Magnetic resin shielded LanTu Micro SNR8040-100MT inductors offering compact size and high current capacity
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Product Description
Product Overview
The SNR8040 Series Magnetic Resin Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are automatic assembly constructed power inductors designed for efficient power management. Featuring a magnetic-resin shielded construction, these inductors significantly reduce buzz noise to ultra-low levels. They offer large current handling capabilities with low DC resistance, a closed magnetic circuit design for reduced leakage flux and enhanced EMI resistance, and a space-saving form factor that contributes to power efficiency. These inductors are widely used in applications such as LED backlights, flat-screen TVs, set-top boxes, notebooks, desktops, servers, graphic cards, portable gaming devices, personal navigation systems, multimedia devices, automotive systems, telecommunication base stations, and DC-DC converters. They are compliant with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY (LT-)
- Series: SNR8040
- Construction: Automatic assembly, Magnetic resin shielded
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
| Part No. | External Dimensions (LWH) (mm) | Inductance (H) | Inductance Tolerance | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|---|
| SNR8040-1R0M | 8.08.04.0 | 1.0 | 20% | 0.008 | 0.010 | 9.85 | 6.30 |
| SNR8040-1R5M | 8.08.04.0 | 1.5 | 20% | 0.010 | 0.013 | 8.15 | 5.65 |
| SNR8040-2R2M | 8.08.04.0 | 2.2 | 20% | 0.012 | 0.015 | 7.10 | 5.15 |
| SNR8040-3R3M | 8.08.04.0 | 3.3 | 20% | 0.017 | 0.022 | 6.50 | 4.40 |
| SNR8040-3R6M | 8.08.04.0 | 3.6 | 20% | 0.017 | 0.022 | 6.50 | 4.35 |
| SNR8040-4R7M | 8.08.04.0 | 4.7 | 20% | 0.019 | 0.024 | 5.90 | 4.10 |
| SNR8040-5R6M | 8.08.04.0 | 5.6 | 20% | 0.021 | 0.027 | 4.55 | 3.85 |
| SNR8040-6R8M | 8.08.04.0 | 6.8 | 20% | 0.024 | 0.031 | 4.55 | 3.60 |
| SNR8040-8R2M | 8.08.04.0 | 8.2 | 20% | 0.026 | 0.033 | 4.20 | 3.45 |
| SNR8040-100M | 8.08.04.0 | 10 | 20% | 0.029 | 0.037 | 3.60 | 3.30 |
| SNR8040-150M | 8.08.04.0 | 15 | 20% | 0.047 | 0.061 | 2.95 | 2.80 |
| SNR8040-180M | 8.08.04.0 | 18 | 20% | 0.053 | 0.068 | 2.70 | 2.40 |
| SNR8040-220M | 8.08.04.0 | 22 | 20% | 0.069 | 0.089 | 2.40 | 2.10 |
| SNR8040-270M | 8.08.04.0 | 27 | 20% | 0.078 | 0.101 | 2.15 | 2.00 |
| SNR8040-330M | 8.08.04.0 | 33 | 20% | 0.097 | 0.126 | 2.05 | 1.80 |
| SNR8040-390M | 8.08.04.0 | 39 | 20% | 0.107 | 0.139 | 1.95 | 1.70 |
| SNR8040-470M | 8.08.04.0 | 47 | 20% | 0.136 | 0.176 | 1.75 | 1.55 |
| SNR8040-680M | 8.08.04.0 | 68 | 20% | 0.196 | 0.254 | 1.45 | 1.25 |
| SNR8040-820M | 8.08.04.0 | 82 | 20% | 0.225 | 0.292 | 1.30 | 1.15 |
| SNR8040-101M | 8.08.04.0 | 100 | 20% | 0.290 | 0.377 | 1.15 | 1.00 |
| SNR8040-121M | 8.08.04.0 | 120 | 20% | 0.334 | 0.434 | 1.12 | 0.95 |
| SNR8040-151M | 8.08.04.0 | 150 | 20% | 0.410 | 0.553 | 1.10 | 0.85 |
| SNR8040-221M | 8.08.04.0 | 220 | 20% | 0.599 | 0.778 | 0.85 | 0.80 |
| SNR8040-331M | 8.08.04.0 | 330 | 20% | 0.889 | 1.155 | 0.68 | 0.64 |
| SNR8040-471M | 8.08.04.0 | 470 | 20% | 1.260 | 1.625 | 0.60 | 0.50 |
| SNR8040-681M | 8.08.04.0 | 680 | 20% | 2.040 | 2.652 | 0.50 | 0.45 |
| SNR8040-102M | 8.08.04.0 | 1000 | 20% | 2.800 | 3.640 | 0.40 | 0.35 |
| Environmental Data: Operating Temperature: -40 to +125 (Including coils self-temperature rise) | |||||||
| Product Identification: SNR 8040 (External Dimensions) 470 (Inductance Value) M (Tolerance) T (Packing Type) | |||||||
| Inductance Tolerance Options: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | |||||||
| Packing Options: B: Bulk Package, T: Tape & Reel | |||||||
Recommended Land Pattern (mm)
| Part No. | A | B | C (Max) | D | E | F (Typ) | G (Typ) | H (Typ) |
|---|---|---|---|---|---|---|---|---|
| SNR8040 | 8.00.3 | 8.00.3 | 4.0 | 4.00.3 | 6.30.3 | 2.2 | 3.8 | 7.5 |
Packaging Specifications
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SNR8040 | 16 | 12 | 7.5 | 16.4 | 100 | 13 | 330 | 1000 | 3000 | 12,000 |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on sectional area of terminal (GB/T 2423.60-2008). Solder paste thickness: 0.12mm. Force applied gradually and maintained for 101s at 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Pull force applied gradually to terminal and maintained for 10 seconds, varying with terminal diameter (GB/T 2423.60-2008). |
| Resistance to Flexure | No visible mechanical damage. | Solder to jig, apply force (2mm flexure) at 0.5mm/sec for 30 sec (JIS C 5321:1997). |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction (GB/T 2423.7-2018). |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. (GB/T 2423.28-2005). |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Solder to jig, subjected to simple harmonic motion (1.5mm amplitude, 10-55 Hz) for 2 hours in 3 directions (GB/T 2423.10-2019). |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | 100 cycles of temperature shock between (85~125) and (-55~40), max 20 sec transforming interval (GB/T 2423.22-2012 Method Na). |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Temperature: -55~-402 for 962 hours (GB/T 2423.1-2008 Method Ab). |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Temperature: 125~852 for 962 hours (GB/T 2423.2-2008 Method Bb). |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Temperature: 602, Humidity: 90% to 95% RH for 962 hours (GB/T 2423.3-2016). |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | Refer to reflow curve, performed twice. Peak temperature: 260+0/-5 (GJB 360B-2009). |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, brush 10 times (IEC 68-2-45:1993). |
| Overload test | During test no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes (JIS C5311-6.13). |
| Voltage resistance test | During test no breakdown. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min (MIL-STD-202G Method 301). For parts with two coils. |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Solderability may deteriorate if storage time is exceeded.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering; ensure the temperature difference between solder and chip does not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions; overheating may cause short circuits, performance degradation, or reduced lifespan.
- Self-Heating: Account for self-heating (temperature increase) when the device is powered on in thermal design.
- Non-Magnetic Shield Type: For non-magnetic shield types, careful layout is needed to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina