Magnetic Resin Shielded Power Inductor LanTu Micro SNR8040-3R3MT for LED Backlights and Graphic Cards
Product Overview
The SNR8040 Series Magnetic Resin Shielded SMD Power Inductors by SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are automatic assembly constructed power inductors designed for high-performance applications. Featuring a magnetic-resin shielded construction, these inductors significantly reduce buzz noise to ultra-low levels. They offer large current handling capabilities with low DC resistance, a closed magnetic circuit design that minimizes leakage flux and enhances EMI resistance, and a space-saving, power-efficient profile. These inductors are widely used in LED backlights, flat-screen TVs, set-top boxes, notebooks, desktop computers, servers, graphic cards, portable gaming devices, personal navigation systems, multimedia devices, automotive products, communication equipment, and DC-DC converters. They are compliant with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR8040
- Construction: Automatic assembly, Magnetic Resin Shielded
- Certifications: RoHS, Halogen Free, REACH Compliance
- Core Material: Ferrite Core (Metallization on Ferrite Core)
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | Test Frequency (KHz) | Test Voltage (V) | Max DCR () | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH mm) | Packing |
|---|---|---|---|---|---|---|---|---|---|
| SNR8040-1R0M | 1.0 | 20% | 100 | 1.0 | 0.010 | 9.85 | 6.30 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-1R5M | 1.5 | 20% | 100 | 1.0 | 0.013 | 8.15 | 5.65 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-2R2M | 2.2 | 20% | 100 | 1.0 | 0.015 | 7.10 | 5.15 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-3R3M | 3.3 | 20% | 100 | 1.0 | 0.022 | 6.50 | 4.40 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-3R6M | 3.6 | 20% | 100 | 1.0 | 0.022 | 6.50 | 4.35 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-4R7M | 4.7 | 20% | 100 | 1.0 | 0.024 | 5.90 | 4.10 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-5R6M | 5.6 | 20% | 100 | 1.0 | 0.027 | 4.55 | 3.85 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-6R8M | 6.8 | 20% | 100 | 1.0 | 0.031 | 4.55 | 3.60 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-8R2M | 8.2 | 20% | 100 | 1.0 | 0.033 | 4.20 | 3.45 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-100M | 10 | 20% | 100 | 1.0 | 0.037 | 3.60 | 3.30 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-150M | 15 | 20% | 100 | 1.0 | 0.061 | 2.95 | 2.80 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-180M | 18 | 20% | 100 | 1.0 | 0.068 | 2.70 | 2.40 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-220M | 22 | 20% | 100 | 1.0 | 0.089 | 2.40 | 2.10 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-270M | 27 | 20% | 100 | 1.0 | 0.101 | 2.15 | 2.00 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-330M | 33 | 20% | 100 | 1.0 | 0.126 | 2.05 | 1.80 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-390M | 39 | 20% | 100 | 1.0 | 0.139 | 1.95 | 1.70 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-470M | 47 | 20% | 100 | 1.0 | 0.176 | 1.75 | 1.55 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-680M | 68 | 20% | 100 | 1.0 | 0.254 | 1.45 | 1.25 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-820M | 82 | 20% | 100 | 1.0 | 0.292 | 1.30 | 1.15 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-101M | 100 | 20% | 100 | 1.0 | 0.377 | 1.15 | 1.00 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-121M | 120 | 20% | 100 | 1.0 | 0.434 | 1.12 | 0.95 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-151M | 150 | 20% | 100 | 1.0 | 0.553 | 1.10 | 0.85 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-221M | 220 | 20% | 100 | 1.0 | 0.778 | 0.85 | 0.80 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-331M | 330 | 20% | 100 | 1.0 | 1.155 | 0.68 | 0.64 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-471M | 470 | 20% | 100 | 1.0 | 1.625 | 0.60 | 0.50 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-681M | 680 | 20% | 100 | 1.0 | 2.652 | 0.50 | 0.45 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| SNR8040-102M | 1000 | 20% | 100 | 1.0 | 3.640 | 0.40 | 0.35 | 8.08.04.0 | Tape & Reel (T) / Bulk Package (B) |
| Environmental Data: | |||||||||
| Operating Temperature: -40 to +125 (Including coils self-temperature rise) | |||||||||
| Test Equipment: | |||||||||
| Inductance: HP4284A, HP4285A LCR meter or equivalent | |||||||||
| Saturation & Temperature Rise Current: HP4284+42841A or equivalent | |||||||||
| DCR: Chroma 16502 or equivalent | |||||||||
| Recommended Land Pattern (mm): | |||||||||
| A: 8.00.3, B: 8.00.3, C: 4.0 Max, D: 4.00.3, E: 6.30.3, F: 2.2 Typ, G: 3.8 Typ, H: 7.5 Typ | |||||||||
| Inductance Tolerance Options: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | |||||||||
| Packing Options: B: Bulk Package, T: Tape & Reel | |||||||||
| Saturation Current Definition: DC current at which inductance drops 30% from its value without current. | |||||||||
| Temperature Rise Current Definition: The actual value of DC current when the temperature rise is T 40 (Ta=25). | |||||||||
| Rated DC Current: The lesser of Isat or Irms. | |||||||||
Packaging Information
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SNR8040 | 16 | 12 | 7.5 | 16.4 | 100 | 13 | 330 | 1000 | 3000 | 12,000 |
Cover Tape Peel Off Condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on sectional area of terminal (GB/T 2423.60-2008). Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force based on terminal diameter (GB/T 2423.60-2008). Pull Force applied gradually and maintained for 10 seconds. |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig, apply force (Flexure: 2mm, Speed: 0.5mm/sec, Keep time: 30 sec) (JIS C 5321:1997). |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction (GB/T 2423.7-2018). |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol (GB/T 2423.28-2005). |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Subject to simple harmonic motion (Amplitude 1.5mm, Frequency 10-55 Hz) for 2 hours in 3 mutually perpendicular directions (GB/T 2423.10-2019). |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature shock from (85~125) to (-55~40). Transforming interval: Max. 20 sec (GB/T 2423.22-2012 Method Na). |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402, Duration: 962 hours (GB/T 2423.1-2008 Method Ab). |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 85~1252, Duration: 962 hours (GB/T 2423.2-2008 Method Bb). |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours (GB/T 2423.3-2016). |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | Refer to reflow curve, undergo reflow twice. Peak temperature: 260+0/-5 (GJB 360B-2009). |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, then brush 10 times (IEC 68-2-45:1993). |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristics are normal after test. | Apply twice the rated current for 5 minutes (JIS C5311-6.13). |
| Voltage resistance test | During the test no breakdown. Characteristics are normal after test. | DC1000V, Current: 1mA, Time: 1Min (MIL-STD-202G Method 301). |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.
Usage Precautions
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Solderability may deteriorate beyond this period.
- Environment: Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands to prevent solderability issues. Handle with care to prevent damage from dropping.
- Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
- Cleaning: Do not clean products; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Always preheat components before soldering. The temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections must be within specified conditions. Overheating can cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when the device is powered on; ensure sufficient thermal design margin.
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