Closed Magnetic Circuit LanTu Micro SDRI129-330MT Shielded SMD Power Inductors for DC DC Converters
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Product Description
Product Overview
The SDRI129 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high performance in demanding applications. These inductors feature a high saturation current, low DC resistance, and a closed magnetic circuit design to minimize leakage flux. Their highly accurate dimensions ensure suitability for automatic mounting. Available in various package sizes and a wide inductance range, these inductors comply with RoHS, Halogen Free, and REACH standards. They are ideal for power supplies in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SDRI129 Series
- Type: Shielded SMD Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
- Magnetic Circuit: Closed magnetic circuit design
- Mounting: Suitable for automatic mounting
Technical Specifications
| Part No. | Inductance (H) | Tolerance | Test Frequency | DCR () Max @ 0A | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH) (mm) |
|---|---|---|---|---|---|---|---|
| SDRI129-1R0N | 1.0 | 30% | 100KHz | 0.0060 | 19.90 | 11.60 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-1R8N | 1.8 | 30% | 100KHz | 0.0075 | 13.40 | 11.00 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-2R2N | 2.2 | 30% | 100KHz | 0.0090 | 12.20 | 10.30 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-3R3N | 3.3 | 30% | 100KHz | 0.010 | 12.00 | 9.00 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-4R7N | 4.7 | 30% | 100KHz | 0.012 | 10.08 | 8.50 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-5R6N | 5.6 | 30% | 100KHz | 0.014 | 9.50 | 8.00 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-6R8N | 6.8 | 30% | 100KHz | 0.015 | 8.56 | 7.90 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-8R2N | 8.2 | 30% | 100KHz | 0.017 | 8.48 | 7.30 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-100M | 10 | 20% | 1KHz | 0.018 | 7.12 | 6.95 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-120M | 12 | 20% | 1KHz | 0.022 | 7.04 | 6.20 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-150M | 15 | 20% | 1KHz | 0.032 | 5.84 | 5.22 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-180M | 18 | 20% | 1KHz | 0.035 | 5.50 | 5.10 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-220M | 22 | 20% | 1KHz | 0.038 | 5.12 | 4.95 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-270M | 27 | 20% | 1KHz | 0.040 | 5.00 | 4.20 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-330M | 33 | 20% | 1KHz | 0.052 | 4.25 | 3.60 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-390M | 39 | 20% | 1KHz | 0.066 | 4.20 | 3.50 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-470M | 47 | 20% | 1KHz | 0.072 | 3.60 | 3.45 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-560M | 56 | 20% | 1KHz | 0.090 | 2.85 | 2.95 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-680M | 68 | 20% | 1KHz | 0.102 | 2.76 | 2.85 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-820M | 82 | 20% | 1KHz | 0.112 | 2.62 | 2.60 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-101M | 100 | 20% | 1KHz | 0.126 | 2.31 | 2.45 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-121M | 120 | 20% | 1KHz | 0.154 | 2.05 | 2.20 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-151M | 150 | 20% | 1KHz | 0.174 | 1.80 | 1.90 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-181M | 180 | 20% | 1KHz | 0.191 | 1.66 | 1.86 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-221M | 220 | 20% | 1KHz | 0.246 | 1.64 | 1.72 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-271M | 270 | 20% | 1KHz | 0.330 | 1.35 | 1.50 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-331M | 330 | 20% | 1KHz | 0.386 | 1.28 | 1.28 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-391M | 390 | 20% | 1KHz | 0.440 | 1.20 | 1.27 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-471M | 470 | 20% | 1KHz | 0.471 | 1.06 | 1.25 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-561M | 560 | 20% | 1KHz | 0.650 | 1.01 | 0.98 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-681M | 680 | 20% | 1KHz | 0.730 | 0.83 | 0.96 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-821M | 820 | 20% | 1KHz | 0.824 | 0.81 | 0.94 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-102M | 1000 | 20% | 1KHz | 1.220 | 0.70 | 0.78 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-122M | 1200 | 20% | 1KHz | 1.330 | 0.64 | 0.79 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-152M | 1500 | 20% | 1KHz | 1.990 | 0.56 | 0.58 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-182M | 1800 | 20% | 1KHz | 2.180 | 0.48 | 0.54 | 12.5 Max 12.5 Max 10.0 Max |
| SDRI129-222M | 2200 | 20% | 1KHz | 2.580 | 0.43 | 0.52 | 12.5 Max 12.5 Max 10.0 Max |
Environmental Data:
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Test Equipment:
- Inductance (L): HP4284A or HP4285A LCR meter or equivalent
- Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284A + 42841A or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Product Identification:
Example: SDRI 129 220 M T
- Type: SDRI
- Series: 129
- Inductance: 220 (22 H)
- Inductance Tolerance: M (20%)
- Packing: T (Tape & Reel)
Package Dimensions (mm):
| Part No. | A (Max) | B (Max) | C (Max) | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SDRI129 | 12.5 | 12.5 | 10.0 | 5.0 | 7.6 | 2.9 | 7.0 | 5.4 |
Packaging:
Tape and Reel Specifications:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension H (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRI129 | 24 | 16 | 11.5 | 100 | 330 | 400 | 800 | 3200 |
Cover tape peel off condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Packing quantity:
- REEL, PE Bag, Inside Box, Outside Carton
Reliability Testing:
| Items | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet the above requirements without any loose terminal | 1. Pulling test: Define: A: sectional area of terminal A8mm, force5N, time:30sec; 8mm |
| Terminal Strength (DIP) | Meet the above requirements without any loose terminal. | 1. Terminal diameter(d) mm 0.35d 0.50, Applied force: 5N, Duration: 10sec. 2. Terminal diameter(d) mm 0.50d 0.80, Applied force: 10N, Duration: 10sec. 3. Terminal diameter(d) mm 0.80d 1.25, Applied force: 20N, Duration: 10sec. 4. Terminal diameter(d) mm D 1.25, Applied force: 40N, Duration: 10sec. Pull Force: applied gradually and maintained for 10 seconds. |
| Resistance to Flexure | 1. No visible mechanical damage. 2. Shown in diagram. 3. Flexure: 2mm. 4. Pressurizing Speed: 0.5mm/sec. 5. Keep time: 30 sec. | Solder the inductor to the test jig (glass epoxy board) using leadfree solder. Then apply a force in the direction shown. |
| Dropping | 1. No case deformation or change in appearance. 2. No short and no open. | Drop the packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | 1. No visible mechanical damage. 2. Wetting shall exceed 75% coverage. 3. Terminals must have 95% minimum solder coverage. | 1. Solder temperature: 2402. 2. Duration: 3 sec. 3. Solder: Sn/3.0Ag/0.5Cu. 4. Flux: 25% Resin and 75% ethanol in weight. |
| Vibration | 1. No visible mechanical damage. 2. Inductance change: Within 10%. 3. Q factor change: Within 20%. | 1. Solder the inductor to the testing jig (glass epoxy board) using leadfree solder. 2. Subjected to simple harmonic motion, total amplitude 1.5mm, frequency varied between 10 and 55 Hz. 3. Frequency range 10-55-10 Hz in approx. 1 minute. Applied for 2 hours in each of 3 mutually perpendicular directions (total 6 hours). |
| Thermal Shock | 1. No visible mechanical damage. 2. Inductance change: Within 10%. (Mn-Zn: Within 30%). 3. Q factor change: Within 20%. | 1. Start at (85~125) for T time, rush to (-55~-40) for T time as one cycle, go through 100 cycles. 2. Transforming interval: Max. 20 sec. 3. Tested cycle: 100 cycles. 4. Stabilize at normal condition for 1~2 hours. |
| Low temperature Storage | 1. No visible mechanical damage. 2. Inductance change: Within 10%. (Mn-Zn: Within 30%). 3. Q factor change: Within 20%. | 1. Temperature: M (-55~-402). 2. Duration: 962 hours. 3. Stabilize at normal condition for 1~2 hours before measuring. |
| High temperature Storage | 1. No visible mechanical damage. 2. Inductance change: Within 10%. (Mn-Zn: Within 30%). 3. Q factor change: Within 20%. | 1. Temperature: N (125~852). 2. Duration: 962 hours. 3. Stabilize at normal condition for 1~2 hours before measuring. |
| Damp Heat (Steady States) | 1. No visible mechanical damage. 2. Inductance change: Within 10%. (Mn-Zn: Within 30%). 3. Q factor change: Within 20%. | 1. Temperature: 602. 2. Humidity: 90% to 95% RH. 3. Duration: 962 hours. 4. Stabilize at normal condition for 1~2 hours before measuring. |
| Heat endurance of Reflow soldering | 1. No significant defects in appearance. 2. L/L10% (Mn-Zn: L/L30%). 3. Q/Q30% (SMD series only). 4. DCR/DCR10%. | 1. Refer to the recommended reflow curve and go through the reflow for twice. 2. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, then dry at room temp for 5Min, then brush 10 times. |
| Overload test | 1. During the test no smoke, no peculiar smell, no fire. 2. The characteristic is normal after test. | Apply twice the rated current for 5 minutes. |
| Voltage resistance test | 1. During the test no breakdown. 2. The characteristic is normal after test. | 1. For parts with two coils. 2. DC1000V, Current: 1mA, Time: 1Min. 3. Refer to catalogue of specific products. |
Recommended reflow soldering curve:
The recommended reflow conditions are set according to our soldering equipment. Due to variations in manufacturers' equipment, products, and process conditions, please adjust and confirm according to your environment/equipment.
Reminders for Using These Products:
- Storage period is within 12 months. Storage conditions: temperature: 5~40C, humidity: 35~65% RH or less. Soldering of terminal electrodes may deteriorate if storage period elapses.
- Do not use or store in environments with gas corrosion (salt, acid, alkali, etc.).
- Avoid direct contact with terminals by bare hands as oil secretions may inhibit soldering.
- Handle products carefully to prevent damage from dropping or inappropriate removal.
- Do not bend terminals with excessive stress to avoid wire fracture.
- Do not rinse coils. Contact SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance deterioration, or lifespan shortening.
- Self-heating (temperature increase) occurs when power is ON; ensure sufficient allowance for thermal design.
- For non-magnetic shield types, carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina