LanTu Micro SNR5030-2R2NT SMD Power Inductor Featuring Magnetic Resin Shielding for Noise Reduction
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Product Description
Product Overview
The SNR5030 Series Magnetic Resin Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are automatic assembly constructed power inductors featuring magnetic resin shielding. This design significantly reduces buzz noise to ultra-low levels and offers a closed magnetic circuit for reduced leakage flux and enhanced EMI resistance. They are designed for large current handling with low DCR, space-saving PCB footprints, and power efficiency. These inductors are suitable for a wide range of applications including LED backlights, flat-screen TVs, notebooks, servers, automotive products, and DC-DC converters.
Product Attributes
- Brand: LANTU MICRO ELECTRIC
- Series: SNR5030
- Construction: Magnetic Resin Shielded SMD
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: SHENZHEN, China
Technical Specifications
| Part No. | Inductance (H) | Tolerance | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH mm) |
|---|---|---|---|---|---|---|---|
| SNR5030-1R0M | 1.0 | 20% | 0.016 | 0.020 | 7.00 | 4.00 | 5.05.03.0 |
| SNR5030-1R5N | 1.5 | 30% | 0.019 | 0.024 | 5.50 | 3.60 | 5.05.03.0 |
| SNR5030-2R2N | 2.2 | 30% | 0.025 | 0.031 | 4.50 | 3.20 | 5.05.03.0 |
| SNR5030-3R3N | 3.3 | 30% | 0.032 | 0.039 | 4.00 | 2.80 | 5.05.03.0 |
| SNR5030-4R7M | 4.7 | 20% | 0.052 | 0.065 | 3.00 | 2.20 | 5.05.03.0 |
| SNR5030-5R6N | 5.6 | 30% | 0.056 | 0.070 | 3.00 | 2.10 | 5.05.03.0 |
| SNR5030-6R8M | 6.8 | 20% | 0.060 | 0.075 | 2.80 | 2.00 | 5.05.03.0 |
| SNR5030-100M | 10 | 20% | 0.080 | 0.100 | 2.10 | 1.80 | 5.05.03.0 |
| SNR5030-150M | 15 | 20% | 0.125 | 0.156 | 1.70 | 1.40 | 5.05.03.0 |
| SNR5030-220M | 22 | 20% | 0.210 | 0.260 | 1.60 | 1.10 | 5.05.03.0 |
| SNR5030-330M | 33 | 20% | 0.330 | 0.410 | 1.20 | 0.85 | 5.05.03.0 |
| SNR5030-470M | 47 | 20% | 0.375 | 0.468 | 0.90 | 0.80 | 5.05.03.0 |
| SNR5030-101M | 100 | 20% | 0.800 | 0.988 | 0.75 | 0.56 | 5.05.03.0 |
| SNR5030-151M | 150 | 20% | 1.180 | 1.470 | 0.55 | 0.46 | 5.05.03.0 |
| SNR5030-221M | 220 | 20% | 1.700 | 2.080 | 0.45 | 0.39 | 5.05.03.0 |
| SNR5030-331M | 330 | 20% | 2.800 | 3.500 | 0.35 | 0.30 | 5.05.03.0 |
| SNR5030-471M | 470 | 20% | 3.800 | 4.700 | 0.30 | 0.26 | 5.05.03.0 |
| SNR5030-102M | 1000 | 20% | 8.700 | 10.800 | 0.20 | 0.17 | 5.05.03.0 |
| Inductance Tolerance Code | Description |
|---|---|
| J | 5% |
| K | 10% |
| L | 15% |
| M | 20% |
| P | 25% |
| N | 30% |
| Packing Code | Description |
|---|---|
| B | Bulk Package |
| T | Tape & Reel |
| Environmental Data | Value |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Test Equipment | Instrument |
|---|---|
| Inductance (L) | HP4284A, HP4285A LCR meter or equivalent |
| Current (Isat & Irms) | HP4284+42841A or equivalent |
| DC Resistance (DCR) | Chroma 16502 or equivalent |
| Shape and Dimensions (mm) | A | B | C (Max) | D | E | F (Typ) | G (Typ) | H (Typ) |
|---|---|---|---|---|---|---|---|---|
| SNR5030 | 5.00.3 | 5.00.3 | 3.0 | 2.50.2 | 4.00.2 | 1.4 | 2.3 | 4.2 |
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | GB/T 2423.60-2008. Pulling test based on terminal sectional area. Solder the inductor using lead-free solder. Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | GB/T 2423.60-2008. Pulling test based on terminal diameter. Pull Force applied gradually and maintained for 10 seconds. |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997. Solder inductor to test jig, apply force in specified direction. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | GB/T 2423.7-2018. Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | GB/T 2423.28-2005. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019. Solder inductor to jig, subjected to simple harmonic motion (10 to 55 Hz). Applied for 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na. 100 cycles of temperature cycling between high (85~125) and low (-55~40). Transforming interval: Max. 20 sec. |
| Low temperature Storage | Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab. Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb. Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.3-2016. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | L/L10%. Q/Q30% (SMD series only). DCR/DCR10%. | GJB 360B-2009. Subject to reflow conditions twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993. Dip parts into IPA solvent for 50.5Min, dry for 5Min, then brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristic is normal after test. | JIS C5311-6.13. Apply twice the rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. Characteristic is normal after test. | MIL-STD-202G Method 301. For parts with two coils: DC1000V, Current: 1mA, Time: 1Min. |
Usage Precautions
- Storage period is within 12 months. Store under conditions: temperature 5~40C, humidity 35~65% RH or less.
- Do not use or store in environments with gas corrosion (salt, acid, alkali, etc.).
- Avoid direct contact with terminals by bare hands to prevent reduced solderability.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals with excessive stress to avoid wire fracture.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering. The temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Allow for sufficient thermal design margin as components self-heat when powered on.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina