Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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Magnetic Resin Shielded Power Inductor LanTu Micro SNR8040-3R3MT for LED Backlights and Graphic Cards

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Product Description

Product Overview

The SNR8040 Series Magnetic Resin Shielded SMD Power Inductors by SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are automatic assembly constructed power inductors designed for high-performance applications. Featuring a magnetic-resin shielded construction, these inductors significantly reduce buzz noise to ultra-low levels. They offer large current handling capabilities with low DC resistance, a closed magnetic circuit design that minimizes leakage flux and enhances EMI resistance, and a space-saving, power-efficient profile. These inductors are widely used in LED backlights, flat-screen TVs, set-top boxes, notebooks, desktop computers, servers, graphic cards, portable gaming devices, personal navigation systems, multimedia devices, automotive products, communication equipment, and DC-DC converters. They are compliant with RoHS, Halogen Free, and REACH standards.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SNR8040
  • Construction: Automatic assembly, Magnetic Resin Shielded
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Core Material: Ferrite Core (Metallization on Ferrite Core)

Technical Specifications

Part No. Inductance (H) Inductance Tolerance Test Frequency (KHz) Test Voltage (V) Max DCR () Saturation Current (A) Max Temperature Rise Current (A) Max Dimensions (LWH mm) Packing
SNR8040-1R0M 1.0 20% 100 1.0 0.010 9.85 6.30 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-1R5M 1.5 20% 100 1.0 0.013 8.15 5.65 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-2R2M 2.2 20% 100 1.0 0.015 7.10 5.15 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-3R3M 3.3 20% 100 1.0 0.022 6.50 4.40 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-3R6M 3.6 20% 100 1.0 0.022 6.50 4.35 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-4R7M 4.7 20% 100 1.0 0.024 5.90 4.10 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-5R6M 5.6 20% 100 1.0 0.027 4.55 3.85 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-6R8M 6.8 20% 100 1.0 0.031 4.55 3.60 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-8R2M 8.2 20% 100 1.0 0.033 4.20 3.45 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-100M 10 20% 100 1.0 0.037 3.60 3.30 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-150M 15 20% 100 1.0 0.061 2.95 2.80 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-180M 18 20% 100 1.0 0.068 2.70 2.40 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-220M 22 20% 100 1.0 0.089 2.40 2.10 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-270M 27 20% 100 1.0 0.101 2.15 2.00 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-330M 33 20% 100 1.0 0.126 2.05 1.80 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-390M 39 20% 100 1.0 0.139 1.95 1.70 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-470M 47 20% 100 1.0 0.176 1.75 1.55 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-680M 68 20% 100 1.0 0.254 1.45 1.25 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-820M 82 20% 100 1.0 0.292 1.30 1.15 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-101M 100 20% 100 1.0 0.377 1.15 1.00 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-121M 120 20% 100 1.0 0.434 1.12 0.95 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-151M 150 20% 100 1.0 0.553 1.10 0.85 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-221M 220 20% 100 1.0 0.778 0.85 0.80 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-331M 330 20% 100 1.0 1.155 0.68 0.64 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-471M 470 20% 100 1.0 1.625 0.60 0.50 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-681M 680 20% 100 1.0 2.652 0.50 0.45 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
SNR8040-102M 1000 20% 100 1.0 3.640 0.40 0.35 8.08.04.0 Tape & Reel (T) / Bulk Package (B)
Environmental Data:
Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Test Equipment:
Inductance: HP4284A, HP4285A LCR meter or equivalent
Saturation & Temperature Rise Current: HP4284+42841A or equivalent
DCR: Chroma 16502 or equivalent
Recommended Land Pattern (mm):
A: 8.00.3, B: 8.00.3, C: 4.0 Max, D: 4.00.3, E: 6.30.3, F: 2.2 Typ, G: 3.8 Typ, H: 7.5 Typ
Inductance Tolerance Options: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing Options: B: Bulk Package, T: Tape & Reel
Saturation Current Definition: DC current at which inductance drops 30% from its value without current.
Temperature Rise Current Definition: The actual value of DC current when the temperature rise is T 40 (Ta=25).
Rated DC Current: The lesser of Isat or Irms.

Packaging Information

Part No. Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) Reel (PCS) Inside Box (PCS) Outside Carton (PCS)
SNR8040 16 12 7.5 16.4 100 13 330 1000 3000 12,000

Cover Tape Peel Off Condition:

  • Cover tape peel force: 10 to 120g
  • Noodle strip peeling angle: 165 to 180

Reliability Testing

Item Requirements Test Methods and Remarks
Terminal Strength (SMT) Meet requirements without any loose terminal. Pulling test based on sectional area of terminal (GB/T 2423.60-2008). Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s.
Terminal Strength (DIP) Meet requirements without any loose terminal. Applied force based on terminal diameter (GB/T 2423.60-2008). Pull Force applied gradually and maintained for 10 seconds.
Resistance to Flexure No visible mechanical damage. Solder to test jig, apply force (Flexure: 2mm, Speed: 0.5mm/sec, Keep time: 30 sec) (JIS C 5321:1997).
Dropping No case deformation or change in appearance. No short and no open. Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction (GB/T 2423.7-2018).
Solderability Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol (GB/T 2423.28-2005).
Vibration No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Subject to simple harmonic motion (Amplitude 1.5mm, Frequency 10-55 Hz) for 2 hours in 3 mutually perpendicular directions (GB/T 2423.10-2019).
Thermal Shock No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. 100 cycles of temperature shock from (85~125) to (-55~40). Transforming interval: Max. 20 sec (GB/T 2423.22-2012 Method Na).
Low temperature Storage No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Temperature: -55~-402, Duration: 962 hours (GB/T 2423.1-2008 Method Ab).
High temperature Storage No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Temperature: 85~1252, Duration: 962 hours (GB/T 2423.2-2008 Method Bb).
Damp Heat (Steady States) No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours (GB/T 2423.3-2016).
Heat endurance of Reflow soldering No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. Refer to reflow curve, undergo reflow twice. Peak temperature: 260+0/-5 (GJB 360B-2009).
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. Dip parts into IPA solvent for 50.5Min, dry for 5Min, then brush 10 times (IEC 68-2-45:1993).
Overload test During the test no smoke, no peculiar smell, no fire. Characteristics are normal after test. Apply twice the rated current for 5 minutes (JIS C5311-6.13).
Voltage resistance test During the test no breakdown. Characteristics are normal after test. DC1000V, Current: 1mA, Time: 1Min (MIL-STD-202G Method 301).

Recommended Reflow Soldering Curve

The recommended reflow conditions are set according to the soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.

Usage Precautions

  • Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Solderability may deteriorate beyond this period.
  • Environment: Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals by bare hands to prevent solderability issues. Handle with care to prevent damage from dropping.
  • Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
  • Cleaning: Do not clean products; contact the manufacturer if cleaning is necessary.
  • Magnetic Fields: Do not expose products to magnets or magnetic fields.
  • Preheating: Always preheat components before soldering. The temperature difference between solder and chip should not exceed 150C.
  • Soldering Corrections: Post-mounting soldering corrections must be within specified conditions. Overheating can cause short circuits, performance degradation, or reduced lifespan.
  • Thermal Design: Account for self-heating when the device is powered on; ensure sufficient thermal design margin.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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