magnetic Circuit: Closed
Technical Specifications
| Part No. | Inductance (H) | Tolerance | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|
| SNR5030-1R0M | 1.0 | 20% | 0.016 | 0.020 | 7.00 | 4.00 |
| SNR5030-1R5N | 1.5 | 30% | 0.019 | 0.024 | 5.50 | 3.60 |
| SNR5030-2R2N | 2.2 | 30% | 0.025 | 0.031 | 4.50 | 3.20 |
| SNR5030-3R3N | 3.3 | 30% | 0.032 | 0.039 | 4.00 | 2.80 |
| SNR5030-4R7M | 4.7 | 20% | 0.052 | 0.065 | 3.00 | 2.20 |
| SNR5030-5R6N | 5.6 | 30% | 0.056 | 0.070 | 3.00 | 2.10 |
| SNR5030-6R8M | 6.8 | 20% | 0.060 | 0.075 | 2.80 | 2.00 |
| SNR5030-100M | 10 | 20% | 0.080 | 0.100 | 2.10 | 1.80 |
| SNR5030-150M | 15 | 20% | 0.125 | 0.156 | 1.70 | 1.40 |
| SNR5030-220M | 22 | 20% | 0.210 | 0.260 | 1.60 | 1.10 |
| SNR5030-330M | 33 | 20% | 0.330 | 0.410 | 1.20 | 0.85 |
| SNR5030-470M | 47 | 20% | 0.375 | 0.468 | 0.90 | 0.80 |
| SNR5030-101M | 100 | 20% | 0.800 | 0.988 | 0.75 | 0.56 |
| SNR5030-151M | 150 | 20% | 1.180 | 1.470 | 0.55 | 0.46 |
| SNR5030-221M | 220 | 20% | 1.700 | 2.080 | 0.45 | 0.39 |
| SNR5030-331M | 330 | 20% | 2.800 | 3.500 | 0.35 | 0.30 |
| SNR5030-471M | 470 | 20% | 3.800 | 4.700 | 0.30 | 0.26 |
| SNR5030-102M | 1000 | 20% | 8.700 | 10.800 | 0.20 | 0.17 |
| Inductance Tolerance Codes | Packaging Codes |
|---|---|
| J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | B: Bulk Package, T: Tape & Reel |
| Characteristic | Value |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Dimensions (LWH) | 5.05.03.0 mm |
| Test Frequency for Inductance | 100KHz, 0.25V |
| Saturation Current Definition | DC current at which inductance drops 30% from its value without current. |
| Temperature Rise Current Definition | The actual value of DC current when the temperature rise is T 40 (Ta=25). |
| Rated DC Current | The lesser value of Isat or Irms. |
Packaging Specifications
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SNR5030 | 12 | 8 | 5.5 | 12.4 | 100 | 13 | 330 | 2000 | 8000 | 32,000 |
Reliability Testing
| Test Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet specified pull force requirements without loose terminal. | Pulling test based on GB/T 2423.60-2008. Force varies with terminal cross-sectional area. Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet specified pull force requirements without loose terminal. | Pulling test based on GB/T 2423.60-2008. Force varies with terminal diameter. Keep time: 10sec. |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | GB/T 2423.7-2018. Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | GB/T 2423.28-2005. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019. Simple harmonic motion, frequency 10-55 Hz, amplitude 1.5mm. Applied for 2 hours in 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na. 100 cycles of temperature transition between high (85~125) and low (-55~40). Transforming interval: Max. 20 sec. |
| Low Temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab. Temperature: -55~-402. Duration: 962 hours. |
| High Temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb. Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | GB/T 2423.3-2016. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: 30%). Q/Q30% (SMD series only). DCR/DCR10%. | GJB 360B-2009. Performed twice according to reflow curve. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993. Dip parts into IPA solvent for 50.5Min, dry for 5Min, then brush 10 times. |
| Overload test | During test: no smoke, no peculiar smell, no fire. Characteristics normal after test. | JIS C5311-6.13. Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test: no breakdown. Characteristics normal after test. | MIL-STD-202G Method 301. For parts with two coils: DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve
The recommended reflow conditions are provided as a guideline. Users should adjust and confirm conditions based on their specific reflow soldering equipment, process, and environment.
Usage Precautions
- Storage: Within 12 months, under temperature 5~40C and humidity 35~65% RH. Beyond this period, terminal solderability may deteriorate.
- Environment: Avoid use or storage in corrosive environments (salt, acid, alkali).
- Handling: Avoid direct contact with terminals with bare hands due to oil secretions. Handle products carefully to prevent damage from dropping.
- Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact LANTU if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Always preheat components before soldering. Ensure the temperature difference between solder and chip temperature does not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when the device is powered on. Ensure sufficient thermal design margin.
- Non-Shielded Types: For non-magnetic shielded types, careful coil layout on the PCB is necessary to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina