Low noise and molding SMD power inductor LanTu Micro SMS0530-220MT with EMI interference protection
Product Overview
The LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0530 Series are ultra-high current SMD power inductors designed for high-density installations. These magnetically shielded inductors offer strong anti-electromagnetic interference capabilities, low DC resistance, and ultra-high current handling in a thin profile. Featuring an integral construction for high reliability and vibration resistance, they utilize a composite structure for ultra-low buzz noise and are die-cast with low-loss alloy powder for low impedance and minimal parasitic capacitance. These inductors achieve high efficiency by reducing winding DC resistance and core eddy-current loss, operating at frequencies up to 3MHz with a maximum insulation voltage of 30VDC. They are RoHS, Halogen Free, and REACH compliant.
Applications include: PDA, notebook, desktop, and server applications; high current POL converters; battery-powered devices; and DC/DC converters in distributed power systems.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS0530
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
| Part No. | Inductance (H) | Tolerance | Frequency (100KHz, 1.0V) | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical | Dimensions (LWH mm) | Operating Temperature (C) | Absolute Maximum Voltage (VDC) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS0530-R22M | 0.22 | 20% | 3.5 | 3.9 | 15.00 | 14.00 | 5.50 x 5.20 x 3.00 | -55 to +125 | 30 | |
| SMS0530-R33M | 0.33 | 20% | 4.6 | 5.5 | 14.40 | 13.10 | 5.50 x 5.20 x 3.00 | -55 to +125 | 30 | |
| SMS0530-R47M | 0.47 | 20% | 7.4 | 8.5 | 14.00 | 11.00 | 5.50 x 5.20 x 3.00 | -55 to +125 | 30 | |
| SMS0530-R68M | 0.68 | 20% | 11.0 | 12.0 | 12.00 | 9.50 | 5.50 x 5.20 x 3.00 | -55 to +125 | 30 | |
| SMS0530-1R0M | 1.0 | 20% | 12.0 | 15.0 | 10.00 | 9.00 | 5.50 x 5.20 x 3.00 | -55 to +125 | 30 | |
| SMS0530-1R2M | 1.2 | 20% | 15.0 | 16.0 | 9.50 | 8.50 | 5.50 x 5.20 x 3.00 | -55 to +125 | 30 | |
| SMS0530-1R5M | 1.5 | 20% | 20.0 | 25.0 | 9.00 | 7.50 | 5.50 x 5.20 x 3.00 | -55 to +125 | 30 | |
| SMS0530-2R2M | 2.2 | 20% | 31.0 | 35.0 | 7.00 | 6.50 | 5.50 x 5.20 x 3.00 | -55 to +125 | 30 | |
| SMS0530-3R3M | 3.3 | 20% | 35.0 | 46.0 | 6.00 | 5.00 | 5.50 x 5.20 x 3.00 | -55 to +125 | 30 | |
| SMS0530-4R7M | 4.7 | 20% | 50.0 | 60.0 | 5.00 | 4.50 | 5.50 x 5.20 x 3.00 | -55 to +125 | 30 | |
| SMS0530-6R8M | 6.8 | 20% | 102.0 | 110.0 | 4.00 | 3.50 | 5.50 x 5.20 x 3.00 | -55 to +125 | 30 | |
| SMS0530-100M | 10 | 20% | 110.0 | 125.0 | 3.50 | 3.20 | 5.50 x 5.20 x 3.00 | -55 to +125 | 30 | |
| SMS0530-150M | 15 | 20% | 175.0 | 215.0 | 2.50 | 2.20 | 5.50 x 5.20 x 3.00 | -55 to +125 | 30 | |
| SMS0530-220M | 22 | 20% | 320.0 | 394.8 | 2.00 | 1.80 | 5.50 x 5.20 x 3.00 | -55 to +125 | 30 |
Inductance Tolerance Options: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Saturation Current: DC current at which inductance drops 30% from its value without current.
Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
Rated DC Current: The lesser value of Isat or Irms.
Recommended Land Pattern Dimensions (mm):
| ITEM | A | B | C | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SMS0530 | 5.500.30 | 5.200.20 | 3.00Max | 2.30 Typ | 1.20 Typ | 3.00 | 7.00 | 2.50 |
Packaging:
- Packing Types: Bulk Package (B), Tape & Reel (T)
- Tape Dimension (mm): W: 12.0, P: 8.0, W1: 5.5
- Reel Dimensions (mm): A: 12.4, B: 100, C: 13, D: 330
- Quantities: Reel (PCS): 2000, Inside Box (PCS): 8000, Outside Carton (PCS): 32,000
Reliability Testing:
- Terminal Strength: Meets specified force requirements without loose terminals.
- Resistance to Flexure: No visible mechanical damage, meets flexure and speed requirements.
- Dropping: No case deformation or appearance change; no short/open circuits after dropping from 1m.
- Solderability: Minimum 95% solder coverage on terminals; wetting exceeds 75% coverage.
- Vibration: No visible mechanical damage; inductance and Q factor changes within specified limits.
- Thermal Shock: No visible mechanical damage; inductance and Q factor changes within specified limits after 100 cycles.
- Low Temperature Storage: No visible mechanical damage; inductance and Q factor changes within specified limits after 962 hours at -55~-402.
- High Temperature Storage: No visible mechanical damage; inductance and Q factor changes within specified limits after 962 hours at 125~852.
- Damp Heat (Steady States): No visible mechanical damage; inductance and Q factor changes within specified limits after 962 hours at 602 and 90% to 95% RH.
- Heat endurance of Reflow soldering: No significant defects; inductance, Q factor, and DCR changes within specified limits after two reflow cycles.
- Resistance to solvent test: No case deformation or appearance change after dipping in IPA solvent and brushing.
- Overload test: No smoke, peculiar smell, or fire during test; characteristics normal after test.
- Voltage resistance test: No breakdown during test; characteristics normal after test.
Recommended Reflow Soldering Curve: Conditions to be adjusted and confirmed according to user's environment/equipment.
Reminders for Using These Products:
- Storage period within 12 months under specified conditions (5~40C, 35-65% RH).
- Avoid use and storage in gas corrosive environments.
- Do not touch electrodes directly with bare hands.
- Handle products carefully to prevent damage.
- Do not bend terminals excessively.
- Do not rinse coils; contact manufacturer if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; temperature difference should not exceed 150C.
- Soldering corrections after mounting should be within specifications to avoid overheating.
- Allow sufficient margin for thermal design due to self-heating.
- For non-magnetic shield types, careful layout is required to prevent malfunction due to magnetic interference.
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