Unshielded SMD Power Inductors - SSD0810 Series

Product Overview
The LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SSD0810 Series Unshielded SMD Power Inductors are designed for high power applications requiring high saturation and low DC resistance. These unshielded inductors are suitable for surface mounting equipment and are available in various package sizes and a wide inductance range. They comply with RoHS, Halogen Free, and REACH standards, making them ideal for use in electronic devices such as laptop computers, power supplies for VTRs, LCD televisions, and DC/DC converters.

Product Attributes

• Brand: LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Series: SSD0810
• Type: Unshielded SMD Power Inductors
• Certifications: RoHS, Halogen Free, REACH Compliance
• Origin: SHENZHEN

Technical Specifications

Dimensions

Environmental Data

• Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment

• Inductance (L): HP4284A, HP4285A LCR meter or equivalent
• Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
• Self-Resonant Frequency (SRF): Agilent E4991A or equivalent
• DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification

SSD 0810 100 M T

• Type: SSD (Unshielded SMD Power Inductors)
• Outer Dimensions (LWH) (mm): 0810
• Inductance: e.g., 100 (10 uH)
• Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
• Packing: B (Bulk Package), T (Tape & Reel)

Definitions

• Saturation Current: DC current at which inductance drops 10% from its value without current.
• Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
• Rated DC Current: The lesser value of Isat or Irms.

Reminders for Using These Products

• Storage period is within 12 months. Storage conditions: temperature 5~40C, humidity 35~65% RH or less.
• Do not use or store in environments with gas corrosion (salt, acid, alkali, etc.).
• Avoid direct contact with terminals by bare hands due to oil secretions.
• Handle products carefully to prevent damage from dropping or improper removal.
• Do not bend terminals with excessive stress to avoid wire fracture.
• Do not rinse coils. Contact the manufacturer if cleaning is necessary.
• Do not expose products to magnets or magnetic fields.
• Preheat components before soldering. The temperature difference between solder and chip should not exceed 150C.
• Soldering corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
• Allow sufficient thermal design margin for self-heating when power is on.
• For non-magnetic shield types, careful PCB layout is required to prevent malfunctions due to magnetic interference.