SMD Power Inductor LanTu Micro SNR3015-1R5MT Magnetic Resin Shielded for Strong EMI Resistance and Low Buzz Noise
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MOQ:
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Delivery Time:
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Product Description
Product Overview
The SNR3015 Series is an automatic assembly compatible, magnetic resin shielded SMD power inductor designed to minimize buzz noise to ultra-low levels. It features a closed magnetic circuit design for reduced leakage flux and strong EMI resistance, large current handling capability with low DCR, and metallization on the ferrite core for excellent shock resistance and durability. This series offers space and power savings, making it suitable for a wide range of applications including LED backlights, flat-screen TVs, notebooks, servers, automotive systems, and DC-DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SNR3015
- Type: Magnetic Resin Shielded SMD Power Inductors
- Construction: Automatic assembly, Magnetic-resin shielded
- Certifications: RoHS, Halogen Free, REACH Compliance
- Core Material: Ferrite
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | Frequency (100KHz, 1.0V) | DCR () Typical | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH mm) |
|---|---|---|---|---|---|---|---|---|
| SNR3015-R47M | 0.47 | 20% | - | 0.024 | 0.035 | 2.50 | 2.60 | 3.03.01.5 |
| SNR3015-1R0M | 1.0 | 20% | - | 0.030 | 0.039 | 2.32 | 2.35 | 3.03.01.5 |
| SNR3015-1R5M | 1.5 | 20% | - | 0.050 | 0.065 | 2.30 | 1.70 | 3.03.01.5 |
| SNR3015-1R8M | 1.8 | 20% | - | 0.050 | 0.065 | 1.75 | 1.70 | 3.03.01.5 |
| SNR3015-2R2M | 2.2 | 20% | - | 0.060 | 0.078 | 1.60 | 1.60 | 3.03.01.5 |
| SNR3015-3R3M | 3.3 | 20% | - | 0.080 | 0.104 | 1.32 | 1.36 | 3.03.01.5 |
| SNR3015-4R7M | 4.7 | 20% | - | 0.125 | 0.165 | 1.10 | 1.09 | 3.03.01.5 |
| SNR3015-6R8M | 6.8 | 20% | - | 0.200 | 0.260 | 0.85 | 0.85 | 3.03.01.5 |
| SNR3015-100M | 10 | 20% | - | 0.250 | 0.325 | 0.72 | 0.77 | 3.03.01.5 |
| SNR3015-150M | 15 | 20% | - | 0.350 | 0.455 | 0.66 | 0.65 | 3.03.01.5 |
| SNR3015-220M | 22 | 20% | - | 0.460 | 0.598 | 0.52 | 0.57 | 3.03.01.5 |
| SNR3015-330M | 33 | 20% | - | 0.820 | 1.066 | 0.44 | 0.43 | 3.03.01.5 |
| SNR3015-470M | 47 | 20% | - | 1.250 | 1.625 | 0.35 | 0.35 | 3.03.01.5 |
| Inductance Tolerance Codes: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | ||||||||
| Packing Codes: B: Bulk Package, T: Tape & Reel | ||||||||
| Operating Temperature: -40 to +125 (Including coils self-temperature rise) | ||||||||
| Test Equipment: L: HP4284A or HP4285A LCR meter or equivalent; Isat & Irms: HP4284+42841A or equivalent; DCR: Chroma 16502 or equivalent | ||||||||
| Saturation Current Definition: DC current at which inductance drops 30% from its value without current. | ||||||||
| Temperature Rise Current Definition: The actual value of DC current when the temperature rise is T 40 (Ta=25). | ||||||||
| Rated DC Current: The lesser value of Isat or Irms. | ||||||||
Packaging Specifications
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SNR3015 | 8 | 4 | 3.5 | 8.4 | 60 | 13 | 178 | 2000 | 20,000 | 80,000 |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on GB/T 2423.60-2008. Solder paste thickness: 0.12mm. Force applied gradually and maintained for 101s at 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Pull Force test based on GB/T 2423.60-2008, varying force based on terminal diameter (5N to 40N) for 10 sec. |
| Resistance to Flexure | No visible mechanical damage. | Solder to jig, apply force in specified direction, flexure 2mm, speed 0.5mm/sec, keep time 30 sec. (JIS C 5321:1997) |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in specified angles and surfaces, twice in each direction. (GB/T 2423.7-2018) |
| Solderability | Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage. | Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. (GB/T 2423.28-2005) |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Solder to jig, subjected to simple harmonic motion (10-55 Hz, 1.5mm amplitude) for 2 hours in 3 perpendicular directions. (GB/T 2423.10-2019) |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | 100 cycles of temperature transition between (-55~-40) and (85~125). Transforming interval: Max. 20 sec. (GB/T 2423.22-2012 Method Na) |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: -55~-402, Duration: 962 hours. Stabilize at normal condition for 1-2 hours before measuring. (GB/T 2423.1-2008 Method Ab) |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: 125~852, Duration: 962 hours. Stabilize at normal condition for 1-2 hours before measuring. (GB/T 2423.2-2008 Method Bb) |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: 602, Humidity: 90% to 95% RH. Duration: 962 hours. Stabilize at normal condition for 1-2 hours before measuring. (GB/T 2423.3-2016) |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | Refer to recommended reflow curve, undergo reflow twice. Peak temperature: 260+0/-5. (GJB 360B-2009) |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, then brush 10 times. (IEC 68-2-45:1993) |
| Overload test | During test no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes. (JIS C5311-6.13) |
| Voltage resistance test | During test no breakdown. Characteristics normal after test. | For parts with two coils: DC1000V, Current: 1mA, Time: 1Min. (MIL-STD-202G Method 301) |
Recommended Reflow Soldering Curve
The recommended reflow conditions are provided for reference and may need adjustment based on specific user equipment and process conditions.
Usage Reminders
- Storage: Within 12 months, under temperature 5~40C and humidity 35~65% RH. Terminal solderability may deteriorate beyond this period.
- Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions that inhibit soldering. Handle products carefully to prevent damage.
- Terminal Bending: Do not bend terminals excessively to prevent wire fracture.
- Cleaning: Do not rinse coils independently; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections must be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when the power is ON to ensure sufficient thermal design margin.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina