Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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Unshielded DIP Power Inductor LanTu Micro SPK0810-472MB for Spike Suppression and Power Applications

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Product Description

Unshielded DIP Power Inductors - SPK Series

Product Overview

The SPK Series Unshielded DIP Power Inductors are designed for spike suppression and general-purpose power applications. They offer a low-cost solution with high power handling, high saturation, and low resistance. The core is encapsulated in UL heat shrink tubing for enhanced mechanical and environmental protection. Available in various package sizes and inductance ranges, these inductors are suitable for automated insertion processes and comply with RoHS, Halogen Free, and REACH standards. They are ideal for use in consumer electronics, telecommunication devices, and power conversion circuits.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SPK
  • Type: Unshielded DIP Power Inductor / Spike suppression coil
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Packaging Options: Tape packaging for auto-insertion, Bulk Package

Applications

  • TVs and Audio equipment
  • Telecommunication devices
  • Noise filters
  • Chargers, fast charge
  • DC/DC converters

Environmental Data

  • Operating Temperature: -40 to +125 (Including coil self-temperature rise)

Technical Specifications

Product Identification: SPK 0608 503 K TF

Inductance Tolerance Options: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%

Shape and Dimensions

Part No A (Max) B (Min) C () D (Max) E () F H
SPK0406 8.0 mm 15.0 mm 2.0 mm 5.0 mm 0.55 mm 0.85 2.0
SPK0608 11.0 mm 15.0 mm 2.5 mm 7.0 mm 0.65 mm 0.95 2.5
SPK0707 9.5 mm 15.0 mm 5.0 mm 8.0 mm 0.65 mm 0.95 5.0
SPK0807 9.5 mm 15.0 mm 5.0 mm 9.0 mm 0.65 mm 0.95 5.0
SPK0810 13.0 mm 15.0 mm 5.0 mm 9.0 mm 0.65 mm 0.95 5.0
SPK0912 15.0 mm 15.0 mm 5.0 mm 10.0 mm 0.80 mm 1.1 5.0
SPK1010 13.0 mm 15.0 mm 5.0 mm 12.0 mm 0.80 mm 1.1 5.0
SPK1012 15.0 mm 15.0 mm 6.0 mm 12.0 mm 0.80 mm 1.1 6.0
SPK1016 19.0 mm 15.0 mm 6.0 mm 12.0 mm 0.80 mm 1.1 6.0
SPK1018 21.0 mm 15.0 mm 6.0 mm 12.0 mm 0.80 mm 1.1 6.0
SPK1213 16.0 mm 15.0 mm 7.5 mm 14.0 mm 0.80 mm 1.1 7.5

Electrical Characteristics (Sample Data for SPK0406 Series)

Part No Inductance L (H) Tolerance Q Min @1KHz Test Freq. (MHz) SRF Min (MHz) DCR Max () Rated Current Max (mA)
SPK0406-1R0M- 1.0 M 100 7.96 120 0.035 2000
SPK0406-1R2M- 1.2 M 100 7.96 120 0.058 1950
SPK0406-100M- 10 M 80 2.52 20 0.230 1000
SPK0406-1000M- 1000 M 45 0.796 6.0 1.000 400
SPK0406-1002K- 10000 K 45 0.0796 72.000 0.47 47

Electrical Characteristics (Sample Data for SPK0608 Series)

Part No Inductance L (H) Tolerance Q Min @1KHz Test Freq. (MHz) SRF Min (MHz) DCR Max () Rated Current Max (mA)
SPK0608-3R3M- 3.3 M 20 7.96 40.0 0.016 3500
SPK0608-100M- 10 M 30 2.52 23.0 0.039 2000
SPK0608-1000M- 1000 M 100 0.252 2.1 3.200 200
SPK0608-1003M- 30000 M 50 0.0796 91.500 0.985 35

Electrical Characteristics (Sample Data for SPK0707 Series)

Part No Inductance L (H) Tolerance Q Min @1KHz Test Freq. (MHz) SRF Min (MHz) DCR Max () Saturation Current Max (mA) Temperature Rise Current Max (mA)
SPK0707-1R0M- 1.0 M 10 7.96 70 0.006 6600 5000
SPK0707-100M- 10 M 20 2.52 19 0.043 2100 1900
SPK0707-1000M- 1000 M 70 0.252 1.3 4.300 200 190

Electrical Characteristics (Sample Data for SPK0807 Series)

Part No Inductance L (H) Tolerance Q Min @1KHz Test Freq. (MHz) SRF Min (MHz) DCR Max () Saturation Current Max (mA) Temperature Rise Current Max (mA)
SPK0807-2R2M- 2.2 M 10 7.96 60 0.011 5500 4000
SPK0807-100M- 10 M 20 2.52 19 0.031 2500 2200
SPK0807-1000K- 1000 K 20 0.252 1.5 2.200 260 230

Electrical Characteristics (Sample Data for SPK0810 Series)

Part No Inductance L (H) Tolerance Q Min @1KHz Test Freq. (MHz) SRF Min (MHz) DCR Max () Rated Current Max (mA)
SPK0810-3R3M- 3.3 M 30 7.96 65 0.012 5000
SPK0810-100M- 10 M 50 2.52 17 0.025 3200
SPK0810-1000M- 1000 M 40 0.252 1.5 1.800 280
SPK0810-1003M- 33000 M 60 0.0796 0.20 75.000 50

Electrical Characteristics (Sample Data for SPK0912 Series)

Part No Inductance L (H) Tolerance DCR Max () Rated Current Max (mA)
SPK0912-1R0M- 1.0 M 0.011 6000
SPK0912-100M- 10 M 0.040 4000
SPK0912-1000M- 1000 M 2.000 200
SPK0912-1003M- 33000 M 45.00 40

Electrical Characteristics (Sample Data for SPK1010 Series)

Part No Inductance L (H) Tolerance Q Min @1KHz Test Freq. (MHz) SRF Min (MHz) DCR Max () Saturation Current Max (mA) Temperature Rise Current Max (mA)
SPK1010-3R3M- 3.3 M 10 7.96 36 0.010 8800 5900
SPK1010-100M- 10 M 20 2.52 16 0.025 5000 3700
SPK1010-1000M- 1000 M 20 0.252 1.1 1.400 510 500
SPK1010-1003K- 15000 K 50 0.0796 0.29 24.000 130 120

Electrical Characteristics (Sample Data for SPK1012 Series)

Part No Inductance L (H) Tolerance Q Min @1KHz Test Freq. (MHz) SRF Min (MHz) DCR Max () Saturation Current Max (mA) Temperature Rise Current Max (mA)
SPK1012-3R3M- 3.3 M 90 7.96 59.00 0.025 5500 5500
SPK1012-100M- 10 M 100 2.52 26.00 0.050 4200 4200
SPK1012-1000K- 1000 K 40 0.252 1.60 1.400 300 300
SPK1012-10000K- 10000 K 80 0.0796 0.35 12.000 180 170

Electrical Characteristics (Sample Data for SPK1016 Series)

Part No Inductance L (H) Tolerance DCR Max () Saturation Current Max (mA) Temperature Rise Current Max (mA)
SPK1016-4R7M- 4.7 M 0.020 8500 5800
SPK1016-100M- 10 M 0.035 7600 5000
SPK1016-1000K- 1000 K 1.200 700 700

Electrical Characteristics (Sample Data for SPK1018 Series)

Part No Inductance L (H) Tolerance DCR Max () Saturation Current Max (mA) Temperature Rise Current Max (mA)
SPK1018-4R7K- 4.7 K 0.008 10000 6000
SPK1018-100K- 10 K 0.017 7000 4500
SPK1018-1000K- 1000 K 0.844 660 660
SPK1018-10000K- 10000 K 7.3000 220 220

Electrical Characteristics (Sample Data for SPK1213 Series)

Part No Inductance L (H) Tolerance DCR Max () Saturation Current Max (mA) Temperature Rise Current Max (mA)
SPK1213-100M- 10 M 0.023 8000 5100
SPK1213-1000K- 1000 K 1.000 780 780
SPK1213-10000K- 10000 K 10.000 240 240

Packaging

Part No. PE Bag Quantity
SPK0406 1000 PCS
SPK0608 1000 PCS
SPK0707 1000 PCS
SPK0807 1000 PCS
SPK0810 500 PCS
SPK0912 300 PCS
SPK1010 200 PCS
SPK1012 200 PCS
SPK1016 200 PCS
SPK1018 200 PCS
SPK1213 200 PCS

Reliability Testing

Item Requirements Test Methods and Remarks
Terminal Strength (SMT) Meet requirements without any loose terminal. Pulling test: Define: A: sectional area of terminal A8mm2 force5N time:30sec; 8mm2<A20mm2 force 10N time: 10sec; 20mm2<A force 20N time: 10sec. Solder paste thickness:0.12mm. Solder the inductor to the testing jig using leadfree solder. Then apply a force in the Keep time: 101s Speed: 1.0mm/s.
Terminal Strength (DIP) Meet requirements without any loose terminal. Pull Force: applied gradually to the terminal and maintained for 10 seconds. Terminal diameter(d) mm: 0.35d 0.50 Applied force:5N Duration: 10sec; 0.50d 0.80 Applied force:10N Duration: 10sec; 0.80d 1.25 Applied force:20N Duration: 10sec; D 1.25 Applied force:40N Duration: 10sec.
Resistance to Flexure No visible mechanical damage. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. Solder the inductor to the test jig (glass epoxy board) using a leadfree solder. Then apply a force in the direction shown.
Dropping No case deformation or change in appearance. No short and no open. Drop the packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction.
Solderability Terminals must have 95% minimum solder coverage. Wetting shall exceed 75% coverage. No visible mechanical damage. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol in weight.
Vibration Inductance change: Within 10%. Q factor change: Within 20%. No visible mechanical damage. Subjected to simple harmonic motion, frequency 10 to 55 Hz and return to 10 Hz in approx. 1 minute. Applied for 2 hours in each of 3 mutually perpendicular directions (total 6 hours). Solder the inductor to the testing jig (glass epoxy board) using leadfree solder.
Thermal Shock Inductance change: Within 10%. Q factor change: Within 20%. No visible mechanical damage. 100 cycles of temperature change from (85~125) for T time to (-55~40) for T time. Transforming interval: Max. 20 sec. Stabilize at normal condition for 1-2 hours before measuring.
Low temperature Storage Inductance change: Within 10%. Q factor change: Within 20%. No visible mechanical damage. Temperature: -55~-402. Duration: 962 hours. Stabilize at normal condition for 1-2 hours before measuring.
High temperature Storage Inductance change: Within 10%. Q factor change: Within 20%. No visible mechanical damage. Temperature: 125~852. Duration: 962 hours. Stabilize at normal condition for 1-2 hours before measuring.
Damp Heat (Steady States) Inductance change: Within 10%. Q factor change: Within 20%. No visible mechanical damage. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilize at normal condition for 1-2 hours before measuring.
Heat endurance of Reflow soldering L/L10%. Q/Q30% (SMD series only). DCR/DCR10%. No significant defects in appearance. Peak temperature: 260+0/-5. Go through reflow twice.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. Dip parts into IPA solvent for 50.5Min, then dry at room temp for 5Min, then brushing making 10 times.
Overload test During the test no smoke, no peculiar smell, no fire. The characteristic is normal after test. Apply twice rated current for 5 minutes.
Voltage resistance test During the test no breakdown. The characteristic is normal after test. DC1000V, Current: 1mA, Time: 1Min. For parts with two coils.

Recommended Lead-free Wave Soldering Curve (DIP-TYP)

The recommended reflow conditions are set according to our soldering equipment. Users should adjust and confirm according to their specific environment/equipment.

Reminders for Using These Products

  • Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Terminal electrode solderability may deteriorate if storage period is exceeded.
  • Environment: Do not use or store in corrosive gas environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals with bare hands to prevent reduced solderability due to oil secretions. Handle products carefully to prevent damage from dropping or improper removal.
  • Bending: Do not bend terminals with excessive stress to avoid wire fracture.
  • Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
  • Magnetic Fields: Do not expose products to magnets or magnetic fields.
  • Soldering: Preheat components before soldering. Ensure the temperature difference between solder and chip temperature does not exceed 150C. Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance degradation, or lifespan reduction due to overheating.
  • Thermal Design: Account for self-heating when power is applied to ensure sufficient thermal design tolerance.
  • Layout: For non-magnetic shield types, carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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