LanTu Micro SMS0630 100MT molding SMD power inductors engineered for low noise and power conversion
Molding SMD Power Inductors - SMS0630 Series
Product Overview
The SMS0630 Series by SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers ultra-high current, thin-profile SMD power inductors designed for high-density installations. These magnetically shielded inductors provide strong anti-electromagnetic interference capabilities and high reliability due to their integral construction, ensuring excellent vibration resistance. Featuring composite construction for ultra-low buzz noise and die-casting with low-loss alloy powder for low impedance and minimal parasitic capacitance, these inductors achieve high efficiency and support frequencies up to 3MHz. They are ideal for applications requiring low DC resistance and low core eddy-current loss, with an absolute maximum voltage of 30VDC and RoHS, Halogen-Free, and REACH compliance.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Type: Molding SMD Power Inductor
- Series: SMS0630
- Certifications: RoHS, Halogen Free, REACH Compliance
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Environmental Data
- Operating Temperature: -55 to +125 (Including coils self-temperature rise)
Technical Specifications
Electrical Characteristics (at 25)
| Part No | Inductance (H) @0A | Tol | DCR (m) Typical | Saturation Current Typical (A) | Heat Rating Current Typical (A) |
|---|---|---|---|---|---|
| SMS0630-R10M | 0.10 | 20% | 1.40 | 60.00 | 32.00 |
| SMS0630-R15M | 0.15 | 20% | 1.55 | 41.00 | 30.00 |
| SMS0630-R22M | 0.22 | 20% | 1.60 | 35.00 | 25.00 |
| SMS0630-R47M | 0.47 | 20% | 4.00 | 20.00 | 18.00 |
| SMS0630-R68M | 0.68 | 20% | 4.75 | 19.00 | 16.00 |
| SMS0630-1R0M | 1.0 | 20% | 7.60 | 16.00 | 13.00 |
| SMS0630-1R5M | 1.5 | 20% | 13.20 | 14.00 | 12.50 |
| SMS0630-2R2M | 2.2 | 20% | 16.50 | 11.50 | 8.50 |
| SMS0630-3R3M | 3.3 | 20% | 24.50 | 9.50 | 7.00 |
| SMS0630-4R7M | 4.7 | 20% | 35.00 | 6.55 | 6.00 |
| SMS0630-5R6M | 5.6 | 20% | 36.00 | 6.35 | 5.70 |
| SMS0630-6R8M | 6.8 | 20% | 44.30 | 6.00 | 5.10 |
| SMS0630-8R2M | 8.2 | 20% | 60.00 | 6.00 | 5.00 |
| SMS0630-100M | 10 | 20% | 64.50 | 5.50 | 4.50 |
| SMS0630-150M | 15 | 20% | 103.00 | 4.50 | 3.10 |
| SMS0630-220M | 22 | 20% | 180.00 | 3.50 | 2.60 |
| SMS0630-330M | 33 | 20% | 250.00 | 3.00 | 2.00 |
| SMS0630-470M | 47 | 20% | 310.00 | 2.00 | 1.50 |
Shape and Dimensions (mm)
| Part No | A | B | C (Max) | D (Typ) | E (Typ) | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SMS0630 | 7.100.30 | 6.600.20 | 3.00 | 3.00 | 1.60 | 3.70 | 8.40 | 3.50 |
Inductance Tolerance
J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing
- Bulk Package
- Tape & Reel
Current Definitions
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
Packaging Specifications (Tape and Reel)
| Part No | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS0630 | 16.0 | 12.0 | 7.5 | 16.4 | 100 | 13 | 330 | 1000 | 3000 | 12,000 |
Cover Tape Peel Off Condition
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing Summary
Testing includes Terminal Strength (SMT & DIP), Resistance to Flexure, Dropping, Solderability, Vibration, Thermal Shock, Low Temperature Storage, High Temperature Storage, Damp Heat (Steady States), Heat endurance of Reflow soldering, Resistance to solvent, Overload, and Voltage resistance tests. Specific requirements and test methods are detailed in the original documentation.
Recommended Reflow Soldering Curve
Users should adjust and confirm reflow conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, at 5~40C and 35~65% RH. Soldering may deteriorate beyond this period.
- Environment: Avoid gas corrosive environments (salt, acid, alkali).
- Handling: Avoid direct contact with terminals due to hand oils. Handle carefully to prevent damage.
- Bending: Do not excessively bend terminals to prevent wire fracture.
- Cleaning: Do not clean the product; contact the manufacturer if cleaning is necessary.
- Magnets: Keep away from magnets or magnetic fields.
- Preheating: Preheat before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform within specified conditions to avoid short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is on.
- Layout: For non-magnetic shield types, carefully consider coil placement on the PCB to prevent malfunction due to electromagnetic interference.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.