Unshielded SMD Power Inductors - SCD1054 Series

Product Overview

The SCD1054 Series Unshielded SMD Power Inductors are designed for surface mounting, offering a low-cost solution with high rated current and low DC resistance in a compact size. These inductors are suitable for a wide range of applications including VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters. They are compliant with RoHS, Halogen Free, and REACH standards, ensuring environmental responsibility.

Product Attributes

• Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Series: SCD1054
• Type: Unshielded SMD Power Inductor
• Design: Silver plated type, Low cost design
• Certifications: RoHS, Halogen Free, REACH Compliance
• Origin: Shenzhen, China (Implied by company name and location)

Technical Specifications

Environmental Data:

• Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment:

• Inductance (L): HP4284A, HP4285A LCR meter or equivalent
• Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
• Self-Resonant Frequency (SRF): Agilent E4991A or equivalent
• DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification: SCD 1054 - Inductance - Tolerance - Packing

External Dimensions (LWH): 10.00.3mm 5.40.5mm 2.1mm

Recommended Land Pattern: (Dimensions provided in mm: A=10.00.3, B=9.00.3, C=5.40.5, D=2.1, H=9.5, I=3.75, J=2.5)

Notes on Specifications:

• Saturation Current: DC current at which inductance drops 10% from its value without current.
• Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
• Rated DC Current: The lesser value of Isat or Irms.
• Special Remind: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

Packaging:

• Packing Options: Bulk Package (B), Tape & Reel (T)
• Tape and Reel Specifications: Tape Dimension W=24mm, P=12mm, W1=11.5mm. Reel Dimensions A=24.4mm.
• Packing Quantity: Reel (1000 PCS), Inside Box (2000 PCS), Outside Carton (8000 PCS)

Reliability Testing:

• Terminal Strength (SMT & DIP)
• Resistance to Flexure
• Dropping Test
• Solderability
• Vibration Test
• Thermal Shock
• Low Temperature Storage
• High Temperature Storage
• Damp Heat (Steady States)
• Heat Endurance of Reflow Soldering
• Resistance to Solvent Test
• Overload Test
• Voltage Resistance Test

Recommended Reflow Soldering Curve: (Refer to provided graph for detailed temperature profile)

Reminders for Using These Products:

• Storage: Within 12 months, under conditions of 5~40C and 35~65% RH.
• Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
• Handling: Avoid direct contact with terminals with bare hands due to oil secretions. Handle products carefully to prevent damage.
• Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
• Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
• Magnetism: Do not expose products to magnets or magnetic fields.
• Preheating: Preheating is required before soldering; temperature difference between solder and chip should not exceed 150C.
• Soldering Correction: Post-mounting soldering corrections should adhere to specifications; overheating may cause issues.
• Thermal Design: Ensure sufficient thermal design margin as the device self-heats when powered on.
• Layout (Non-Shielded): Careful coil placement on the PCB is required for non-magnetic shield types to prevent malfunctions due to magnetic interference.