LanTu Micro SMS1350 3R3MT power inductor with composite structure and excellent vibration resistance
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS1350 Series are ultra-high current SMD power inductors designed for high-density installations. These magnetically shielded inductors offer low DC resistance, ultra-high current capability, and excellent vibration resistance due to their integral construction. They feature a composite structure for ultra-low buzz noise, die-casting with low-loss alloy powder for low impedance and small parasitic capacitance, and high efficiency by reducing winding DC resistance and core eddy-current loss. Operating up to 3MHz with an absolute maximum voltage of 30VDC, these RoHS, Halogen Free, and REACH compliant inductors are ideal for PDA, notebook, desktop, server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Series: SMS1350 Series
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
| Part No | Inductance (H) | Inductance Tolerance | DCR (m) Typical | Saturation Current (A) Typical | Heat Rating Current (A) Typical | Dimensions (LWH) (mm) | Operating Temperature (C) | Absolute Maximum Voltage (VDC) |
|---|---|---|---|---|---|---|---|---|
| SMS1350-R36M | 0.36 | 20% | 0.85 | 60.00 | 41.00 | 13.812.66.0 | -55 to +125 | 30 |
| SMS1350-R47M | 0.47 | 20% | 1.1 | 52.00 | 39.00 | 13.812.66.0 | -55 to +125 | 30 |
| SMS1350-R68M | 0.68 | 20% | 1.2 | 40.00 | 32.00 | 13.812.66.0 | -55 to +125 | 30 |
| SMS1350-R82M | 0.82 | 20% | 1.5 | 42.00 | 30.00 | 13.812.66.0 | -55 to +125 | 30 |
| SMS1350-1R0M | 1.0 | 20% | 1.9 | 35.00 | 26.00 | 13.812.66.0 | -55 to +125 | 30 |
| SMS1350-1R5M | 1.5 | 20% | 2.7 | 30.00 | 23.00 | 13.812.66.0 | -55 to +125 | 30 |
| SMS1350-2R2M | 2.2 | 20% | 4.0 | 26.00 | 20.00 | 13.812.66.0 | -55 to +125 | 30 |
| SMS1350-3R3M | 3.3 | 20% | 7.0 | 22.00 | 15.00 | 13.812.66.0 | -55 to +125 | 30 |
| SMS1350-4R7M | 4.7 | 20% | 9.0 | 17.00 | 12.00 | 13.812.66.0 | -55 to +125 | 30 |
| SMS1350-6R8M | 6.8 | 20% | 15.0 | 14.00 | 11.00 | 13.812.66.0 | -55 to +125 | 30 |
| SMS1350-100M | 10 | 20% | 20.0 | 12.00 | 8.00 | 13.812.66.0 | -55 to +125 | 30 |
| SMS1350-150M | 15 | 20% | 28.0 | 10.00 | 6.00 | 13.812.66.0 | -55 to +125 | 30 |
| SMS1350-220M | 22 | 20% | 45.0 | 7.00 | 4.50 | 13.812.66.0 | -55 to +125 | 30 |
| SMS1350-330M | 33 | 20% | 66.0 | 6.00 | 4.00 | 13.812.66.0 | -55 to +125 | 30 |
| SMS1350-470M | 47 | 20% | 100.0 | 5.00 | 3.00 | 13.812.66.0 | -55 to +125 | 30 |
| SMS1350-680M | 68 | 20% | 115.0 | 4.50 | 2.50 | 13.812.66.0 | -55 to +125 | 30 |
| Inductance Tolerance Codes: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | ||||||||
| Packing Codes: B: Bulk Package, T: Tape & Reel | ||||||||
| Shape and Dimensions (mm): A: 13.800.50, B: 12.600.20, C: 6.00Max, D: 3.70 Typ, E: 2.50 Typ, F: 8.00, G: 14.60, H: 5.00 | ||||||||
| Test Equipment: L: WK3260B LCR meter or equivalent, Isat & Irms: WK3260B+WK3265B or equivalent, DCR: Chroma 16502 or equivalent | ||||||||
| Saturation Current Definition: DC current at which inductance drops 30% from its value without current. | ||||||||
| Temperature Rise Current Definition: The actual value of DC current when the temperature rise is T 40 (Ta=25). | ||||||||
| Rated DC Current Definition: The lesser value of Isat or Irms. | ||||||||
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test: Based on terminal sectional area (A). Solder paste thickness: 0.12mm. Force applied gradually and maintained for 101s. Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force based on terminal diameter (d). Duration: 10sec. |
| Resistance to Flexure | No visible mechanical damage. | Solder inductor to test jig. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. No visible mechanical damage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Solder inductor to testing jig. Simple harmonic motion, amplitude 1.5mm, frequency 10 to 55 Hz (and return). Duration: 2 hours in each of 3 mutually perpendicular directions (total 6 hours). |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Start at (85~125) for T time, rush to (-55~40) for T time as one cycle. 100 cycles. Transforming interval: Max. 20 sec. Stabilize at normal condition for 1~2 hours. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. Stabilize at normal condition for 1~2 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. Stabilize at normal condition for 1~2 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilize at normal condition for 1~2 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, then dry at room temp for 5Min, then brushing making 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristics are normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. Characteristics are normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm according to their specific environment/equipment.
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Terminal electrode solderability may deteriorate beyond this period.
- Environment: Do not use or store in environments with gas corrosion (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. The temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating (temperature increase) when power is applied; ensure sufficient thermal design margin.
- Non-Magnetic Shield Type: Carefully consider coil layout in PCB design to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina