SMD Power Inductor LanTu Micro SNR5040-330MT with Magnetic Resin Shielding and High Shock Resistance

Product Overview

The SNR5040 Series are automatic assembly constructed, magnetic resin shielded SMD power inductors designed for high-current, low DCR applications. These inductors feature a closed magnetic circuit design that minimizes leakage flux and enhances EMI resistance. The magnetic-resin shielded construction significantly reduces buzz noise to ultra-low levels, making them suitable for space-constrained and power-efficient designs. They are widely used in LED backlights, flat-screen TVs, set-top boxes, notebooks, desktops, servers, graphics cards, portable gaming devices, personal navigation systems, multimedia devices, automotive systems, telecommunication base stations, and DC-DC converters. The metallization on the ferrite core provides excellent shock resistance and durability.

Product Attributes

• Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Series: SNR5040 Series
• Construction: Magnetic Resin Shielded SMD Power Inductor
• Certifications: RoHS, Halogen Free, REACH Compliance
• Type: Shielded SMD Power Inductors
• Magnetic Circuit: Closed Magnetic Circuit Design
• Shielding: Magnetic Resin Shielded

Technical Specifications

Environmental Data:

• Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment:

• Inductance (L): HP4284A, HP4285A LCR meter or equivalent
• Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
• DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification:

SNR 5040 [Inductance Code] [Tolerance Code] [Packing Code]

• Type: SNR (Shielded SMD Power Inductors)
• External Dimensions (LWH): 5040 (5.04.04.0 mm)
• Inductance: e.g., 470 (47 uH)
• Tolerance Code: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
• Packing Code: B (Bulk Package), T (Tape & Reel)

Shape and Dimensions:

Specifications:

Notes on Specifications:

• Saturation Current: DC current at which inductance drops 30% from its value without current.
• Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
• Rated DC Current: The lesser value of Isat or Irms.
• Special Reminder: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

Packaging:

Cover Tape Peel Off Condition:

• Cover tape peel force shall be 10 to 120g.
• Noodle strip peeling angle 165 to 180.

Reliability Testing:

Recommended Reflow Soldering Curve:

The recommended reflow conditions are set according to typical soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.

Reminders for Using These Products:

• Storage: Within 12 months, temperature: 5~40C, humidity: 35~65% RH or less. Soldering of terminal electrodes may deteriorate if storage period elapses.
• Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
• Handling: Avoid touching electrodes directly with bare hands due to oil secretions. Handle products carefully to prevent damage from dropping or inappropriate removal.
• Terminals: Do not bend terminals with excessive stress to avoid wire fracture.
• Cleaning: Do not rinse coils. Contact SXN if cleaning is necessary.
• Magnetic Fields: Do not expose products to magnets or strong magnetic fields.
• Preheating: Preheat components before soldering. Temperature difference between solder and chip temperature should not exceed 150C.
• Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or lifespan reduction.
• Self Heating: Devices generate heat when energized; ensure sufficient thermal design margin.
• Non-Magnetic Shield Type: Carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.