Wide Range Inductance LanTu Micro SSD1306-330MT Unshielded SMD Power Inductors for Surface Mount Equipment

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Product Description

Product Overview

The LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SSD1306 Series Unshielded SMD Power Inductors are designed for high power applications, featuring high saturation and low DC resistance. These unshielded inductors are suitable for surface mounting equipment and offer a wide range of inductance values and package sizes. They comply with RoHS, Halogen Free, and REACH standards, making them ideal for use in power supplies for VTRs, LCD televisions, DC/DC converters, and various home appliances.

Product Attributes

Brand: LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
Series: SSD1306
Type: Unshielded SMD Power Inductors
Certifications: RoHS, Halogen Free, REACH Compliance
Origin: Shenzhen, China

Technical Specifications

General Specifications:

Item	Description
Operating Temperature	-40 to +125 (Including coils self-temperature rise)
Package Size (LWH)	18.5415.24x7.11 mm
Inductance Tolerance	J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing	Bulk Package (B), Tape & Reel (T)

Electrical Characteristics:

Part No.	Inductance (H) @ 0A	Tolerance	Test Freq.	SRF (MHz) Typ	DCR () Max	Saturation Current (A) Max	Temperature Rise Current (A) Max
SSD1306-1R0M	1.0	20%	100KHz	80	0.009	20.00	8.60
SSD1306-2R2M	2.2	20%	100KHz	80	0.014	16.00	7.10
SSD1306-3R3M	3.3	20%	100KHz	60	0.018	14.00	6.20
SSD1306-5R6M	5.6	20%	100KHz	40	0.020	12.00	5.30
SSD1306-100M	10	20%	100KHz	30	0.031	10.00	4.30
SSD1306-150M	15	20%	100KHz	22	0.036	8.00	4.00
SSD1306-220M	22	20%	100KHz	20	0.047	7.00	3.50
SSD1306-330M	33	20%	100KHz	15	0.066	5.50	3.00
SSD1306-470M	47	20%	100KHz	9	0.086	4.50	2.60
SSD1306-680M	68	20%	100KHz	8	0.130	4.00	2.30
SSD1306-101M	100	20%	100KHz	7	0.190	3.00	1.80
SSD1306-151M	150	20%	100KHz	6	0.250	2.60	1.50
SSD1306-221M	220	20%	100KHz	5	0.380	2.40	1.20
SSD1306-331M	330	20%	100KHz	4	0.560	1.90	1.00
SSD1306-471M	470	20%	100KHz	3	0.850	1.40	0.82
SSD1306-681M	680	20%	100KHz	2.5	1.100	1.20	0.72
SSD1306-102M	1000	20%	100KHz	2	1.800	1.00	0.56

Test Equipment:

Inductance: HP4284A, HP4285A LCR meter or equivalent
Saturation & Temperature Rise Current: HP4284+42841A or equivalent
SRF: Agilent E4991A or equivalent
DCR: Chroma 16502 or equivalent

Definitions:

Saturation Current: DC current at which inductance drops 10% from its value without current.
Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
Rated DC Current: The lesser value of Isat or Irms.

Dimensions (mm):

Part No.	A (Max)	B (Max)	C (Max)	D	E	F	H	I (Max)	J
SSD1306	18.54	15.24	7.11	7.11	2.54	2.54	2.79	2.92	12.45

Recommended Land Pattern:

[Image placeholder for Recommended Land Pattern]

Packaging:

Part No.	Tape Dimension W (mm)	Tape Dimension P (mm)	Tape Dimension W1 (mm)	Reel Dimensions A (mm)	Reel Dimensions B (mm)	Reel Dimensions C (mm)	Reel Dimensions D (mm)	REEL (PCS)	Inside Box (PCS)	Outside Carton (PCS)
SSD1306	32	20	14.2	32.4	100	13	330	250	500	2000

Tape and Reel Specifications:

Cover tape peel force: 10 to 120g
Noodle strip peeling angle: 165 to 180

Reliability Testing:

Item	Requirements	Test Methods and Remarks
Terminal Strength (SMT)	Meet requirements without loose terminal.	Pulling test based on sectional area; Solder paste thickness: 0.12mm; Force application: gradual to maintained.
Terminal Strength (DIP)	Meet requirements without loose terminal.	Applied force based on terminal diameter. Keep time: 10 sec.
Resistance to Flexure	No visible mechanical damage.	Flexure: 2mm; Pressurizing Speed: 0.5mm/sec; Keep time: 30 sec.
Dropping	No case deformation or change in appearance; No short and no open.	Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction.
Solderability	Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage.	Solder temperature: 2402; Duration: 3 sec; Solder: Sn/3.0Ag/0.5Cu; Flux: 25% Resin and 75% ethanol.
Vibration	No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%.	Frequency varied between 10 and 55 Hz; Applied for 2 hours in each of 3 mutually perpendicular directions.
Thermal Shock	No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%.	100 cycles of temperature extremes (-55~40 to 85~125); Transforming interval: Max. 20 sec.
Low temperature Storage	No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%.	Temperature: -55~-402; Duration: 962 hours.
High temperature Storage	No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%.	Temperature: 125~852; Duration: 962 hours.
Damp Heat (Steady States)	No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%.	Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours.
Heat endurance of Reflow soldering	No significant defects in appearance; L/L10%; Q/Q30%; DCR/DCR10%.	Refer to reflow curve, performed twice; Peak temperature: 260+0/-5.
Resistance to solvent test	No case deformation or change in appearance or obliteration of marking.	Dip in IPA solvent for 50.5Min, dry for 5Min, brushing 10 times.
Overload test	During test no smoke, no peculiar smell, no fire; Characteristics normal after test.	Apply twice rated current for 5 minutes (twice).
Voltage resistance test	During test no breakdown; Characteristics normal after test.	DC1000V, Current: 1mA, Time: 1Min.

Recommended Reflow Soldering Curve:

[Image placeholder for Recommended Reflow Soldering Curve]

Reminders for Using These Products:

Storage period is within 12 months under conditions (temperature: 5~40C, humidity: 35 to 65% RH or less).
Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability.
Handle products carefully to prevent damage from dropping or improper removal.
Do not bend terminals with excessive stress to avoid wire fracture.
Do not rinse coils; contact the manufacturer if cleaning is necessary.
Do not expose products to magnets or magnetic fields.
Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
Soldering corrections after mounting should be within specified conditions; overheating may cause short circuits, performance degradation, or reduced lifespan.
Allow sufficient thermal design margin for self-heating when power is ON.
For non-magnetic shield types, carefully lay out the coil on the PCB to prevent malfunctions due to magnetic interference.