Shielded SMD Power Inductors LanTu Micro SDRI74-151MT with Accurate Dimensions and RoHS Compliance
Shielded SMD Power Inductors - SDRI74 Series
Product Overview:
The SDRI74 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power supply applications. Featuring a closed magnetic circuit for reduced leakage, high saturation current, and low DC resistance, these inductors ensure efficient operation. Their highly accurate dimensions are optimized for automatic mounting, making them suitable for a wide range of electronic devices including VTRs, LCD televisions, notebook PCs, and DC/DC converters. The series offers various package sizes and a broad inductance range, all while complying with RoHS, Halogen Free, and REACH standards.
Product Attributes:
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Origin: SHENZHEN
- Product Series: SDRI74 Series
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications:
| Part No. | Inductance (H) | Tolerance | Test Freq (L @ 0A) | Q Min (Test Freq) | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | External Dimensions (LWH) (mm) | |
|---|---|---|---|---|---|---|---|---|---|
| SDRI74-2R2N | 2.2 | 30% | 100KHz | 30 (1MHz) | 0.0147 | 5.20 | 5.00 | 7.57.54.5 | |
| SDRI74-3R3N | 3.3 | 30% | 100KHz | 30 (1MHz) | 0.0214 | 4.60 | 4.00 | 7.57.54.5 | |
| SDRI74-4R7N | 4.7 | 30% | 100KHz | 30 (1MHz) | 0.0310 | 3.80 | 3.40 | 7.57.54.5 | |
| SDRI74-6R8N | 6.8 | 30% | 100KHz | 30 (1MHz) | 0.035 | 3.20 | 2.30 | 7.57.54.5 | |
| SDRI74-8R2N | 8.2 | 30% | 100KHz | 30 (1MHz) | 0.042 | 3.00 | 2.10 | 7.57.54.5 | |
| SDRI74-100N | 10 | 30% | 100KHz | 35 (1MHz) | 0.049 | 2.95 | 1.84 | 7.57.54.5 | |
| SDRI74-120M | 12 | 20% | 100KHz | 35 (1MHz) | 0.058 | 2.85 | 1.71 | 7.57.54.5 | |
| SDRI74-150M | 15 | 20% | 100KHz | 35 (1MHz) | 0.081 | 2.80 | 1.47 | 7.57.54.5 | |
| SDRI74-180M | 18 | 20% | 100KHz | 35 (1MHz) | 0.091 | 2.50 | 1.31 | 7.57.54.5 | |
| SDRI74-220M | 22 | 20% | 100KHz | 35 (1MHz) | 0.110 | 2.10 | 1.23 | 7.57.54.5 | |
| SDRI74-270M | 27 | 20% | 100KHz | 35 (1MHz) | 0.150 | 1.90 | 1.12 | 7.57.54.5 | |
| SDRI74-330M | 33 | 20% | 100KHz | 35 (1MHz) | 0.170 | 1.80 | 0.96 | 7.57.54.5 | |
| SDRI74-390M | 39 | 20% | 100KHz | 35 (1MHz) | 0.230 | 1.70 | 0.91 | 7.57.54.5 | |
| SDRI74-470M | 47 | 20% | 100KHz | 35 (1MHz) | 0.260 | 1.50 | 0.88 | 7.57.54.5 | |
| SDRI74-560M | 56 | 20% | 100KHz | 35 (1MHz) | 0.350 | 1.32 | 0.75 | 7.57.54.5 | |
| SDRI74-680M | 68 | 20% | 1 | 100KHz | 35 (1MHz) | 0.380 | 1.08 | 0.69 | 7.57.54.5 |
| SDRI74-820M | 82 | 20% | 100KHz | 35 (1MHz) | 0.430 | 1.05 | 0.61 | 7.57.54.5 | |
| SDRI74-101M | 100 | 20% | 100KHz | 40 (0.796MHz) | 0.610 | 1.02 | 0.60 | 7.57.54.5 | |
| SDRI74-121M | 120 | 20% | 100KHz | 40 (0.796MHz) | 0.660 | 0.98 | 0.52 | 7.57.54.5 | |
| SDRI74-151M | 150 | 20% | 100KHz | 40 (0.796MHz) | 0.880 | 0.95 | 0.46 | 7.57.54.5 | |
| SDRI74-181M | 180 | 20% | 100KHz | 40 (0.796MHz) | 0.980 | 0.74 | 0.42 | 7.57.54.5 | |
| SDRI74-221M | 220 | 20% | 100KHz | 40 (0.796MHz) | 1.170 | 0.70 | 0.36 | 7.57.54.5 | |
| SDRI74-271M | 270 | 20% | 100KHz | 40 (0.796MHz) | 1.640 | 0.57 | 0.34 | 7.57.54.5 | |
| SDRI74-331M | 330 | 20% | 100KHz | 40 (0.796MHz) | 1.860 | 0.56 | 0.32 | 7.57.54.5 | |
| SDRI74-391M | 390 | 20% | 100KHz | 40 (0.796MHz) | 2.850 | 0.45 | 0.29 | 7.57.54.5 | |
| SDRI74-471M | 470 | 20% | 100KHz | 40 (0.796MHz) | 3.010 | 0.45 | 0.26 | 7.57.54.5 | |
| SDRI74-561M | 560 | 20% | 100KHz | 40 (0.796MHz) | 3.620 | 0.43 | 0.23 | 7.57.54.5 | |
| SDRI74-681M | 680 | 20% | 100KHz | 40 (0.796MHz) | 4.630 | 0.37 | 0.22 | 7.57.54.5 | |
| SDRI74-821M | 820 | 20% | 100KHz | 40 (0.796MHz) | 5.200 | 0.35 | 0.20 | 7.57.54.5 | |
| SDRI74-102M | 1000 | 20% | 100KHz | 40 (0.796MHz) | 6.000 | 0.33 | 0.18 | 7.57.54.5 |
Environmental Data:
- Operating Temperature: -55 to +125 (Including coils self-temperature rise)
Test Equipment:
- Inductance (L): HP4284A or HP4285A LCR meter or equivalent
- Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
- Quality Factor (Q): HP4285A or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Product Identification:
Model Number Structure: SDRI 74 470 M T
- Type: SDRI (Shielded SMD Power Inductors)
- Series: 74
- Inductance: 470 (e.g., 47 H)
- Inductance Tolerance: M (20%)
- Packing: T (Tape & Reel)
Shape and Dimensions (mm):
| Part No. | A (Max) | B (Max) | C (Max) | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SDRI74 | 7.5 | 7.5 | 4.5 | 1.8 | 5.0 | 1.6 | 4.8 | 2.2 |
Recommended Land Pattern:
(Image or diagram would be placed here if available in source)
Packaging:
Tape and Reel Specifications:
| Part No. | Tape Dimension (W) | Tape Dimension (P) | Tape Dimension (H) | Reel Dimensions (A) | Reel Dimensions (B) | Reel Dimensions (C) | Reel Dimensions (D) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRI74 | 16 | 12 | 11.5 | 16.5 | 100 | 13 | 330 | 1000 | 3000 | 12,000 |
Cover tape peel off condition:
- Cover tape peel force shall be 10 to 120g
- Noodle strip peeling angle 165 to 180
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test: Defined forces based on terminal sectional area. Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force and duration based on terminal diameter (d). Pull Force: gradually applied and maintained for 10 seconds. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Frequency varied between 10 and 55 Hz and return. Applied for 2 hours in each 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature transition between (85~125) and (-55~40). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: M(-55~-402). Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: N(125~852). Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30% (SMD series only). DCR/DCR10%. | Peak temperature: 260+0/-5. Reflowed twice. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, then dry for 5Min, brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. The characteristic is normal after test. | Apply twice as rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. The characteristic is normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils) |
Recommended Reflow Soldering Curve:
(Image or diagram would be placed here if available in source)
Reminders for Using These Products:
- Storage: Within 12 months, under conditions (temperature: 5~40C, humidity: 35~65% RH or less).
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals due to hand grease affecting solderability. Handle carefully to prevent damage from dropping.
- Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils; contact SXN if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Ensure preheating before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform after mounting within specified conditions to avoid overheating.
- Thermal Design: Allow sufficient margin for self-heating when power is ON.
- Layout: For non-magnetic shield types, carefully lay out coils on the PCB to prevent malfunctions due to magnetic interference.
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