High Current Magnetic Resin Shielded SMD Power Inductors LanTu Micro SNR4030-680MT for DC DC Converters
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Product Description
Product Overview
The SNR4030 Series Magnetic Resin Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are automatic assembly compatible power inductors designed for high performance and reliability. Featuring a magnetic-resin shielded construction, these inductors significantly reduce buzz noise to ultra-low levels. They offer large current handling capabilities with low DC resistance, a closed magnetic circuit design for reduced leakage flux and strong EMI resistance, and metallization on the ferrite core for excellent shock resistance and durability. These space-saving and power-efficient components are compliant with RoHS, Halogen Free, and REACH standards, making them suitable for a wide range of applications including LED backlights, flat-screen TVs, notebooks, servers, automotive products, and DC-DC converters.
Product Attributes
- Brand: LANTU MICRO ELECTRIC
- Series: SNR4030
- Type: Magnetic Resin Shielded SMD Power Inductors
- Construction: Automatic assembly, Magnetic-resin shielded
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
| Part Number | Inductance (H) | Inductance Tolerance | Test Frequency | Test Voltage | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|---|---|
| SNR4030-1R0M | 1.0 | 20% | 100KHz | 1.0V | 0.014 | 0.018 | 5.26 | 4.15 |
| SNR4030-1R2M | 1.2 | 20% | 100KHz | 1.0V | 0.015 | 0.020 | 5.26 | 3.82 |
| SNR4030-1R5M | 1.5 | 20% | 100KHz | 1.0V | 0.020 | 0.026 | 4.84 | 3.34 |
| SNR4030-1R8M | 1.8 | 20% | 100KHz | 1.0V | 0.025 | 0.033 | 4.84 | 3.20 |
| SNR4030-2R2M | 2.2 | 20% | 100KHz | 1.0V | 0.030 | 0.039 | 4.40 | 2.95 |
| SNR4030-3R3M | 3.3 | 20% | 100KHz | 1.0V | 0.040 | 0.050 | 3.30 | 2.40 |
| SNR4030-4R7M | 4.7 | 20% | 100KHz | 1.0V | 0.060 | 0.076 | 2.90 | 2.00 |
| SNR4030-5R6M | 5.6 | 20% | 100KHz | 1.0V | 0.073 | 0.091 | 2.75 | 1.90 |
| SNR4030-6R8M | 6.8 | 20% | 100KHz | 1.0V | 0.090 | 0.115 | 2.60 | 1.60 |
| SNR4030-8R2M | 8.2 | 20% | 100KHz | 1.0V | 0.095 | 0.122 | 2.10 | 1.60 |
| SNR4030-100M | 10 | 20% | 100KHz | 1.0V | 0.100 | 0.130 | 1.95 | 1.50 |
| SNR4030-120M | 12 | 20% | 100KHz | 1.0V | 0.135 | 0.172 | 1.70 | 1.30 |
| SNR4030-150M | 15 | 20% | 100KHz | 1.0V | 0.190 | 0.230 | 1.65 | 1.11 |
| SNR4030-220M | 22 | 20% | 100KHz | 1.0V | 0.225 | 0.290 | 1.30 | 1.00 |
| SNR4030-330M | 33 | 20% | 100KHz | 1.0V | 0.330 | 0.420 | 1.10 | 0.84 |
| SNR4030-470M | 47 | 20% | 100KHz | 1.0V | 0.445 | 0.570 | 0.95 | 0.72 |
| SNR4030-680M | 68 | 20% | 100KHz | 1.0V | 0.868 | 1.100 | 0.72 | 0.52 |
| SNR4030-820M | 82 | 20% | 100KHz | 1.0V | 1.060 | 1.280 | 0.66 | 0.47 |
| SNR4030-101M | 100 | 20% | 100KHz | 1.0V | 1.150 | 1.480 | 0.60 | 0.45 |
| SNR4030-121M | 120 | 20% | 100KHz | 1.0V | 1.350 | 1.700 | 0.55 | 0.42 |
Dimensions
| Part No | L (mm) | W (mm) | H (mm) | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) | G (mm) | H (mm) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| SNR4030 | 4.00.3 | 4.00.3 | 3.0 Max | 2.10.2 | 3.30.2 | 1.1 Typ | 1.9 Typ | 3.7 Typ |
Environmental Data
| Parameter | Value |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
Packaging Information
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SNR4030 | 12 | 8 | 5.5 | 12.4 | 100 | 13 | 330 | 2000 | 8000 | 32,000 |
Reliability Testing Summary
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without loose terminal | Pulling test (force varies by terminal area), Solder paste thickness: 0.12mm, Keep time: 101s, Speed: 1.0mm/s |
| Terminal Strength (DIP) | Meet requirements without loose terminal | Pull Force test (force varies by terminal diameter), Duration: 10sec |
| Resistance to Flexure | No visible mechanical damage, Meet requirements | Flexure: 2mm, Pressurizing Speed: 0.5mm/sec, Keep time: 30 sec |
| Dropping | No case deformation or change in appearance, No short and no open | Drop from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction |
| Solderability | Wetting shall exceed 75% coverage, Terminals must have 95% minimum solder coverage | Solder temperature: 2402, Duration: 3 sec, Solder: Sn/3.0Ag/0.5Cu, Flux: 25% Resin and 75% ethanol |
| Vibration | No visible mechanical damage, Inductance change: Within 10%, Q factor change: Within 20% | Amplitude 1.5mm, Frequency 10-55 Hz and return, 2 hours in each of 3 mutually perpendicular directions |
| Thermal Shock | No visible mechanical damage, Inductance change: Within 10% (Mn-Zn: Within 30%), Q factor change: Within 20% | 100 cycles of temperature transitions between (-55~40) and (85~125), Transforming interval: Max. 20 sec |
| Low temperature Storage | No visible mechanical damage, Inductance change: Within 10% (Mn-Zn: Within 30%), Q factor change: Within 20% | Temperature: -55~-402, Duration: 962 hours |
| High temperature Storage | No visible mechanical damage, Inductance change: Within 10% (Mn-Zn: Within 30%), Q factor change: Within 20% | Temperature: 85~1252, Duration: 962 hours |
| Damp Heat (Steady States) | No visible mechanical damage, Inductance change: Within 10% (Mn-Zn: Within 30%), Q factor change: Within 20% | Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours |
| Heat endurance of Reflow soldering | No significant defects in appearance, L/L10% (Mn-Zn: L/L30%), Q/Q30% (SMD series only), DCR/DCR10% | Refer to reflow curve, peak temperature: 260+0/-5, Tested twice |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking | Dip into IPA solvent for 50.5Min, dry for 5Min, brushing 10 times |
| Overload test | During test no smoke, no peculiar smell, no fire; Characteristic normal after test | Apply twice rated current for 5 minutes |
| Voltage resistance test | During test no breakdown; Characteristic normal after test | DC1000V, Current: 1mA, Time: 1Min (For parts with two coils) |
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Adjust and confirm based on user's environment/equipment.
Reminders for Using These Products
- Storage: Within 12 months, temperature 5~40C, humidity 35~65% RH. Solderability may deteriorate if storage period elapses.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions. Handle products carefully to prevent damage.
- Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
- Cleaning: Do not rinse coils; contact manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or lifespan reduction.
- Thermal Design: Allow sufficient margin for thermal design due to self-heating when power is ON.
- Non-Magnetic Shield Type: Carefully lay out coils in circuit board design to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina