Surface Mount LanTu Micro SCD7850-4R7MT Unshielded SMD Power Inductors with RoHS Halogen Free Compliance
Price:
Negotiable
MOQ:
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Delivery Time:
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Product Description
Unshielded SMD Power Inductors - SCD7850 Series
Product Overview
The SCD7850 Series from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers unshielded SMD power inductors designed for surface mounting. These low-cost, silver-plated inductors feature a small size with high rated current capability and low DC resistance. They are suitable for a wide range of applications including VTR power supplies, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters. The series complies with RoHS, Halogen Free, and REACH standards.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SCD7850
- Type: Unshielded SMD Power Inductors
- Design: Silver plated type, Low cost design
- Certifications: RoHS, Halogen Free, REACH Compliance
- Packaging Options: Bulk Package (B), Tape & Reel (T)
Technical Specifications
General Specifications
| Parameter | Value |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Test Equipment (Inductance) | HP4284A, HP4285A or equivalent LCR meter |
| Test Equipment (Isat & Irms) | HP4284+42841A or equivalent |
| Test Equipment (SRF) | Agilent E4991A or equivalent |
| Test Equipment (DCR) | Chroma 16502 or equivalent |
Product Identification
Format: SCD 7850 [Inductance Code] [Tolerance Code] [Packing Code]
- Type Code: SCD
- Inductance Tolerance Codes: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
- Packing Codes: B (Bulk Package), T (Tape & Reel)
Dimensions
| Part No. | External Dimensions (LWH) (mm) | A (mm) | B (mm) | C (mm) | D (mm) | H (mm) | I (mm) | J (mm) |
|---|---|---|---|---|---|---|---|---|
| SCD7850 | 7.85.0H (H not specified) | 7.80.3 | 7.00.3 | 5.00.5 | 2.1 | 7.5 | 3.0 | 2.0 |
Electrical Characteristics (Examples from SCD7850 Series)
| Part No. | Inductance (H) | Tolerance | Test Frequency (L) | SRF (MHz) Min | DCR () Typ | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|---|
| SCD7850-1R0M | 1.0 | M (20%) | 100KHz | 145 | 0.013 | 7.00 | 5.20 |
| SCD7850-100M | 10 | M (20%) | 100KHz | 120 | 0.042 | 2.85 | 2.31 |
| SCD7850-470M | 47 | M (20%) | 100KHz | 41 | 0.176 | 1.28 | 1.10 |
| SCD7850-101M | 100 | M (20%) | 100KHz | 27 | 0.325 | 0.92 | 0.73 |
| SCD7850-102M | 1000 | M (20%) | 100KHz | 7 | 3.640 | 0.25 | 0.19 |
Note: Saturation Current is defined as the DC current at which inductance drops 10% from its value without current. Temperature Rise Current is the DC current when the temperature rise is T 40 (Ta=25). Rated DC Current is the lesser value of Isat or Irms.
Packaging Specifications
Tape and Reel Dimensions: (Dimensions are in mm)
| Part No. | Inductance (H) | Tolerance | Test Frequency (L) | SRF (MHz) Min | DCR () Typ | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|---|
| SCD7850-101M | 100 | M (20%) | 100KHz | 27 | 0.325 | 0.92 | 0.73 |
| SCD7850-102M | 1000 | M (20%) | 100KHz | 7 | 3.640 | 0.25 | 0.19 |
Reel Dimensions: A, B, C, D (Dimensions in mm)
Tape Dimension: W, P, W1 (Dimensions in mm)
Packing Quantity:
| Part No. | Tape Dimension W | P | W1 | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) | |
|---|---|---|---|---|---|---|---|
| SCD7850 | 16 | 12 | 7.5 | 16.4 | 100 | 3000 | 12,000 |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet specified force and duration requirements without loose terminals. | Pulling test based on GB/T 2423.60-2008. Solder paste thickness: 0.12mm. |
| Terminal Strength (DIP) | Meet specified force and duration requirements without loose terminals. | Pulling test based on GB/T 2423.60-2008, varying force with terminal diameter. |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997. Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | GB/T 2423.7-2018. Drop from 1m high, 1 angle, 3 ridges, 6 surfaces, twice each direction. |
| Solderability | Terminals must have 95% minimum solder coverage. Wetting shall exceed 75% coverage. | GB/T 2423.28-2005. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019. Simple harmonic motion, 10-55 Hz, 2 hours per direction (3 directions). Amplitude: 1.5mm. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na. 100 cycles of temperature shock (-55~40 to 85~125). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab. Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb. Temperature: 85~1252. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.3-2016. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | GJB 360B-2009. Peak temperature: 260+0/-5. Twice reflow. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993. Dip in IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | During test no smoke, no peculiar smell, no fire. Characteristics normal after test. | JIS C5311-6.13. Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test no breakdown. Characteristics normal after test. | MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Adjustments may be necessary based on specific user equipment and process conditions.
Reminders for Using These Products
- Storage period is within 12 months under conditions (5~40C, 35~65% RH).
- Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
- Do not touch terminals directly with bare hands to maintain solderability.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals excessively to avoid wire fracture.
- Do not rinse coils; contact the manufacturer if cleaning is required.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid overheating.
- Allow sufficient thermal design margin for self-heating when power is on.
- For non-magnetic shield types, carefully consider coil placement in PCB design to avoid malfunction due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
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16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina