Product Overview

The SCD4532 Series from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are unshielded SMD power inductors designed for surface mounting. These low-cost inductors feature a silver-plated construction, offering a small size with high rated current and low DC resistance. They are compliant with RoHS, Halogen Free, and REACH standards. Ideal for DC/DC converters and power supplies in applications such as VTRs, LCD televisions, notebook PCs, and portable communication equipment.

Product Attributes

• Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Series: SCD4532
• Type: Unshielded SMD Power Inductors
• Construction: Silver plated type
• Certifications: RoHS, Halogen Free, REACH Compliance
• Packaging Options: Bulk Package (B), Tape & Reel (T)

Technical Specifications

Environmental Data:

• Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment:

• Inductance (L): HP4284A, HP4285A LCR meter or equivalent
• Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
• Self-Resonant Frequency (SRF): Agilent E4991A or equivalent
• DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification Example: SCD 4532 - 100 M T

• : Series (SCD4532)
• : Inductance (100 = 10 H)
• : Tolerance (M = 20%)
• : Type (SM = Unshielded SMD Power Inductors)
• : Packing (T = Tape & Reel)

Definitions:

• Saturation Current: DC current at which inductance drops 10% from its value without current.
• Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
• Rated DC Current: The lesser value of Isat or Irms.

Special Reminder: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

Packaging:

Cover tape peel off condition:

• a) Cover tape peel force shall be 10 to 120g
• b) Noodle strip peeling angle 165 to 180

Reliability Testing:

• Terminal Strength: SMT and DIP specifications provided, involving pull tests and applied forces based on terminal dimensions.
• Resistance to Flexure: No visible mechanical damage after flexure test (2mm flexure, 0.5mm/sec speed, 30 sec keep time).
• Dropping: No case deformation or change in appearance, no short/open circuit after dropping packaged products from 1m height.
• Solderability: Minimum 95% solder coverage on terminals after soldering at 2402 for 3 sec.
• Vibration: Inductance change within 10%, Q factor change within 20% after vibration test.
• Thermal Shock: Inductance change within 10% (Mn-Zn: 30%), Q factor change within 20% after 100 cycles of thermal shock.
• Low temperature Storage: Inductance change within 10% (Mn-Zn: 30%), Q factor change within 20% after 962 hours at -402.
• High temperature Storage: Inductance change within 10% (Mn-Zn: 30%), Q factor change within 20% after 962 hours at 852.
• Damp Heat (Steady States): Inductance change within 10% (Mn-Zn: 30%), Q factor change within 20% after 962 hours at 602 and 90-95% RH.
• Heat endurance of Reflow soldering: L/L10% (Mn-Zn: L/L30%), Q/Q30%, DCR/DCR10% after reflow soldering twice.
• Resistance to solvent test: No case deformation or change in appearance after dipping in IPA solvent.
• Overload test: Apply twice rated current for 5 minutes. No smoke, peculiar smell, or fire. Characteristics normal after test.
• Voltage resistance test: No breakdown during test. Characteristics normal after test. DC1000V, Current: 1mA, Time: 1Min.

Recommended reflow soldering curve: Conditions to be adjusted and confirmed according to user's environment/equipment.

Reminders for Using These Products:

• Storage period is within 12 months under conditions: temperature 5~40C, humidity 35~65% RH or less.
• Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
• Avoid direct contact with terminals by bare hands due to oil secretions.
• Handle products carefully to prevent damage from dropping or inappropriate removal.
• Do not bend terminals with excessive stress.
• Do not rinse coils; contact the company if cleaning is necessary.
• Do not expose products to magnets or magnetic fields.
• Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
• Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance degradation, or lifespan reduction.
• Allow sufficient margin for thermal design due to self-heating when power is ON.
• For non-magnetic shield types, carefully lay out the coil on the circuit board to prevent malfunctions due to magnetic interference.