SMD Power Inductors LanTu Micro SNR4030-1R0MT with Metallized Ferrite Core and Strong EMI Resistance
Product Overview
The SNR4030 Series Magnetic Resin Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are automatic assembly compatible power inductors featuring magnetic resin shielding for ultra-low buzz noise. They offer large current handling capabilities with low DC resistance, a closed magnetic circuit design for reduced leakage flux and strong EMI resistance, and metallization on the ferrite core for excellent shock resistance and durability. These space-saving and power-efficient inductors are suitable for a wide range of applications including LED backlights, flat-screen TVs, notebooks, servers, graphics cards, automotive products, and DC-DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR4030
- Type: Magnetic Resin Shielded SMD Power Inductors
- Construction: Automatic assembly, Magnetic-resin shielded
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | Test Frequency (Hz) | Test Voltage (V) | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|---|---|
| SNR4030-1R0M | 1.0 | 20% | 100KHz | 1.0V | 0.014 | 0.018 | 5.26 | 4.15 |
| SNR4030-1R2M | 1.2 | 20% | 100KHz | 1.0V | 0.015 | 0.020 | 5.26 | 3.82 |
| SNR4030-1R5M | 1.5 | 20% | 100KHz | 1.0V | 0.020 | 0.026 | 4.84 | 3.34 |
| SNR4030-1R8M | 1.8 | 20% | 100KHz | 1.0V | 0.025 | 0.033 | 4.84 | 3.20 |
| SNR4030-2R2M | 2.2 | 20% | 100KHz | 1.0V | 0.030 | 0.039 | 4.40 | 2.95 |
| SNR4030-3R3M | 3.3 | 20% | 100KHz | 1.0V | 0.040 | 0.050 | 3.30 | 2.40 |
| SNR4030-4R7M | 4.7 | 20% | 100KHz | 1.0V | 0.060 | 0.076 | 2.90 | 2.00 |
| SNR4030-5R6M | 5.6 | 20% | 100KHz | 1.0V | 0.073 | 0.091 | 2.75 | 1.90 |
| SNR4030-6R8M | 6.8 | 20% | 100KHz | 1.0V | 0.090 | 0.115 | 2.60 | 1.60 |
| SNR4030-8R2M | 8.2 | 20% | 100KHz | 1.0V | 0.095 | 0.122 | 2.10 | 1.60 |
| SNR4030-100M | 10 | 20% | 100KHz | 1.0V | 0.100 | 0.130 | 1.95 | 1.50 |
| SNR4030-120M | 12 | 20% | 100KHz | 1.0V | 0.135 | 0.172 | 1.70 | 1.30 |
| SNR4030-150M | 15 | 20% | 100KHz | 1.0V | 0.190 | 0.230 | 1.65 | 1.11 |
| SNR4030-220M | 22 | 20% | 100KHz | 1.0V | 0.225 | 0.290 | 1.30 | 1.00 |
| SNR4030-330M | 33 | 20% | 100KHz | 1.0V | 0.330 | 0.420 | 1.10 | 0.84 |
| SNR4030-470M | 47 | 20% | 100KHz | 1.0V | 0.445 | 0.570 | 0.95 | 0.72 |
| SNR4030-680M | 68 | 20% | 100KHz | 1.0V | 0.868 | 1.100 | 0.72 | 0.52 |
| SNR4030-820M | 82 | 20% | 100KHz | 1.0V | 1.060 | 1.280 | 0.66 | 0.47 |
| SNR4030-101M | 100 | 20% | 100KHz | 1.0V | 1.150 | 1.480 | 0.60 | 0.45 |
| SNR4030-121M | 120 | 20% | 100KHz | 1.0V | 1.350 | 1.700 | 0.55 | 0.42 |
Inductance Tolerance Codes: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing Codes: B: Bulk Package, T: Tape & Reel
Dimensions
| Part No. | Dimensions (LWH) (mm) | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) | G (mm) | H (mm) |
|---|---|---|---|---|---|---|---|---|---|
| SNR4030 | 4.04.03.0 | 4.00.3 | 4.00.3 | 3.0 Max | 2.10.2 | 3.30.2 | 1.1 Typ | 1.9 Typ | 3.7 Typ |
Environmental Data
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Test Equipment
- Inductance (L): HP4284A, HP4285A LCR meter or equivalent
- Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Packaging Specifications
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SNR4030 | 12 | 8 | 5.5 | 12.4 | 100 | 13 | 330 | 2000 | 8000 | 32,000 |
Reliability Testing
Terminal Strength: Tested per GB/T 2423.60-2008 (SMT & DIP variations). Requirements vary based on terminal cross-sectional area or diameter.
Resistance to Flexure: Tested per JIS C 5321:1997. No visible mechanical damage required after flexure test.
Dropping: Tested per GB/T 2423.7-2018. No case deformation, change in appearance, short, or open circuits required after dropping packaged products.
Solderability: Tested per GB/T 2423.28-2005. Requires 95% minimum solder coverage on terminals.
Vibration: Tested per GB/T 2423.10-2019. Inductance change within 10%, Q factor change within 20% required.
Thermal Shock: Tested per GB/T 2423.22-2012 Method Na. Inductance change within 10% (Mn-Zn: 30%), Q factor change within 20% required.
Low Temperature Storage: Tested per GB/T 2423.1-2008 Method Ab. Inductance change within 10% (Mn-Zn: 30%), Q factor change within 20% required.
High Temperature Storage: Tested per GB/T 2423.2-2008 Method Bb. Inductance change within 10% (Mn-Zn: 30%), Q factor change within 20% required.
Damp Heat (Steady States): Tested per GB/T 2423.3-2016. Inductance change within 10% (Mn-Zn: 30%), Q factor change within 20% required.
Heat endurance of Reflow soldering: Tested per GJB 360B-2009. L/L 10% (Mn-Zn: 30%), Q/Q 30%, DCR/DCR 10% required.
Resistance to solvent test: Tested per IEC 68-2-45:1993. No case deformation or change in appearance required.
Overload test: Tested per JIS C5311-6.13. No smoke, peculiar smell, or fire during test. Characteristics normal after test.
Voltage resistance test: Tested per MIL-STD-202G Method 301. No breakdown during test. Characteristics normal after test.
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Adjustments may be necessary based on specific user equipment and process conditions.
Reminders for Using These Products
- Storage period is within 12 months under conditions of 5~40C and 35-65% RH.
- Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
- Do not touch terminals directly with bare hands due to oil secretions that may inhibit soldering.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals with excessive stress to avoid wire fracture.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; ensure the temperature difference between solder and chip does not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance degradation, or lifespan reduction.
- Allow for sufficient thermal design due to self-heating when power is ON.
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