Product Overview

The SDRI129 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power supply applications. These inductors feature a high saturation current, low DC resistance, and a closed magnetic circuit design to minimize leakage. Their high-precision dimensions ensure suitability for automatic mounting, and they are available in various package sizes and inductance ranges. These components are RoHS, Halogen Free, and REACH compliant, making them ideal for use in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.

Product Attributes

• Brand: LANTU MICRO ELECTRIC TECHNOLOGY
• Series: SDRI129
• Type: Shielded SMD Power Inductors
• Certifications: RoHS, Halogen Free, REACH Compliance
• Magnetic Circuit Design: Closed magnetic circuit
• Mounting: Automatic mounting

Technical Specifications

Environmental Data

• Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment

• Inductance (L): HP4284A, HP4285A LCR meter or equivalent
• Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284A+42841A or equivalent
• DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification

Example: SDRI129220MT

• Type: SDRI (Shielded SMD Power Inductors)
• Series: 129
• Inductance: 220 (22 H)
• Inductance Tolerance: M (20%)
• Packing: T (Tape & Reel)

Shape and Dimensions

External Dimensions (LWH): 12.512.510.0 mm

Recommended Land Pattern

Dimensions are in mm.

Packaging

Tape and Reel Specifications:

Cover tape peel off condition:

• Cover tape peel force: 10 to 120g
• Noodle strip peeling angle: 165 to 180

Reliability Testing

Terminal Strength:

• SMT: Pulling test based on sectional area of terminal.
• DIP: Pulling test based on terminal diameter.
• Solder paste thickness: 0.12mm
• Meet requirements without any loose terminal.

Resistance to Flexure:

• No visible mechanical damage.
• Flexure: 2mm.
• Pressurizing Speed: 0.5mm/sec.
• Keep time: 30 sec.

Dropping Test:

• No case deformation or change in appearance.
• No short and no open.
• Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction.

Solderability:

• No visible mechanical damage.
• Wetting shall exceed 75% coverage.
• Terminals must have 95% minimum solder coverage.
• Solder temperature: 2402
• Duration: 3 sec.

Vibration Test:

• No visible mechanical damage.
• Inductance change: Within 10%.
• Q factor change: Within 20%.
• Applied for 2 hours in each 3 mutually perpendicular directions.

Thermal Shock Test:

• No visible mechanical damage.
• Inductance change: Within 10% (Mn-Zn: Within 30%).
• Q factor change: Within 20%.
• 100 cycles.

Low Temperature Storage Test:

• No visible mechanical damage.
• Inductance change: Within 10% (Mn-Zn: Within 30%).
• Q factor change: Within 20%.
• Temperature: -55~-402
• Duration: 962 hours.

High Temperature Storage Test:

• No visible mechanical damage.
• Inductance change: Within 10% (Mn-Zn: Within 30%).
• Q factor change: Within 20%.
• Temperature: 125~852.
• Duration: 962 hours.

Damp Heat (Steady States) Test:

• No visible mechanical damage.
• Inductance change: Within 10% (Mn-Zn: Within 30%).
• Q factor change: Within 20%.
• Temperature: 602
• Humidity: 90% to 95% RH.
• Duration: 962 hours.

Heat endurance of Reflow soldering:

• No significant defects in appearance.
• L/L10% (Mn-Zn: L/L30%).
• Q/Q30% (SMD series only).
• DCR/DCR10%.
• Peak temperature: 260+0/-5.

Resistance to solvent test:

• No case deformation or change in appearance or obliteration of marking.
• Dip parts into IPA solvent for 50.5Min, then drying at room temp for 5Min, brushing 10 times.

Overload test:

• During the test no smoke, no peculiar smell, no fire.
• The characteristic is normal after test.
• Apply twice the rated current for 5 minutes.

Voltage resistance test:

• During the test no breakdown.
• The characteristic is normal after test.
• DC1000V, Current: 1mA, Time: 1Min.

Recommended Reflow Soldering Curve

The recommended reflow conditions are set according to our soldering equipment. Adjust and confirm according to user's environment/equipment.

Reminders for Using These Products

• Storage: Within 12 months, temperature: 5~40C, humidity: 35~65% RH or less.
• Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
• Handling: Avoid direct contact with terminals by bare hands. Handle products carefully to prevent damage.
• Terminal Bending: Do not bend terminals with excessive stress.
• Cleaning: Do not rinse coils by yourself; contact the manufacturer if cleaning is necessary.
• Magnetic Fields: Do not expose products to magnets or magnetic fields.
• Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
• Soldering Corrections: Perform after mounting within specified conditions. Overheating may cause issues.
• Thermal Design: Allow sufficient margin for self-heating when power is ON.
• Layout (Non-magnetic Shield Type): Carefully lay out coils to avoid malfunctions due to magnetic interference.