Space Saving Magnetic Resin Shielded SMD Power Inductor LanTu Micro SNR8040-150MT with Performance
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Product Description
Product Overview
The SNR8040 Series Magnetic Resin Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are automatic assembly compatible power inductors designed for efficient and reliable performance. Featuring a magnetic-resin shielded construction, these inductors significantly reduce buzz noise to ultra-low levels. They offer large current handling capabilities with low DC resistance, a closed magnetic circuit design for reduced leakage flux and enhanced EMI resistance, and metallization on the ferrite core for excellent shock resistance. These space-saving and power-efficient components are suitable for a wide range of applications including LED backlights, flat-screen TVs, notebooks, servers, automotive systems, and DC-DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR8040
- Construction: Magnetic Resin Shielded SMD
- Certifications: RoHS, Halogen Free, REACH Compliance
- Core Material: Ferrite Core
- Circuit Design: Closed Magnetic Circuit
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | Test Frequency (100KHz, 1.0V) | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|
| SNR8040-1R0M | 1.0 | 20% | 1.0V | 0.010 | 9.85 | 6.30 |
| SNR8040-1R5M | 1.5 | 20% | 1.0V | 0.013 | 8.15 | 5.65 |
| SNR8040-2R2M | 2.2 | 20% | 1.0V | 0.015 | 7.10 | 5.15 |
| SNR8040-3R3M | 3.3 | 20% | 1.0V | 0.022 | 6.50 | 4.40 |
| SNR8040-3R6M | 3.6 | 20% | 1.0V | 0.022 | 6.50 | 4.35 |
| SNR8040-4R7M | 4.7 | 20% | 1.0V | 0.024 | 5.90 | 4.10 |
| SNR8040-5R6M | 5.6 | 20% | 1.0V | 0.027 | 4.55 | 3.85 |
| SNR8040-6R8M | 6.8 | 20% | 1.0V | 0.031 | 4.55 | 3.60 |
| SNR8040-8R2M | 8.2 | 20% | 1.0V | 0.033 | 4.20 | 3.45 |
| SNR8040-100M | 10 | 20% | 1.0V | 0.037 | 3.60 | 3.30 |
| SNR8040-150M | 15 | 20% | 1.0V | 0.061 | 2.95 | 2.80 |
| SNR8040-180M | 18 | 20% | 1.0V | 0.068 | 2.70 | 2.40 |
| SNR8040-220M | 22 | 20% | 1.0V | 0.089 | 2.40 | 2.10 |
| SNR8040-270M | 27 | 20% | 1.0V | 0.101 | 2.15 | 2.00 |
| SNR8040-330M | 33 | 20% | 1.0V | 0.126 | 2.05 | 1.80 |
| SNR8040-390M | 39 | 20% | 1.0V | 0.139 | 1.95 | 1.70 |
| SNR8040-470M | 47 | 20% | 1.0V | 0.176 | 1.75 | 1.55 |
| SNR8040-680M | 68 | 20% | 1.0V | 0.254 | 1.45 | 1.25 |
| SNR8040-820M | 82 | 20% | 1.0V | 0.292 | 1.30 | 1.15 |
| SNR8040-101M | 100 | 20% | 1.0V | 0.377 | 1.15 | 1.00 |
| SNR8040-121M | 120 | 20% | 1.0V | 0.434 | 1.12 | 0.95 |
| SNR8040-151M | 150 | 20% | 1.0V | 0.553 | 1.10 | 0.85 |
| SNR8040-221M | 220 | 20% | 1.0V | 0.778 | 0.85 | 0.80 |
| SNR8040-331M | 330 | 20% | 1.0V | 1.155 | 0.68 | 0.64 |
| SNR8040-471M | 470 | 20% | 1.0V | 1.625 | 0.60 | 0.50 |
| SNR8040-681M | 680 | 20% | 1.0V | 2.652 | 0.50 | 0.45 |
| SNR8040-102M | 1000 | 20% | 1.0V | 3.640 | 0.40 | 0.35 |
| Dimensions (mm) | L | W | H |
|---|---|---|---|
| SNR8040 Series | 8.00.3 | 8.00.3 | 4.0 Max |
| Environmental Data | Operating Temperature |
|---|---|
| -40 to +125 (Including coils self-temperature rise) |
| Product Identification Example | |||||
|---|---|---|---|---|---|
| Part No. | Type | External Dimensions (LWH) (mm) | Inductance | Inductance Tolerance | Packing |
| SNR8040-470M T | SNR | 8040 (8.08.04.0) | 470 (47 H) | M (20%) | T (Tape & Reel) |
| Inductance Tolerance Codes |
|---|
| J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% |
| Packing Codes |
|---|
| B: Bulk Package, T: Tape & Reel |
| Key Definitions | Description |
|---|---|
| Saturation Current | DC current at which inductance drops 30% from its value without current. |
| Temperature Rise Current | The actual value of DC current when the temperature rise is T 40 (Ta=25). |
| Rated DC Current | The lesser value of Isat or Irms. |
| Reliability Testing Items | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without loose terminal. | Pulling test based on sectional area; Solder paste thickness: 0.12mm. |
| Terminal Strength (DIP) | Meet requirements without loose terminal. | Applied force based on terminal diameter. |
| Resistance to Flexure | No visible mechanical damage. | Solder to jig, apply flexure (2mm) at 0.5mm/sec for 30 sec. |
| Dropping | No case deformation, no short/open. | Drop packaged products from 1m high in various angles/surfaces. |
| Solderability | Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage. | Solder temperature: 2402, Duration: 3 sec. |
| Vibration | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | Harmonic motion 10-55 Hz, 1.5mm amplitude for 2 hours in 3 directions. |
| Thermal Shock | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | 100 cycles of temperature extremes (-55~40 to 85~125). |
| Low Temperature Storage | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | -402 for 962 hours. |
| High Temperature Storage | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | 852 for 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | 602, 90%-95% RH for 962 hours. |
| Heat endurance of Reflow soldering | No significant defects; L/L10%; Q/Q30%; DCR/DCR10%. | Two reflow cycles, peak temperature 260+0/-5. |
| Resistance to solvent test | No case deformation or appearance change. | Dip in IPA solvent, dry, brush 10 times. |
| Overload test | No smoke, smell, fire; characteristics normal after test. | Apply twice rated current for 5 minutes (twice). |
| Voltage resistance test | No breakdown; characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Usage Precautions
- Storage period: within 12 months. Storage conditions: 5~40C, 35-65% RH.
- Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Do not touch terminals directly with bare hands to prevent soldering issues.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals excessively to avoid wire fracture.
- Do not clean coils; contact the manufacturer if cleaning is necessary.
- Keep away from magnets or magnetic objects.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid issues like short circuits or reduced lifespan.
- Account for self-heating when power is on in thermal design.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina