Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
Verified Supplier
17 Years
Since 2009
Menu

Epoxy coated axial fixed inductors LanTu Micro AL0307-471K ideal for in various electronic circuits

Price Negotiable
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Product Description

Axial Fixed Inductors - AL0307 Series

Product Overview

The AL0307 Series Axial Fixed Inductors by SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for reliable performance in a wide range of electronic applications. These compact, lightweight RF chokes feature epoxy resin coating for enhanced humidity resistance and longevity. They offer a wide inductance range, high Q values, and self-resonant frequencies, making them suitable for automatic insertion processes. Compliant with RoHS, Halogen Free, and REACH standards, these inductors are ideal for use in televisions, personal computers, radios, telephones, chargers, and other electronic devices.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: AL0307 Series
  • Type: Axial Fixed Inductors / Leaded RF Chokes
  • Coating: Epoxy resin
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Packaging Options: Bulk Package (B), Tape Packaging (TF)

Technical Specifications

General Specifications

Parameter Value
Operating Temperature -25 to +85 (Including coil self-temperature rise)
External Dimensions (LH) 3.27.62 mm (Model 0307)
Lead Diameter 0.500.1 mm

Electrical Characteristics (at 25)

Part No Inductance (H) Tolerance Test Freq. (MHz) Q Min L/Q Max () SRF Min (MHz) DCR Max () Rated Current Max (mA)
AL0307-1R0M 1.0 20% 25.2 40 150 0.15 740 -
AL0307-1R2M 1.2 20% 7.96 40 150 0.18 740 -
AL0307-1R5M 1.5 20% 7.96 40 150 0.20 700 -
AL0307-1R8M 1.8 20% 7.96 50 125 0.23 655 -
AL0307-2R2M 2.2 20% 7.96 50 110 0.27 630 -
AL0307-2R7M 2.7 20% 7.96 50 95 0.28 595 -
AL0307-3R3M 3.3 20% 7.96 50 70 0.30 575 -
AL0307-3R9M 3.9 20% 7.96 50 65 0.32 555 -
AL0307-4R7M 4.7 20% 7.96 50 36 0.35 530 -
AL0307-5R6M 5.6 20% 7.96 50 32 0.40 500 -
AL0307-6R8M 6.8 20% 7.96 50 28 0.48 470 -
AL0307-8R2M 8.2 20% 7.96 50 23 0.56 425 -
AL0307-100K 10 10% 7.96 50 18 0.75 370 -
AL0307-120K 12 10% 2.52 50 17 0.80 350 -
AL0307-150K 15 10% 2.52 50 16 0.93 335 -
AL0307-180K 18 10% 2.52 50 15 1.00 315 -
AL0307-220K 22 10% 2.52 50 13 1.20 285 -
AL0307-270K 27 10% 2.52 50 11 1.80 270 -
AL0307-330K 33 10% 2.52 50 10 2.20 255 -
AL0307-390K 39 10% 2.52 50 9.5 2.30 240 -
AL0307-470K 47 10% 2.52 50 8.5 2.60 205 -
AL0307-560K 56 10% 2.52 50 7.5 2.90 195 -
AL0307-680K 68 10% 2.52 50 6.5 3.30 185 -
AL0307-820K 82 10% 2.52 50 6.0 3.80 175 -
AL0307-101K 100 10% 2.52 50 5.5 4.20 165 -
AL0307-121K 120 10% 0.796 50 5.4 4.70 160 -
AL0307-151K 150 10% 0.796 50 4.7 5.40 150 -
AL0307-181K 180 10% 0.796 50 4.3 6.00 140 -
AL0307-221K 220 10% 0.796 60 4.0 7.00 130 -
AL0307-271K 270 10% 0.796 60 3.7 7.70 120 -
AL0307-331K 330 10% 0.796 60 3.4 11.1 100 -
AL0307-391K 390 10% 0.796 60 2.8 12.6 95 -
AL0307-471K 470 10% 0.796 60 2.5 14.0 90 -
AL0307-561K 560 10% 0.796 60 2.3 15.5 85 -
AL0307-681K 680 10% 0.796 60 2.0 25.3 75 -
AL0307-821K 820 10% 0.796 60 1.5 27.5 65 -
AL0307-102K 1000 10% 0.796 50 1.2 31.4 60 -

Current Ratings

Parameter Definition Condition
Saturation Current (Isat) Inductance drops by 10% from initial value Ta=25
Temperature Rise Current (Irms) Temperature rise of T 40 Ta=25
Rated DC Current The lesser of Isat or Irms -

Packaging Specifications

Series Type Packaging Quantity (pcs) Carton Size (mm) (LWH) Parts/Box Parts/Reel Parts/Carton
AL0307 T5A (Tape and Reel) 3000 440275392 - - 72,000

Reliability Testing

Test Item Requirements Test Method
Terminal Strength (SMT/DIP) Meet specified force and duration without loose terminal GB/T 2423.60-2008
Resistance to Flexure No visible mechanical damage JIS C 5321:1997
Dropping Test No case deformation, appearance change, short, or open circuit GB/T 2423.7-2018
Solderability 75% wetting coverage, 95% solder coverage on terminals GB/T 2423.28-2005
Vibration Test No visible damage, Inductance change 10%, Q factor change 20% GB/T 2423.10-2019
Thermal Shock No visible damage, Inductance change 10% (30% for Mn-Zn), Q factor change 20% GB/T 2423.22-2012 (Method Na)
Low Temperature Storage No visible damage, Inductance change 10% (30% for Mn-Zn), Q factor change 20% GB/T 2423.1-2008 (Method Ab)
High Temperature Storage No visible damage, Inductance change 10% (30% for Mn-Zn), Q factor change 20% GB/T 2423.2-2008 (Method Bb)
Damp Heat (Steady States) No visible damage, Inductance change 10% (30% for Mn-Zn), Q factor change 20% GB/T 2423.3-2016
Heat Endurance of Reflow Soldering No significant appearance defects, L/L 10% (30% for Mn-Zn), Q/Q 30% (SMD only), DCR/DCR 10% GJB 360B-2009
Resistance to Solvent Test No case deformation, appearance change, or obliteration of marking IEC 68-2-45:1993
Overload Test No smoke, peculiar smell, or fire; characteristics normal after test JIS C5311-6.13
Voltage Resistance Test No breakdown; characteristics normal after test MIL-STD-202G Method 301

Recommended Lead-free Wave Soldering Curve (DIP-Type)

Note: The recommended wave soldering curve is a reference. Adjust and confirm according to user's environment/equipment.

Soldering Iron (Rework)

  • Hand soldering should not exceed 350 degrees and 3 times.
  • Avoid contacting the inductor body or wire during soldering.
  • Hand soldering is not recommended.

Usage Precautions

  • Storage: Within 12 months under conditions of 5~40C and 35~65% RH. Solderability may deteriorate beyond this period.
  • Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals due to hand oils affecting solderability. Handle carefully to prevent damage from dropping.
  • Terminal Bending: Do not excessively bend terminals to prevent wire fracture.
  • Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
  • Magnetism: Keep away from magnets or magnetic objects.
  • Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering Correction: Perform soldering corrections within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
  • Self-heating: Allow for sufficient thermal design due to self-heating when power is on.
  • Non-magnetic Shield Type: Careful layout is required on the PCB to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

Request A Quote

Please check your email address.
Your message must be at least 20 characters.