Shielded SMD Power Inductors featuring LanTu Micro SDRI74-220MT ideal for power supply applications and DC DC converters
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Shielded SMD Power Inductors - SDRI74 Series
Product Overview
The SDRI74 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power supply applications. Featuring a closed magnetic circuit for reduced leakage, high saturation current, and low DC resistance, these inductors are ideal for automatic mounting due to their high-precision dimensions. They are available in various package sizes and a wide inductance range, complying with RoHS, Halogen Free, and REACH standards. Applications include power supplies for VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Origin: SHENZHEN, China
- Series: SDRI74 Series
- Certifications: RoHS, Halogen Free, REACH Compliance
- Magnetic Circuit Design: Closed magnetic circuit
- Mounting Type: SMD (Surface Mount Device)
- Packaging Options: Bulk Package (B), Tape & Reel (T)
Technical Specifications
General Specifications:
| Item | Specification | Details |
|---|---|---|
| Operating Temperature | -55 to +125 | (Including coils self-temperature rise) |
| External Dimensions (LWH) | 7.57.54.5 mm | (Model SDRI74) |
| Inductance Tolerance | J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | |
| Test Equipment | LCR Meters, Power Meters, Resistance Meters | (e.g., HP4284A, HP4285A, Chroma 16502) |
Electrical Characteristics:
| Part No. | Inductance (H) @ 0A | Tolerance | Test Freq (L) | Q Factor Min @ Test Freq | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|---|
| SDRI74-2R2N | 2.2 | 30% | 100KHz | 30 @ 1MHz | 0.0147 | 5.20 | 5.00 |
| SDRI74-3R3N | 3.3 | 30% | 100KHz | 30 @ 1MHz | 0.0214 | 4.60 | 4.00 |
| SDRI74-4R7N | 4.7 | 30% | 100KHz | 30 @ 1MHz | 0.0310 | 3.80 | 3.40 |
| SDRI74-6R8N | 6.8 | 30% | 100KHz | 30 @ 1MHz | 0.035 | 3.20 | 2.30 |
| SDRI74-8R2N | 8.2 | 30% | 100KHz | 30 @ 1MHz | 0.042 | 3.00 | 2.10 |
| SDRI74-100N | 10 | 30% | 100KHz | 35 @ 1MHz | 0.049 | 2.95 | 1.84 |
| SDRI74-120M | 12 | 20% | 100KHz | 35 @ 1MHz | 0.058 | 2.85 | 1.71 |
| SDRI74-150M | 15 | 20% | 100KHz | 35 @ 1MHz | 0.081 | 2.80 | 1.47 |
| SDRI74-180M | 18 | 20% | 100KHz | 35 @ 1MHz | 0.091 | 2.50 | 1.31 |
| SDRI74-220M | 22 | 20% | 100KHz | 35 @ 1MHz | 0.110 | 2.10 | 1.23 |
| SDRI74-270M | 27 | 20% | 100KHz | 35 @ 1MHz | 0.150 | 1.90 | 1.12 |
| SDRI74-330M | 33 | 20% | 100KHz | 35 @ 1MHz | 0.170 | 1.80 | 0.96 |
| SDRI74-390M | 39 | 20% | 100KHz | 35 @ 1MHz | 0.230 | 1.70 | 0.91 |
| SDRI74-470M | 47 | 20% | 100KHz | 35 @ 1MHz | 0.260 | 1.50 | 0.88 |
| SDRI74-560M | 56 | 20% | 100KHz | 35 @ 1MHz | 0.350 | 1.32 | 0.75 |
| SDRI74-680M | 68 | 20% | 100KHz | 35 @ 1MHz | 0.380 | 1.08 | 0.69 |
| SDRI74-820M | 82 | 20% | 100KHz | 35 @ 1MHz | 0.430 | 1.05 | 0.61 |
| SDRI74-101M | 100 | 20% | 100KHz | 40 @ 0.796MHz | 0.610 | 1.02 | 0.60 |
| SDRI74-121M | 120 | 20% | 100KHz | 40 @ 0.796MHz | 0.660 | 0.98 | 0.52 |
| SDRI74-151M | 150 | 20% | 100KHz | 40 @ 0.796MHz | 0.880 | 0.95 | 0.46 |
| SDRI74-181M | 180 | 20% | 100KHz | 40 @ 0.796MHz | 0.980 | 0.74 | 0.42 |
| SDRI74-221M | 220 | 20% | 100KHz | 40 @ 0.796MHz | 1.170 | 0.70 | 0.36 |
| SDRI74-271M | 270 | 20% | 100KHz | 40 @ 0.796MHz | 1.640 | 0.57 | 0.34 |
| SDRI74-331M | 330 | 20% | 100KHz | 40 @ 0.796MHz | 1.860 | 0.56 | 0.32 |
| SDRI74-391M | 390 | 20% | 100KHz | 40 @ 0.796MHz | 2.850 | 0.45 | 0.29 |
| SDRI74-471M | 470 | 20% | 100KHz | 40 @ 0.796MHz | 3.010 | 0.45 | 0.26 |
| SDRI74-561M | 560 | 20% | 100KHz | 40 @ 0.796MHz | 3.620 | 0.43 | 0.23 |
| SDRI74-681M | 680 | 20% | 100KHz | 40 @ 0.796MHz | 4.630 | 0.37 | 0.22 |
| SDRI74-821M | 820 | 20% | 100KHz | 40 @ 0.796MHz | 5.200 | 0.35 | 0.20 |
| SDRI74-102M | 1000 | 20% | 100KHz | 40 @ 0.796MHz | 6.000 | 0.33 | 0.18 |
Definitions:
- Saturation Current (Isat): DC current at which inductance drops 30% from its value without current.
- Temperature Rise Current (Irms): The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat and Irms.
- Note: Part temperature is affected by circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions. Verify part temperature in the end application.
Dimensions (mm):
| Part No. | A (Max) | B (Max) | C (Max) | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SDRI74 | 7.5 | 7.5 | 4.5 | 1.8 | 5.0 | 1.6 | 4.8 | 2.2 |
Recommended Land Pattern:
(Image placeholder for Recommended Land Pattern)
Packaging:
| Part No. | Tape Dimension (W x P x H) | Reel Dimensions (A x B x C x D) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|
| SDRI74 | 16 x 12 x 11.5 | 16.5 x 13 x 330 x 100 | 1000 | 3000 | 12,000 |
Tape and Reel Specifications:
(Image placeholder for Tape and Reel Diagram)
Reel Dimensions (mm):
(Image placeholder for Reel Dimensions Diagram)
Tape Dimension (mm):
(Image placeholder for Tape Dimension Diagram)
Cover Tape Peel Off Condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT/DIP) | Meet specified force and duration requirements without loose terminals. | Reference documents: GB/T 2423.60-2008, JIS C 5321:1997. Includes pulling, solder paste thickness, terminal diameter considerations. |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997. Flexure: 2mm. Speed: 0.5mm/sec. Duration: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | GB/T 2423.7-2018. Drop packaged products from 1m height in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | GB/T 2423.28-2005. Solder temp: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019. Amplitude: 1.5mm. Frequency: 10 to 55 Hz and return. Duration: 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na. 100 cycles of temperature transitions between (85~125) and (-55~40). Transforming interval: Max. 20 sec. |
| Low Temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab. Temperature: -55~-402. Duration: 962 hours. |
| High Temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb. Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.3-2016. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | GJB 360B-2009. Performed twice according to recommended reflow curve. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993. Dip parts into IPA solvent for 50.5Min, then dry at room temp for 5Min, then brush 10 times. |
| Overload test | During test: no smoke, no peculiar smell, no fire. Characteristics normal after test. | JIS C5311-6.13. Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test: no breakdown. Characteristics normal after test. | MIL-STD-202G Method 301. For parts with two coils: DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve:
(Image placeholder for Recommended Reflow Soldering Curve)
Reminders for Using These Products:
- Storage: Within 12 months. Conditions: 5~40C, 35~65% RH or less. Solderability may deteriorate beyond this period.
- Environment: Do not use or store in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands to prevent reduced solderability. Handle carefully to prevent damage from dropping.
- Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact SXN if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform after mounting within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Allow sufficient margin for self-heating when power is on.
- Non-Magnetic Shield Type: Carefully lay out coils on the PCB to prevent malfunctions due to magnetic interference.
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina