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Molding SMD Power Inductors LanTu Micro SMS0630-220MT with High Vibration Resistance and Reliability

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Product Description

Molding SMD Power Inductors - SMS0630 Series

Product Overview

The SMS0630 Series from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are ultra-high current SMD power inductors designed for high-density installation. Featuring a thin profile with low DC resistance and ultra-high current capabilities, these magnetically shielded inductors offer strong anti-electromagnetic interference. Their integral construction ensures high reliability and excellent vibration resistance, while the composite structure minimizes buzz noise. Built with low-loss alloy powder for die-casting, they provide low impedance and small parasitic capacitance, leading to high efficiency by reducing winding DC resistance and core eddy-current loss. These inductors are suitable for frequencies up to 3MHz and have an absolute maximum voltage of 30VDC. They comply with RoHS, Halogen Free, and REACH standards.

Applications:

  • PDA, notebook, desktop, server applications
  • High current POL converters
  • Battery powered devices
  • DC/DC converters in distributed power systems

Product Attributes

  • Brand: LANTU MICRO ELECTRIC TECHNOLOGY
  • Origin: SHENZHEN, CHINA
  • Series: SMS0630
  • Type: Molding SMD Power Inductor
  • Certifications: RoHS, Halogen Free, REACH Compliance

Environmental Data

  • Operating Temperature: -55 to +125 (Including coils self-temperature rise)

Technical Specifications

Part No. Inductance (H) @ 0A Tolerance DCR (m) Typical DCR (m) Max Saturation Current Typical (A) Heat Rating Current Typical (A) Dimensions (LWH mm)
SMS0630-R10M 0.10 20% 1.40 2.20 60.00 32.00 7.16.63.0
SMS0630-R15M 0.15 20% 1.55 2.30 41.00 30.00 7.16.63.0
SMS0630-R22M 0.22 20% 1.60 3.00 35.00 25.00 7.16.63.0
SMS0630-R47M 0.47 20% 4.00 4.50 20.00 18.00 7.16.63.0
SMS0630-R68M 0.68 20% 4.75 5.30 19.00 16.00 7.16.63.0
SMS0630-1R0M 1.0 20% 7.60 8.00 16.00 13.00 7.16.63.0
SMS0630-1R5M 1.5 20% 13.20 16.00 14.00 12.50 7.16.63.0
SMS0630-2R2M 2.2 20% 16.50 20.00 11.50 8.50 7.16.63.0
SMS0630-3R3M 3.3 20% 24.50 35.00 9.50 7.00 7.16.63.0
SMS0630-4R7M 4.7 20% 35.00 40.00 6.55 6.00 7.16.63.0
SMS0630-5R6M 5.6 20% 36.00 42.00 6.35 5.70 7.16.63.0
SMS0630-6R8M 6.8 20% 44.30 48.00 6.00 5.10 7.16.63.0
SMS0630-8R2M 8.2 20% 60.00 64.90 6.00 5.00 7.16.63.0
SMS0630-100M 10 20% 64.50 75.00 5.50 4.50 7.16.63.0
SMS0630-150M 15 20% 103.00 115.00 4.50 3.10 7.16.63.0
SMS0630-220M 22 20% 180.00 200.00 3.50 2.60 7.16.63.0
SMS0630-330M 33 20% 250.00 270.00 3.00 2.00 7.16.63.0
SMS0630-470M 47 20% 310.00 385.00 2.00 1.50 7.16.63.0

Shape and Dimensions (mm)

Part No. A B C (Max) D (Typ) E (Typ) F G H
SMS0630 7.100.30 6.600.20 3.00 3.00 1.60 3.70 8.40 3.50

Inductance Tolerance Codes

  • J: 5%
  • K: 10%
  • L: 15%
  • M: 20%
  • P: 25%
  • N: 30%

Packing

  • Bulk Package (B)
  • Tape & Reel (T)

Test Equipment

  • Inductance (L): WK3260B LCR meter or equivalent
  • Saturation Current (Isat) & Heat Rating Current (Irms): WK3260B+WK3265B or equivalent
  • DC Resistance (DCR): Chroma 16502 or equivalent

Definitions

  • Saturation Current: DC current at which inductance drops 30% from its value without current.
  • Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
  • Rated DC Current: The lesser value of Isat or Irms.

Reminders for Using These Products

  • Storage: Within 12 months. Conditions: 5~40C, 35-65% RH. Soldering of terminal electrodes may deteriorate if storage period elapses.
  • Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals due to hand oils affecting solderability. Handle carefully to prevent damage from dropping.
  • Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
  • Cleaning: Do not rinse coils. Contact SXN if cleaning is necessary.
  • Magnetism: Do not expose to magnets or magnetic fields.
  • Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
  • Soldering Correction: Post-mounting soldering corrections must be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
  • Thermal Design: Account for self-heating when power is ON. Ensure sufficient thermal design margin.
  • Non-Magnetic Shield Type: Careful coil layout is required on the circuit board to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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