RoHS Halogen Free molding SMD power inductor LanTu Micro SMS0850 680MT for high frequency applications
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MOQ:
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Delivery Time:
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Product Description
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS0850 Series is an ultra-high current SMD power inductor designed for high-density installations. It features a thin profile with low DC resistance and ultra-high current capabilities. The magnetic shielding provides strong anti-electromagnetic interference, while the integral construction ensures high reliability and excellent vibration resistance. Its composite structure results in ultra-low buzz noise and low loss alloy powder die-casting contributes to low impedance and small parasitic capacitance, leading to high efficiency. These inductors operate up to 1-2MHz and are RoHS, Halogen Free, and REACH compliant.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS0850
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by company name and location)
Technical Specifications
General Specifications
| Parameter | Value |
|---|---|
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) |
| Maximum Voltage | 30VDC |
| Frequency Range | Up to 1-2MHz |
| Test Equipment (Inductance) | WK3260B LCR meter or equivalent |
| Test Equipment (Saturation Current & Heat Rating Current) | WK3260B+WK3265B or equivalent |
| Test Equipment (DCR) | Chroma 16502 or equivalent |
Dimensions
| Part Number Prefix | External Dimensions (LWH) (mm) |
|---|---|
| SMS0850 | 8.5 8.0 5.0 |
Recommended Land Pattern
| Part No. | A (0.50) | B (0.30) | C (Max) | D (0.30) | E (0.30) | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SMS0850 | 8.5 | 8.0 | 5.00 | 3.0 | 1.8 | 4.5 | 9.5 | 3.5 |
Electrical Characteristics
| Part No. | Inductance (H) | Tolerance | Inductance @ 100KHz, 1.0V (H) | DCR (m) | Saturation Current (A) | Heat Rating Current (A) |
|---|---|---|---|---|---|---|
| Typical | Typical | Max | Typical | |||
| SMS0850-R56M | 0.56 | 20% | 3.0 | 4.5 | 30.00 | 24.00 |
| SMS0850-R68M | 0.68 | 20% | 3.6 | 6.0 | 25.00 | 23.00 |
| SMS0850-1R0M | 1.0 | 20% | 4.1 | 5.5 | 20.00 | 19.00 |
| SMS0850-1R5M | 1.5 | 20% | 5.0 | 7.0 | 19.00 | 17.00 |
| SMS0850-2R2M | 2.2 | 20% | 8.2 | 12.0 | 16.00 | 14.00 |
| SMS0850-3R3M | 3.3 | 20% | 11.0 | 15.0 | 13.00 | 12.00 |
| SMS0850-4R7M | 4.7 | 20% | 15.0 | 20.0 | 12.00 | 9.50 |
| SMS0850-5R6M | 5.6 | 20% | 25.0 | 28.5 | 11.00 | 9.00 |
| SMS0850-100M | 10 | 20% | 35.0 | 45.0 | 8.00 | 6.20 |
| SMS0850-150M | 15 | 20% | 55.0 | 65.0 | 7.00 | 5.40 |
| SMS0850-220M | 22 | 20% | 78.0 | 88.0 | 5.50 | 4.80 |
| SMS0850-330M | 33 | 20% | 120.0 | 140.0 | 6.00 | 3.50 |
| SMS0850-470M | 47 | 20% | 177.0 | 190.0 | 4.00 | 2.90 |
| SMS0850-560M | 56 | 20% | 188.0 | 226.0 | 3.00 | 2.50 |
| SMS0850-680M | 68 | 20% | 280.0 | 310.0 | 2.80 | 2.00 |
Inductance Tolerance Codes
| Code | Tolerance |
|---|---|
| J | 5% |
| K | 10% |
| L | 15% |
| M | 20% |
| P | 25% |
| N | 30% |
Packaging Options
| Code | Package Type |
|---|---|
| B | Bulk Package |
| T | Tape & Reel |
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Tape and Reel Specifications
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel Quantity (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS0850 | 24.0 | 12.0 | 11.5 | 24.4 | 100 | 13 | 330 | 1000 | 2000 | 8000 |
Reliability Testing Summary
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal | Pulling test (force based on terminal area), Solder paste thickness: 0.12mm, Keep time: 101s, Speed: 1.0mm/s |
| Terminal Strength (DIP) | Meet requirements without any loose terminal | Pull Force: 5N to 40N (based on terminal diameter), Duration: 10sec |
| Resistance to Flexure | No visible mechanical damage | Flexure: 2mm, Pressurizing Speed: 0.5mm/sec, Keep time: 30 sec |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Frequency: 10 to 55 Hz and return, Total amplitude: 1.5mm, Duration: 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | 100 cycles of temperature transition between (85~125) and (-55~40). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: -55~-402, Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: 125~852, Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | Reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip in IPA solvent for 50.5Min, drying at room temp for 5Min, brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. The characteristic is normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. The characteristic is normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm according to their specific environment and equipment.
Reminders for Using These Products
- Storage period is within 12 months. Storage conditions: temperature 5~40C, humidity 35~65% RH or less.
- Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
- Avoid touching terminals directly with bare hands due to oil secretions.
- Handle products carefully to prevent damage from dropping or inappropriate removal.
- Do not bend terminals excessively to avoid wire fracture.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance degradation, or lifespan reduction.
- Allow sufficient margin for thermal design due to self-heating when power is on.
- For non-magnetic shield types, carefully lay out the coil on the circuit board to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina