SMD power inductor LanTu Micro SMS1070-4R7M designed for high frequency operation up to 3 megahertz
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MOQ:
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Delivery Time:
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Product Description
Product Overview
The SMS1070 Series from Shenzhen Lantu Micro Electric Technology Co., Ltd. are ultra-high current SMD power inductors featuring a thin design with low DC resistance and high current capability. These magnetically shielded inductors offer strong anti-electromagnetic interference, making them suitable for high-density installations. Their integral construction ensures high reliability and excellent vibration resistance, while the composite structure minimizes buzz noise. Designed for high efficiency, these inductors utilize a low-loss alloy powder die-casting for low impedance and small parasitic capacitance, reducing winding resistance and core eddy-current loss. They operate at frequencies up to 3MHz and have an absolute maximum voltage of 30VDC. The series is RoHS, Halogen Free, and REACH compliant.
Key applications include PDA, notebook, desktop, and server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS1070
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by company location)
Technical Specifications
| Part Number | Inductance (H) | Tolerance | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical | Dimensions (LWH mm) | Operating Temperature (C) | Absolute Maximum Voltage (VDC) |
|---|---|---|---|---|---|---|---|---|
| SMS1070-4R7M | 4.7 | 20% | 12.0 | 15.00 | 9.00 | 11.210.27.0 | -55 to +125 (Including coils self-temperature rise) | 30 |
Product Dimensions
| Part No. | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) | G (mm) | H (mm) |
|---|---|---|---|---|---|---|---|---|
| SMS1070 | 11.200.5 | 10.200.3 | 7.00Max | 3.00 Typ | 2.00 Typ | 5.40 | 13.60 | 4.10 |
Packaging Specifications
| Part No. | Packing Type | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel Quantity (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| SMS1070 | Tape & Reel (T) | 24.0 | 16.0 | 11.5 | 24.4 | 330 | 400 | 800 | 3200 | 100 | 13 |
Test Equipment
- Inductance (L): WK3260B LCR meter or equivalent
- Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Reliability Testing
| Test Item | Requirements | Test Method & Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal | Pulling test (force varies by terminal area), Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal | Pulling test (force varies by terminal diameter). Keep time: 10 sec. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Terminals must have 95% minimum solder coverage. Wetting shall exceed 75% coverage. | Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Simple harmonic motion, amplitude 1.5mm, frequency 10-55 Hz (traversed in 1 min), applied for 2 hours in each of 3 mutually perpendicular directions (total 6 hours). |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of (85~125 for T time) to (-55~40 for T time). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602, Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | Refer to reflow curve, performed twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip into IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | During test no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test no breakdown. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH.
- Environment: Avoid gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions. Handle carefully to prevent damage from dropping.
- Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Allow sufficient margin for self-heating when power is ON.
- Non-Magnetic Shield Type: Careful coil layout is required on the circuit board to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
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16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina