High Current Magnetic Resin Shielded LanTu Micro SNR4020-330MT Power Inductor for Server Electronics
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MOQ:
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Delivery Time:
Negotiable
Product Description
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SNR4020 Series are automatic assembly, magnetic resin shielded SMD power inductors designed for high-current, low-DCR applications. Featuring a closed magnetic circuit design, they significantly reduce leakage flux and EMI, while the magnetic-resin shielding minimizes buzz noise. These inductors are durable, space-saving, and power-efficient, making them suitable for a wide range of electronic devices including LED backlights, flat-screen TVs, notebooks, servers, automotive products, and DC-DC converters. They comply with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR4020
- Construction: Magnetic Resin Shielded
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | L @ 100KHz, 1.0V (H) | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH) (mm) |
|---|---|---|---|---|---|---|---|---|
| SNR4020-R47M | 0.47 | 20% | 0.47 | 0.022 | 0.029 | 7.00 | 3.30 | 4.04.02.0 |
| SNR4020-1R0M | 1.0 | 20% | 1.0 | 0.029 | 0.038 | 4.78 | 2.15 | 4.04.02.0 |
| SNR4020-1R5M | 1.5 | 20% | 1.5 | 0.035 | 0.045 | 4.45 | 2.15 | 4.04.02.0 |
| SNR4020-2R2M | 2.2 | 20% | 2.2 | 0.035 | 0.046 | 3.40 | 1.85 | 4.04.02.0 |
| SNR4020-3R3M | 3.3 | 20% | 3.3 | 0.070 | 0.091 | 3.20 | 1.40 | 4.04.02.0 |
| SNR4020-4R7M | 4.7 | 20% | 4.7 | 0.075 | 0.098 | 2.35 | 1.34 | 4.04.02.0 |
| SNR4020-6R8M | 6.8 | 20% | 6.8 | 0.125 | 0.163 | 2.20 | 1.04 | 4.04.02.0 |
| SNR4020-8R2M | 8.2 | 20% | 8.2 | 0.148 | 0.185 | 1.75 | 1.00 | 4.04.02.0 |
| SNR4020-100M | 10 | 20% | 10 | 0.165 | 0.215 | 1.60 | 0.90 | 4.04.02.0 |
| SNR4020-150M | 15 | 20% | 15 | 0.230 | 0.300 | 1.35 | 0.77 | 4.04.02.0 |
| SNR4020-220M | 22 | 20% | 22 | 0.350 | 0.455 | 1.05 | 0.62 | 4.04.02.0 |
| SNR4020-330M | 33 | 20% | 33 | 0.550 | 0.710 | 0.85 | 0.49 | 4.04.02.0 |
| SNR4020-470M | 47 | 20% | 47 | 0.710 | 0.920 | 0.74 | 0.44 | 4.04.02.0 |
| SNR4020-680M | 68 | 20% | 68 | 1.060 | 1.380 | 0.60 | 0.36 | 4.04.02.0 |
| Inductance Tolerance Codes | Packing Codes |
|---|---|
| J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | B: Bulk Package, T: Tape & Reel |
| Environmental Data | Operating Temperature |
|---|---|
| -40 to +125 (Including coils self-temperature rise) | -40 to +125 |
| Shape and Dimensions (mm) | A | B | C (Max) | D | E | F (Typ) | G (Typ) | H (Typ) |
|---|---|---|---|---|---|---|---|---|
| SNR4020 | 4.00.3 | 4.00.3 | 2.0 | 2.10.2 | 3.30.2 | 1.1 | 1.9 | 3.7 |
Reliability Testing Summary
- Terminal Strength: Withstands specified pulling forces based on terminal cross-sectional area.
- Resistance to Flexure: No visible mechanical damage after flexure test.
- Dropping: No case deformation, change in appearance, short, or open after dropping packaged products.
- Solderability: Over 75% wetting coverage, 95% minimum solder coverage on terminals.
- Vibration: No visible mechanical damage; inductance change within 10%; Q factor change within 20%.
- Thermal Shock: No visible mechanical damage; inductance change within 10% (Mn-Zn: 30%); Q factor change within 20%.
- Low Temperature Storage: No visible mechanical damage; inductance change within 10% (Mn-Zn: 30%); Q factor change within 20%.
- High Temperature Storage: No visible mechanical damage; inductance change within 10% (Mn-Zn: 30%); Q factor change within 20%.
- Damp Heat (Steady States): No visible mechanical damage; inductance change within 10% (Mn-Zn: 30%); Q factor change within 20%.
- Heat endurance of Reflow soldering: No significant defects; L/L 10% (Mn-Zn: 30%); Q/Q 30%; DCR/DCR 10%.
- Resistance to solvent test: No case deformation, change in appearance, or obliteration of marking after IPA solvent exposure.
- Overload test: No smoke, peculiar smell, or fire during test; characteristics normal after test.
- Voltage resistance test: No breakdown during test; characteristics normal after test.
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Users should adjust and confirm conditions based on their specific equipment and process.
Reminders for Using These Products
- Storage period is within 12 months under conditions: 5-40C, 35-65% RH.
- Avoid use and storage in corrosive gas environments.
- Do not touch terminals directly with bare hands.
- Handle products carefully to prevent damage.
- Do not bend terminals excessively.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Keep away from magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions.
- Allow sufficient thermal design margin for self-heating during operation.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina