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LanTu Micro SSD0804 101MT Series Unshielded SMD Power Inductors for VTR LCD Television Power Supplies

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Product Description

Unshielded SMD Power Inductors - SSD0804 Series

Product Overview

The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SSD0804 Series offers high-power, unshielded SMD power inductors designed for surface mounting. These inductors feature high saturation and low DC resistance, making them suitable for a wide range of applications including power supplies for VTRs, LCD televisions, and DC/DC converters. They are available in various package sizes and inductance ranges, and comply with RoHS, Halogen Free, and REACH standards.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SSD0804
  • Type: Unshielded SMD Power Inductors
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Packaging Options: Bulk Package (B), Tape & Reel (T)

Technical Specifications

General Specifications

Specification Value
Operating Temperature -40 to +125 (Including coils self-temperature rise)
External Dimensions (LWH) 0804 (12.959.45.21 mm)
Inductance Tolerance J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%

Electrical Characteristics (at 25)

Part No. Inductance (H) Tolerance Test Freq. (KHz) SRF (MHz) Typ DCR () Max Saturation Current (A) Max Temperature Rise Current (A) Max
SSD0804-1R0M 1.0 20% 100KHz 100 0.009 9.00 6.80
SSD0804-1R5M 1.5 20% 100KHz 90 0.010 8.00 6.40
SSD0804-2R2M 2.2 20% 100KHz 80 0.012 7.00 6.10
SSD0804-3R3M 3.3 20% 100KHz 65 0.015 6.40 5.40
SSD0804-4R7M 4.7 20% 100KHz 45 0.018 5.40 4.80
SSD0804-6R8M 6.8 20% 100KHz 38 0.027 4.60 4.40
SSD0804-100M 10 20% 100KHz 30 0.038 3.80 3.90
SSD0804-150M 15 20% 100KHz 27 0.046 3.50 3.10
SSD0804-220M 22 20% 100KHz 19 0.085 3.00 2.70
SSD0804-330M 33 20% 100KHz 15 0.100 2.60 2.10
SSD0804-470M 47 20% 100KHz 12 0.140 2.00 1.60
SSD0804-680M 68 20% 100KHz 10 0.200 1.60 1.40
SSD0804-101M 100 20% 100KHz 9 0.280 1.40 1.20
SSD0804-151K 150 10% 100KHz 6 0.400 1.20 1.00
SSD0804-221K 220 10% 100KHz 5 0.610 1.00 0.80
SSD0804-331K 330 10% 100KHz 4.5 1.020 0.60 0.60
SSD0804-471K 470 10% 100KHz 3.5 1.270 0.50 0.50
SSD0804-681K 680 10% 100KHz 2.5 2.020 0.40 0.40
SSD0804-102K 1000 10% 100KHz 2.0 3.000 0.30 0.30

Dimensions (mm)

Part No. A (Max) B (Max) C (Max) D E F H I J
SSD0804 12.95 9.4 5.21 7.62 2.54 2.54 2.79 2.92 7.37

Definitions

  • Saturation Current: DC current at which inductance drops 10% from its value without current.
  • Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
  • Rated DC Current: The lesser value of Isat or Irms.

Packaging Information

Part No. Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
SSD0804 24 16 11.5 24.4 100 13 330 1000 2000 8000

Reliability Testing

Item Requirements Test Methods and Remarks
Terminal Strength Meet requirements without any loose terminal. Pulling test (SMT/DIP), Solder paste thickness, applied force and duration based on terminal dimensions.
Resistance to Flexure No visible mechanical damage. Inductor soldered to jig, force applied in specified direction, flexure 2mm, speed 0.5mm/sec, keep time 30 sec.
Dropping No case deformation or change in appearance. No short and no open. Packaged products dropped from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction.
Solderability No visible mechanical damage. Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol.
Vibration No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Subjected to simple harmonic motion, frequency varied 10-55 Hz and return, 2 hours in each of 3 mutually perpendicular directions.
Thermal Shock No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. 100 cycles of temperature shock (-55~40 to 85~125). Transforming interval: Max. 20 sec.
Low temperature Storage No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Temperature: -55~-402. Duration: 962 hours.
High temperature Storage No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Temperature: 85~1252. Duration: 962 hours.
Damp Heat (Steady States) No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours.
Heat endurance of Reflow soldering No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. Refer to reflow curve, twice. Peak temperature: 260+0/-5.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. Dipped into IPA solvent for 50.5Min, dried for 5Min, brushed 10 times.
Overload test During test no smoke, no peculiar smell, no fire. Characteristics normal after test. Apply twice rated current for 5 minutes.
Voltage resistance test During test no breakdown. Characteristics normal after test. DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils)

Recommended Reflow Soldering Curve

The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.

Reminders for Using These Products

  • Storage period is within 12 months under conditions (temperature: 5~40C, humidity: 35~65% RH or less).
  • Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
  • Avoid direct contact with terminals by bare hands due to oil secretions affecting soldering.
  • Handle products carefully to prevent damage from dropping or improper removal.
  • Do not bend terminals with excessive stress to avoid wire fracture.
  • Do not rinse coils; contact the manufacturer if cleaning is necessary.
  • Do not expose products to magnets or magnetic fields.
  • Preheat components before soldering; the temperature difference between solder and chip should not exceed 150C.
  • Soldering corrections after mounting should be within specified conditions; overheating can cause issues.
  • Allow sufficient margin for thermal design due to self-heating when power is ON.
  • For non-magnetic shield types, careful coil layout is needed to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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