Molding SMD Power Inductors featuring LanTu Micro SMS1360-680MT for high current low loss applications
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Product Description
Molding SMD Power Inductors - SMS1360 Series
Product Overview
The SMS1360 Series by SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are ultra-high current, thin-profile SMD power inductors designed for high-density installations. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors offer high reliability with excellent vibration resistance due to their integral construction. They exhibit ultra-low buzz noise and low loss thanks to a composite structure and die-casting with low-loss alloy powder, resulting in low impedance and small parasitic capacitance. These inductors achieve high efficiency by reducing winding DC resistance and core eddy-current loss, operating at frequencies up to 3MHz with an absolute maximum voltage of 30VDC. They are RoHS, Halogen Free, and REACH compliant.
Applications
Suitable for PDA, notebook, desktop, and server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: LANTU MICRO ELECTRIC
- Origin: SHENZHEN, CHINA
- Series: SMS1360
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
| Item | Description | Value | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| General Features | ||||||||||
| Design | Thin-profile, Magnetic shielding | N/A | ||||||||
| Vibration Resistance | High, Integral construction | N/A | ||||||||
| Noise | Ultra Low buzz noise (composite construction) | N/A | ||||||||
| Impedance & Capacitance | Low impedance, Small parasitic capacitance (low loss alloy powder die-casting) | N/A | ||||||||
| Efficiency | High efficiency | N/A | ||||||||
| Operating Frequency | Up to 3MHz | N/A | ||||||||
| Absolute Maximum Voltage | 30VDC | N/A | ||||||||
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) | N/A | ||||||||
| Test Equipment | ||||||||||
| Inductance (L) | WK3260B LCR meter or equivalent | N/A | ||||||||
| Saturation Current (Isat) & Heat Rating Current (Irms) | WK3260B+WK3265B or equivalent | N/A | ||||||||
| DC Resistance (DCR) | Chroma 16502 or equivalent | N/A | ||||||||
| Product Identification Example | ||||||||||
| Model Structure | SMS 1360 101 M T | N/A | ||||||||
| Inductance Value | 101 = 100 uH | N/A | ||||||||
| Tolerance | M = 20% | J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | ||||||||
| Packaging | T = Tape & Reel | B = Bulk Package | ||||||||
| Dimensions (LWH) | 1360 = 13.812.67.0 mm | N/A | ||||||||
| External Dimensions (mm) | ||||||||||
| Part No | A | B | C | D | E | F | G | H | ||
| SMS1360 | 13.800.50 | 12.600.20 | 7.00Max | 3.70 Typ | 2.50 Typ | 8.00 | 14.60 | 5.00 | ||
| Electrical Characteristics (at 25) | ||||||||||
| Part No. | Inductance (H) | Tolerance | DCR (m) Typical | Saturation Current (A) Typical | Heat Rating Current (A) Typical | |||||
| SMS1360-R68M | 0.68 | 20% | 1.4 | 1.6 | 55.00 | |||||
| SMS1360-1R0M | 1.0 | 20% | 1.7 | 2.0 | 35.00 | |||||
| SMS1360-2R2M | 2.2 | 20% | 3.5 | 4.2 | 25.00 | |||||
| SMS1360-3R3M | 3.3 | 20% | 5.5 | 6.8 | 22.00 | |||||
| SMS1360-4R7M | 4.7 | 20% | 8.0 | 9.0 | 18.00 | |||||
| SMS1360-6R8M | 6.8 | 20% | 10.0 | 14.0 | 15.00 | |||||
| SMS1360-8R2M | 8.2 | 20% | 13.5 | 16.0 | 14.00 | |||||
| SMS1360-100M | 10 | 20% | 18.0 | 21.0 | 12.50 | |||||
| SMS1360-220M | 22 | 20% | 34.0 | 38.0 | 8.00 | |||||
| SMS1360-270M | 27 | 20% | 45.0 | 56.0 | 7.00 | |||||
| SMS1360-330M | 33 | 20% | 56.0 | 70.0 | 6.50 | |||||
| SMS1360-470M | 47 | 20% | 70.0 | 90.0 | 6.00 | |||||
| SMS1360-680M | 68 | 20% | 105.0 | 125.0 | 5.00 | |||||
| SMS1360-820M | 82 | 20% | 115.0 | 140.0 | 4.00 | |||||
| SMS1360-101M | 100 | 20% | 130.0 | 200.0 | 3.00 | |||||
| Definitions | ||||||||||
| Saturation Current | DC current at which inductance drops 30% from its value without current. | |||||||||
| Heat Rating Current | The actual value of DC current when the temperature rise is T 40 (Ta=25). | |||||||||
| Rated DC Current | The lesser value of Isat or Irms. | |||||||||
| Note | Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. | |||||||||
| Packaging Quantity | ||||||||||
| Part No. | Tape Dimension W (mm) | P (mm) | W1 (mm) | Reel Dimensions A (mm) | B (mm) | C (mm) | D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
| SMS1360 | 24.0 | 16.0 | 11.5 | 24.4 | 100 | 13 | 330 | 500 | 1000 | 4000 |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength | Meet requirements without any loose terminal | Pulling test (SMT/DIP), Solder paste thickness, Pull Force application |
| Resistance to Flexure | No visible mechanical damage | Flexure: 2mm, Pressurizing Speed: 0.5mm/sec, Keep time: 30 sec |
| Dropping | No case deformation or change in appearance, No short and no open | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage, Terminals must have 95% minimum solder coverage | Solder temperature: 2402, Duration: 3 sec, Solder: Sn/3.0Ag/0.5Cu, Flux: 25% Resin and 75% ethanol |
| Vibration | Inductance change: Within 10%, Q factor change: Within 20% | Amplitude 1.5mm, Frequency 10-55 Hz (varied), Duration 2 hours in each 3 mutually perpendicular directions |
| Thermal Shock | Inductance change: Within 10% (Mn-Zn: Within 30%), Q factor change: Within 20% | 100 cycles of temperature shock (-55~40 to 85~125), Transforming interval: Max. 20 sec |
| Low temperature Storage | Inductance change: Within 10% (Mn-Zn: Within 30%), Q factor change: Within 20% | Temperature: -55~-402, Duration: 962 hours |
| High temperature Storage | Inductance change: Within 10% (Mn-Zn: Within 30%), Q factor change: Within 20% | Temperature: 125~852, Duration: 962 hours |
| Damp Heat (Steady States) | Inductance change: Within 10% (Mn-Zn: Within 30%), Q factor change: Within 20% | Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours |
| Heat endurance of Reflow soldering | L/L10% (Mn-Zn: L/L30%), Q/Q30%, DCR/DCR10% | Peak temperature: 260+0/-5, twice reflow |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking | Dip into IPA solvent for 50.5Min, drying at room temp for 5Min, brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire; Characteristic is normal after test | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown; Characteristic is normal after test | DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm according to their specific environment/equipment.
Reminders for Using These Products
- Storage: Within 12 months, conditions: 5~40C, 35-65% RH. Soldering of terminal electrodes may deteriorate if storage period elapses.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals using bare hands due to oil secretions inhibiting soldering. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Ensure preheating before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections must be within specified conditions. Overheating may cause short circuits, performance degradation, or lifespan reduction.
- Thermal Design: Account for self-heating (temperature increase) when power is ON. Ensure sufficient thermal design margin.
- Non-Magnetic Shield Type: Careful layout is required on the circuit board to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina