Unshielded SMD Power Inductors - SCD7850 Series

Product Overview

The SCD7850 Series Unshielded SMD Power Inductors are low-cost, surface-mountable components designed for efficient power delivery in a variety of electronic devices. Featuring a silver-plated construction, these inductors offer a small footprint with high rated current capabilities and low DC resistance. They are compliant with RoHS, Halogen Free, and REACH standards, making them suitable for environmentally conscious applications. Ideal for use in power supplies for VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.

Product Attributes

• Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Series: SCD7850
• Type: Unshielded SMD Power Inductors
• Design: Silver plated type, Low cost design
• Construction: Unshielded magnetic circuit, Surface mounting
• Certifications: RoHS, Halogen Free, REACH Compliance
• Origin: China (implied by Shenzhen location)

Technical Specifications

Dimensions:

Electrical Characteristics (Typical):

Environmental Data:

Product Identification:

Packaging:

Test Equipment:

• Inductance (L): HP4284A, HP4285A or equivalent
• Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
• Self-Resonant Frequency (SRF): Agilent E4991A or equivalent
• DC Resistance (DCR): Chroma 16502 or equivalent

Definitions:

• Saturation Current: DC current at which inductance drops 10% from its value without current.
• Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
• Rated DC Current: The lesser value between Isat and Irms.

Reminders for Using These Products:

• Storage period is within 12 months under conditions (5~40C, 35~65% RH).
• Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
• Do not touch electrodes directly with bare hands to prevent soldering issues.
• Handle products carefully to prevent damage from dropping or improper removal.
• Do not bend terminals excessively to avoid wire fracture.
• Do not rinse coils; contact the manufacturer if cleaning is necessary.
• Keep away from magnets or magnetic fields.
• Preheat components before soldering; ensure the temperature difference between solder and chip does not exceed 150C.
• Soldering corrections after mounting should be within specified conditions to prevent short circuits, performance degradation, or reduced lifespan.
• Account for self-heating when power is on in thermal design.
• For non-magnetic shield types, careful coil layout on the PCB is required to prevent malfunctions due to magnetic interference.