Molding SMD Power Inductors LanTu Micro SMS0850-220MT With Integral Construction And High Reliability
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Product Description
Molding SMD Power Inductors - SMS0850 Series
Product Overview
The SMS0850 Series by SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers ultra-high current SMD power inductors with a thin design, low DC resistance, and excellent anti-electromagnetic interference capabilities due to magnetic shielding. These inductors feature an integral construction for high reliability and vibration resistance, composite construction for ultra-low buzz noise, and are manufactured using low-loss alloy powder for low impedance and small parasitic capacitance. They achieve high efficiency with low winding DC resistance and core eddy-current loss, operating at frequencies up to 1-2MHz with an absolute maximum voltage of 30VDC. The series is RoHS, Halogen Free, and REACH compliant.
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS0850
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by company name)
Technical Specifications
Environmental Data
| Parameter | Value |
|---|---|
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) |
Electrical Characteristics (SMS0850 Series)
| Part No. | Inductance (H) | Inductance Tolerance | Frequency | Voltage | DCR (m) Typical | Saturation Current (A) Typical | Heat Rating Current (A) Typical |
|---|---|---|---|---|---|---|---|
| SMS0850-R56M | 0.56 | 20% | 100KHz, 1.0V | 30VDC | 3.0 | 4.5 | 30.00 |
| SMS0850-R68M | 0.68 | 20% | 100KHz, 1.0V | 30VDC | 3.6 | 6.0 | 25.00 |
| SMS0850-1R0M | 1.0 | 20% | 100KHz, 1.0V | 30VDC | 4.1 | 5.5 | 20.00 |
| SMS0850-1R5M | 1.5 | 20% | 100KHz, 1.0V | 30VDC | 5.0 | 7.0 | 19.00 |
| SMS0850-2R2M | 2.2 | 20% | 100KHz, 1.0V | 30VDC | 8.2 | 12.0 | 16.00 |
| SMS0850-3R3M | 3.3 | 20% | 100KHz, 1.0V | 30VDC | 11.0 | 15.0 | 13.00 |
| SMS0850-4R7M | 4.7 | 20% | 100KHz, 1.0V | 30VDC | 15.0 | 20.0 | 12.00 |
| SMS0850-5R6M | 5.6 | 20% | 100KHz, 1.0V | 30VDC | 25.0 | 28.5 | 11.00 |
| SMS0850-100M | 10 | 20% | 100KHz, 1.0V | 30VDC | 35.0 | 45.0 | 8.00 |
| SMS0850-150M | 15 | 20% | 100KHz, 1.0V | 30VDC | 55.0 | 65.0 | 7.00 |
| SMS0850-220M | 22 | 20% | 100KHz, 1.0V | 30VDC | 78.0 | 88.0 | 5.50 |
| SMS0850-330M | 33 | 20% | 100KHz, 1.0V | 30VDC | 120.0 | 140.0 | 6.00 |
| SMS0850-470M | 47 | 20% | 100KHz, 1.0V | 30VDC | 177.0 | 190.0 | 4.00 |
| SMS0850-560M | 56 | 20% | 100KHz, 1.0V | 30VDC | 188.0 | 226.0 | 3.00 |
| SMS0850-680M | 68 | 20% | 100KHz, 1.0V | 30VDC | 280.0 | 310.0 | 2.80 |
Inductance Tolerance Codes
| Code | Tolerance |
|---|---|
| J | 5% |
| K | 10% |
| L | 15% |
| M | 20% |
| P | 25% |
| N | 30% |
Packing Options
| Code | Description |
|---|---|
| B | Bulk Package |
| T | Tape & Reel |
Dimensions (mm)
| Part No. | L | W | H | A | B | C | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|---|---|---|
| SMS0850 | 8.50.50 | 8.00.30 | 5.00 Max | 3.0 0.30 | 1.8 0.30 | 4.5 | 9.5 | 3.5 | (N/A) | (N/A) | (N/A) |
Test Equipment Used
- Inductance (L): WK3260B LCR meter or equivalent
- Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Product Identification Example
SMS 0850 100 M T
- SMS: Type
- 0850: External Dimensions (LWH) (mm)
- 100: Inductance (e.g., 10 H)
- M: Inductance Tolerance (20%)
- T: Packing Type (Tape & Reel)
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal | Pulling test (force varies by terminal area), Solder paste thickness: 0.12mm, Keep time: 101s, Speed: 1.0mm/s |
| Terminal Strength (DIP) | Meet requirements without any loose terminal | Pulling test (force varies by terminal diameter), Keep time: 10sec |
| Resistance to Flexure | No visible mechanical damage | Flexure: 2mm, Pressurizing Speed: 0.5mm/sec, Keep time: 30 sec |
| Dropping | No case deformation or change in appearance, No short and no open | Drop packaged products from 1m high (1 angle, 3 ridges, 6 surfaces, twice each direction) |
| Solderability | Wetting shall exceed 75% coverage, Terminals must have 95% minimum solder coverage | Solder temperature: 2402, Duration: 3 sec, Solder: Sn/3.0Ag/0.5Cu, Flux: 25% Resin and 75% ethanol |
| Vibration | No visible mechanical damage, Inductance change: Within 10%, Q factor change: Within 20% | Simple harmonic motion (1.5mm amplitude, 10-55 Hz), 2 hours in each of 3 mutually perpendicular directions |
| Thermal Shock | No visible mechanical damage, Inductance change: Within 10% (Mn-Zn: 30%), Q factor change: Within 20% | 100 cycles of temperature change (-55~40 to 85~125), Transforming interval: Max. 20 sec |
| Low temperature Storage | No visible mechanical damage, Inductance change: Within 10% (Mn-Zn: 30%), Q factor change: Within 20% | Temperature: -55~-402, Duration: 962 hours |
| High temperature Storage | No visible mechanical damage, Inductance change: Within 10% (Mn-Zn: 30%), Q factor change: Within 20% | Temperature: 125~852, Duration: 962 hours |
| Damp Heat (Steady States) | No visible mechanical damage, Inductance change: Within 10% (Mn-Zn: 30%), Q factor change: Within 20% | Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours |
| Heat endurance of Reflow soldering | No significant defects in appearance, L/L10% (Mn-Zn: 30%), Q/Q30% (SMD series only), DCR/DCR10% | Reflow twice, Peak temperature: 260+0/-5 |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking | Dip in IPA solvent for 50.5Min, dry for 5Min, brush 10 times |
| Overload test | During test no smoke, no peculiar smell, no fire; Characteristics normal after test | Apply twice rated current for 5 minutes |
| Voltage resistance test | During test no breakdown; Characteristics normal after test | DC1000V, Current: 1mA, Time: 1Min (for parts with two coils) |
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Users should adjust and confirm based on their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, at 5~40C and 35~65% RH. Solderability may deteriorate after storage period.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability. Handle carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetism: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform after mounting within specified conditions. Overheating may cause short circuits, performance reduction, or lifespan shortening.
- Thermal Design: Account for self-heating (temperature increase) when power is ON.
- Layout (Non-magnetic Shield Type): Careful coil layout is required on the circuit board to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina