High Saturation LanTu Micro SSD0804-470MT Power Inductor for in Laptop and LCD Television Electronics
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Delivery Time:
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Product Description
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SSD0804 Series are unshielded SMD power inductors designed for surface mounting applications. These inductors offer high power handling, high saturation capabilities, and low DC resistance, making them suitable for various DC/DC converters and power supply applications in consumer electronics like laptop computers and LCD televisions. They are available in multiple package sizes and a wide inductance range, and comply with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SSD0804
- Type: Unshielded SMD Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
- Packaging Options: Bulk Package (B), Tape & Reel (T)
Technical Specifications
| Part No. | Inductance (H) | Tolerance | Test Frequency (kHz) | SRF (MHz) Typ | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|---|
| SSD0804-1R0M | 1.0 | 20% | 100KHz | 100 | 0.009 | 9.00 | 6.80 |
| SSD0804-1R5M | 1.5 | 20% | 100KHz | 90 | 0.010 | 8.00 | 6.40 |
| SSD0804-2R2M | 2.2 | 20% | 100KHz | 80 | 0.012 | 7.00 | 6.10 |
| SSD0804-3R3M | 3.3 | 20% | 100KHz | 65 | 0.015 | 6.40 | 5.40 |
| SSD0804-4R7M | 4.7 | 20% | 100KHz | 45 | 0.018 | 5.40 | 4.80 |
| SSD0804-6R8M | 6.8 | 20% | 100KHz | 38 | 0.027 | 4.60 | 4.40 |
| SSD0804-100M | 10 | 20% | 100KHz | 30 | 0.038 | 3.80 | 3.90 |
| SSD0804-150M | 15 | 20% | 100KHz | 27 | 0.046 | 3.50 | 3.10 |
| SSD0804-220M | 22 | 20% | 100KHz | 19 | 0.085 | 3.00 | 2.70 |
| SSD0804-330M | 33 | 20% | 100KHz | 15 | 0.100 | 2.60 | 2.10 |
| SSD0804-470M | 47 | 20% | 100KHz | 12 | 0.140 | 2.00 | 1.60 |
| SSD0804-680M | 68 | 20% | 100KHz | 10 | 0.200 | 1.60 | 1.40 |
| SSD0804-101M | 100 | 20% | 100KHz | 9 | 0.280 | 1.40 | 1.20 |
| SSD0804-151K | 150 | 10% | 100KHz | 6 | 0.400 | 1.20 | 1.00 |
| SSD0804-221K | 220 | 10% | 100KHz | 5 | 0.610 | 1.00 | 0.80 |
| SSD0804-331K | 330 | 10% | 100KHz | 4.5 | 1.020 | 0.60 | 0.60 |
| SSD0804-471K | 470 | 10% | 100KHz | 3.5 | 1.270 | 0.50 | 0.50 |
| SSD0804-681K | 680 | 10% | 100KHz | 2.5 | 2.020 | 0.40 | 0.40 |
| SSD0804-102K | 1000 | 10% | 100KHz | 2.0 | 3.000 | 0.30 | 0.30 |
| Part No. | External Dimensions (LWH) (mm) | Inductance Tolerance | Packing |
|---|---|---|---|
| SSD0804 | 12.959.45.21 | J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | B (Bulk), T (Tape & Reel) |
| Item | A (Max) | B (Max) | C (Max) | D | E | F | H | I | J |
|---|---|---|---|---|---|---|---|---|---|
| SSD0804 | 12.95 | 9.4 | 5.21 | 7.62 | 2.54 | 2.54 | 2.79 | 2.92 | 7.37 |
Environmental Data:
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Test Equipment:
- Inductance (L): HP4284A or HP4285A LCR meter or equivalent
- Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
- Self-Resonant Frequency (SRF): Agilent E4991A or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Definitions:
- Saturation Current: DC current at which inductance drops 10% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat and Irms.
Special Reminder: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
Packaging:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SSD0804 | 24 | 16 | 11.5 | 24.4 | 100 | 13 | 330 | 1000 | 2000 | 8000 |
Tape and Reel Specifications:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing:
| Items | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on sectional area of terminal. Solder with lead-free solder. Force applied gradually and maintained for 10 sec. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force based on terminal diameter. Duration: 10 sec. |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig, apply force in specified direction. Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | No visible mechanical damage. Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Solder to testing jig. Subjected to simple harmonic motion, frequency varied between 10 and 55 Hz. Applied for 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Cycle of high temperature (85~125) and low temperature (-55~40). 100 cycles. Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30% (SMD series only). DCR/DCR10%. | Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, then dry for 5Min, then brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. The characteristic is normal after test. | Apply twice the rated current for 5 minutes. Repeat twice. |
| Voltage resistance test | During the test no breakdown. The characteristic is normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils). |
Recommended reflow soldering curve: The recommended reflow conditions are set according to the soldering equipment. Users should adjust and confirm according to their specific environment/equipment.
Reminders for Using These Products:
- Storage period is within 12 months. Storage conditions: temperature 5~40C, humidity 35~65% RH or less.
- Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
- Avoid touching electrodes directly with bare hands due to oil secretions.
- Handle products carefully to prevent damage from dropping or inappropriate removing.
- Do not bend terminals with excessive stress to avoid wire fracture.
- Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering. The temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or lifespan reduction.
- Allow sufficient thermal design margin as self-heating occurs when power is ON.
- For non-magnetic shield types, carefully consider coil layout on the PCB to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina