Ultra high current SMD power inductor LanTu Micro SMS252010-1R0MT with low AC losses and EMI shielding

Product Overview

The SMS252010 Series Ultra-high current SMD power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offer a thin design with low DC resistance and ultra-high current capability. Featuring magnetic shielding for strong anti-electromagnetic interference, they are suitable for high-density installations. These high-reliability inductors utilize an integral construction for excellent vibration resistance and boast extremely low DCR and ultra-low AC losses, making them ideal for high switching frequencies. They are compliant with RoHS, Halogen Free, and REACH standards. Key applications include DC/DC converters for notebook PC CPUs, mobile phones, tablets, HDDs, DVCs, PDAs, 5G modules, servers, base stations, and various DC-DC conversion power modules.

Product Attributes

• Brand: LANTU MICRO ELECTRIC TECHNOLOGY
• Origin: SHENZHEN
• Product Type: Common Mode Choke / Molding SMD Power Inductor
• Certifications: RoHS, Halogen Free, REACH Compliance

Technical Specifications

General Specifications

Feature	Description
Operating Temperature	-40 to +125 (Including coils self-temperature rise)
Test Equipment (Inductance)	WK3260B LCR meter or equivalent
Test Equipment (Current)	WK3260B+WK3265B or equivalent
Test Equipment (DCR)	Chroma 16502 or equivalent

Product Identification

SMS 252010 R47 M T

Component	Description
Inductance	0.47 uH
(LWH) (mm)	252010 (2.52.01.0 mm)
(Type)	SMS (Molding SMD Power Inductor)
(Inductance Tolerance)	M: 20% (Other options: J:5%, K: 10%, L: 15%, P: 25%, N: 30%)
(Packing)	T (Tape & Reel) (Other option: B: Bulk Package)

Shape and Dimensions

Part No.	A (mm)	B (mm)	C (mm)	D (mm)	E (mm)	F (mm)	H (mm)
SMS252010	2.500.20	2.000.20	1.00 Max	0.90 Typ	2.80 Typ	1.00 Typ	2.10 Typ

Specifications

Part No.	Inductance (H)	Tolerance	DCR (m)	Saturation Current (A)	Heat Rating Current (A)
	1MHz, 1.0V '@0A		Typical	Max	Typical	Typical
SMS252010-R33M	0.33	20%	13.0	19.0	7.20	6.20
SMS252010-R47M	0.47	20%	15.0	22.0	6.50	5.60
SMS252010-R68M	0.68	20%	23.0	27.0	5.50	5.00
SMS252010-1R0M	1.0	20%	25.0	30.0	4.80	4.10
SMS252010-1R5M	1.5	20%	45.0	55.0	3.90	3.00
SMS252010-2R2M	2.2	20%	62.0	70.0	3.00	2.10
SMS252010-3R3M	3.3	20%	86.0	100.0	2.50	2.10
SMS252010-4R7M	4.7	20%	160.0	180.0	2.00	1.60

Definitions:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
- Special remind: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

Packaging

Part No.	Tape Dimension W (mm)	Tape Dimension P (mm)	Tape Dimension W1 (mm)	REEL (PCS)	Inside Box (PCS)	Outside Carton (PCS)
SMS252010	8.0	4.0	3.5	3000	30,000	120,000

Cover tape peel off condition:
a) Cover tape peel force shall be 10 to 120g.
b) Noodle strip peeling angle 165 to 180.

Reliability Testing

Item	Requirements	Test Methods and Remarks
Terminal Strength (SMT)	Meet requirements without any loose terminal.	Pulling test: Defined forces based on terminal cross-sectional area (A). Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s.
Terminal Strength (DIP)	Meet requirements without any loose terminal.	Applied force: 5N to 40N based on terminal diameter (d). Duration: 10sec.
Resistance to Flexure	No visible mechanical damage.	Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec.
Dropping	No case deformation or change in appearance. No short and no open.	Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction.
Solderability	No visible mechanical damage. Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage.	Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol in weight.
Vibration	No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%.	Frequency: 10 to 55 Hz and return to 10 Hz in 1 minute. Applied for 2 hours in each of 3 mutually perpendicular directions (total 6 hours). Total amplitude: 1.5mm.
Thermal Shock	No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%.	100 cycles of temperature shock from (85~125) to (-55~40). Transforming interval: Max. 20 sec.
Low temperature Storage	No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%.	Temperature: -55~-402. Duration: 962 hours.
High temperature Storage	No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%.	Temperature: 125~852. Duration: 962 hours.
Damp Heat (Steady States)	No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%.	Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours.
Heat endurance of Reflow soldering	No significant defects in appearance. L/L10%. Q/Q30% (SMD series only). DCR/DCR10%.	Peak temperature: 260+0/-5. Performed twice.
Resistance to solvent test	No case deformation or change in appearance or obliteration of marking.	Dip parts into IPA solvent for 50.5Min, then dry at room temp for 5Min, brush 10 times.
Overload test	During the test no smoke, no peculiar smell, no fire. Characteristics are normal after test.	Apply twice the rated current for 5 minutes.
Voltage resistance test	During the test no breakdown. Characteristics are normal after test.	DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils)

Recommended reflow soldering curve

The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm according to their specific environment/equipment.

Reminders for Using These Products

• Storage period is within 12 months. Storage conditions: temperature 5~40C, humidity 35 to 65% RH or less.
• Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
• Avoid direct contact with terminals by bare hands to prevent solderability issues.
• Handle products carefully to prevent damage from dropping or improper removal.
• Do not bend terminals with excessive stress to avoid wire fracture.
• Do not rinse coils by yourself; contact the manufacturer if cleaning is necessary.
• Do not expose products to magnets or magnetic fields.
• Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
• Soldering corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
• Allow sufficient margin for thermal design due to self-heating when power is ON.
• For non-magnetic shield types, careful layout is required to prevent malfunctions due to magnetic interference.