Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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Molding SMD Power Inductors LanTu Micro SMS1360-150MT with High Reliability and Vibration Resistance

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Product Description

Molding SMD Power Inductors - SMS1360 Series

Product Overview

The SMS1360 Series by SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers ultra-high current SMD power inductors designed for demanding applications. These inductors feature a thin profile with low DC resistance and ultra-high current capabilities. Their magnetic shielding provides strong anti-electromagnetic interference, making them suitable for high-density installations. Constructed with an integral molding structure, they offer high reliability and excellent vibration resistance, while the composite structure minimizes buzz noise. Utilizing low-loss alloy powder die-casting, these inductors achieve low impedance and small parasitic capacitance, contributing to high efficiency and reduced core eddy-current losses. They support frequencies up to 3MHz and have an absolute maximum voltage rating of 30VDC, adhering to RoHS, Halogen Free, and REACH compliance.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Product Type: Molding SMD Power Inductor
  • Series: SMS1360
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Origin: Shenzhen, China (Implied by company name and location)

Applications

  • PDA, notebook, desktop, server applications
  • High current POL converters
  • Battery powered devices
  • DC/DC converters in distributed power systems

Technical Specifications

Part No. Inductance (H) Tolerance DCR (m) Typical Saturation Current (A) Typical Heat Rating Current (A) Typical Dimensions (LWH) (mm) Frequency Absolute Maximum Voltage
SMS1360-R68M 0.68 20% 1.4 1.6 55.00 13.812.67.0 Up to 3MHz 30VDC
SMS1360-1R0M 1.0 20% 1.7 2.0 35.00 13.812.67.0 Up to 3MHz 30VDC
SMS1360-2R2M 2.2 20% 3.5 4.2 25.00 13.812.67.0 Up to 3MHz 30VDC
SMS1360-3R3M 3.3 20% 5.5 6.8 22.00 13.812.67.0 Up to 3MHz 30VDC
SMS1360-4R7M 4.7 20% 8.0 9.0 18.00 13.812.67.0 Up to 3MHz 30VDC
SMS1360-6R8M 6.8 20% 10.0 14.0 15.00 13.812.67.0 Up to 3MHz 30VDC
SMS1360-8R2M 8.2 20% 13.5 16.0 14.00 13.812.67.0 Up to 3MHz 30VDC
SMS1360-100M 10 20% 18.0 21.0 12.50 13.812.67.0 Up to 3MHz 30VDC
SMS1360-220M 22 20% 34.0 38.0 8.00 13.812.67.0 Up to 3MHz 30VDC
SMS1360-270M 27 20% 45.0 56.0 7.00 13.812.67.0 Up to 3MHz 30VDC
SMS1360-330M 33 20% 56.0 70.0 6.50 13.812.67.0 Up to 3MHz 30VDC
SMS1360-470M 47 20% 70.0 90.0 6.00 13.812.67.0 Up to 3MHz 30VDC
SMS1360-680M 68 20% 105.0 125.0 5.00 13.812.67.0 Up to 3MHz 30VDC
SMS1360-820M 82 20% 115.0 140.0 4.00 13.812.67.0 Up to 3MHz 30VDC
SMS1360-101M 100 20% 130.0 200.0 3.00 13.812.67.0 Up to 3MHz 30VDC

Environmental Data

Operating Temperature: -55 to +125 (Including coils self-temperature rise)

Test Equipment

  • Inductance (L): WK3260B LCR meter or equivalent
  • Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
  • DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification

SMS 1360 101 M T

  • : Inductance (e.g., 101 = 100 H)
  • : Tolerance (M = 20%)
  • : Packing (T = Tape & Reel)

Shape and Dimensions

External Dimensions (LWH): 13.812.67.0 mm

Recommended Land Pattern Dimensions (mm):

ITEM A B C D E F G H
SMS1360 13.800.50 12.600.20 7.00Max 3.70 Typ 2.50 Typ 8.00 14.60 5.00

Packaging

  • Tolerance Inductance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
  • Packing: Bulk Package (B), Tape & Reel (T)

Important Notes for Usage

  • Storage: Within 12 months, under 5~40C and 35~65% RH.
  • Avoid use and storage in corrosive environments (salt, acid, alkali).
  • Do not touch electrodes directly with bare hands.
  • Handle products carefully to prevent damage.
  • Do not bend terminals excessively.
  • Do not rinse coils; contact manufacturer if cleaning is necessary.
  • Keep away from magnets or magnetic fields.
  • Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering corrections after mounting should be within specified conditions. Overheating may cause issues.
  • Account for self-heating when designing for thermal management.
  • For non-magnetic shield types, careful layout is needed to avoid malfunction due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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