Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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SMD Power Inductors Featuring LanTu Micro SNR8040-102MT for Graphic Cards and Portable Gaming Devices

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Price: Negotiable
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Delivery Time: Negotiable
Product Description

Product Overview

The SNR8040 Series are automatic assembly constructed, magnetic resin shielded SMD power inductors designed to minimize buzz noise to ultra-low levels. These inductors feature a closed magnetic circuit for reduced leakage flux and enhanced EMI resistance, a metallization on ferrite core for excellent shock resistance and durability, and a space-saving design that also conserves power. They are widely used in applications such as LED backlighting, flat-screen TVs, set-top boxes, notebooks, desktop computers, servers, graphic cards, portable gaming devices, personal navigation systems, multimedia devices, automotive systems, telecommunication base stations, and DC-DC converters. The series operates within an environmental temperature range of -40 to +125.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SNR8040
  • Type: Magnetic Resin Shielded SMD Power Inductors
  • Construction: Automatic assembly, magnetic resin shielded
  • Magnetic Circuit: Closed magnetic circuit design
  • Certifications: RoHS, Halogen Free, REACH Compliance

Technical Specifications

Part No. Inductance (H) Inductance Tolerance Test Frequency (KHz) Test Voltage (V) DCR () Typical DCR () Max Saturation Current (A) Max Temperature Rise Current (A) Max
SNR8040-1R0M 1.0 20% 100 1.0 0.008 0.010 9.85 6.30
SNR8040-1R5M 1.5 20% 100 1.0 0.010 0.013 8.15 5.65
SNR8040-2R2M 2.2 20% 100 1.0 0.012 0.015 7.10 5.15
SNR8040-3R3M 3.3 20% 100 1.0 0.017 0.022 6.50 4.40
SNR8040-3R6M 3.6 20% 100 1.0 0.017 0.022 6.50 4.35
SNR8040-4R7M 4.7 20% 100 1.0 0.019 0.024 5.90 4.10
SNR8040-5R6M 5.6 20% 100 1.0 0.021 0.027 4.55 3.85
SNR8040-6R8M 6.8 20% 100 1.0 0.024 0.031 4.55 3.60
SNR8040-8R2M 8.2 20% 1 1.0 0.026 0.033 4.20 3.45
SNR8040-100M 10 20% 100 1.0 0.029 0.037 3.60 3.30
SNR8040-150M 15 20% 100 1.0 0.047 0.061 2.95 2.80
SNR8040-180M 18 20% 100 1.0 0.053 0.068 2.70 2.40
SNR8040-220M 22 20% 100 1.0 0.069 0.089 2.40 2.10
SNR8040-270M 27 20% 100 1.0 0.078 0.101 2.15 2.00
SNR8040-330M 33 20% 100 1.0 0.097 0.126 2.05 1.80
SNR8040-390M 39 20% 100 1.0 0.107 0.139 1.95 1.70
SNR8040-470M 47 20% 100 1.0 0.136 0.176 1.75 1.55
SNR8040-680M 68 20% 100 1.0 0.196 0.254 1.45 1.25
SNR8040-820M 82 20% 100 1.0 0.225 0.292 1.30 1.15
SNR8040-101M 100 20% 100 1.0 0.290 0.377 1.15 1.00
SNR8040-121M 120 20% 100 1.0 0.334 0.434 1.12 0.95
SNR8040-151M 150 20% 100 1.0 0.410 0.553 1.10 0.85
SNR8040-221M 220 20% 100 1.0 0.599 0.778 0.85 0.80
SNR8040-331M 330 20% 100 1.0 0.889 1.155 0.68 0.64
SNR8040-471M 470 20% 100 1.0 1.260 1.625 0.60 0.50
SNR8040-681M 680 20% 100 1.0 2.040 2.652 0.50 0.45
SNR8040-102M 1000 20% 100 1.0 2.800 3.640 0.40 0.35
External Dimensions (LWH) (mm): 8.08.04.0
Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Inductance Tolerance Options: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing: B (Bulk Package), T (Tape & Reel)
Recommended Land Pattern (mm) A B C D E F G H
SNR8040 8.00.3 8.00.3 4.0 Max 4.00.3 6.30.3 2.2 Typ 3.8 Typ 7.5 Typ
Tape and Reel Specifications (mm) W P W1 Reel (PCS) Inside Box (PCS) Outside Carton (PCS)
SNR8040 16 12 7.5 100 3000 12,000
Reliability Test Items Requirements Test Methods and Remarks
Terminal Strength (SMT) Meet requirements without any loose terminal. Pulling test based on sectional area; Solder paste thickness: 0.12mm; Keep time: 101s; Speed: 1.0mm/s.
Terminal Strength (DIP) Meet requirements without any loose terminal. Applied force based on terminal diameter (0.35mm to >1.25mm); Duration: 10sec.
Resistance to Flexure No visible mechanical damage. Solder to jig, apply force (Flexure: 2mm, Speed: 0.5mm/sec, Keep time: 30 sec).
Dropping No case deformation or change in appearance; No short and no open. Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction.
Solderability Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage. Solder temperature: 2402; Duration: 3 sec; Solder: Sn/3.0Ag/0.5Cu; Flux: 25% Resin and 75% ethanol.
Vibration No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. Solder to jig, subjected to harmonic motion (Amplitude 1.5mm, Frequency 10-55 Hz), 2 hours in 3 directions.
Thermal Shock No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. 100 cycles of temperature shock (-55~40 to 85~125); Transforming interval: Max. 20 sec.
Low temperature Storage No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. Temperature: -55~-402; Duration: 962 hours.
High temperature Storage No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. Temperature: 85~1252; Duration: 962 hours.
Damp Heat (Steady States) No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours.
Heat endurance of Reflow soldering No significant defects in appearance; L/L10%; Q/Q30%; DCR/DCR10%. Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. Dip parts into IPA solvent for 50.5Min, dry for 5Min, brush 10 times.
Overload test No smoke, no peculiar smell, no fire during test; Characteristics normal after test. Apply twice rated current for 5 minutes.
Voltage resistance test No breakdown during test; Characteristics normal after test. DC1000V, Current: 1mA, Time: 1Min (for parts with two coils).

Recommended reflow soldering curve: The recommended reflow conditions are set according to our soldering equipment. Users should adjust and confirm according to their environment/equipment.

Reminders for Using These Products:

  • Storage period within 12 months under conditions (temperature: 5~40C, humidity: 35 to 65% RH or less).
  • Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
  • Avoid direct contact with terminals by bare hands to prevent soldering issues.
  • Handle products carefully to prevent damage from dropping or inappropriate removal.
  • Do not bend terminals excessively to avoid wire fracture.
  • Do not rinse coils; contact the company if cleaning is necessary.
  • Do not expose products to magnets or magnetic fields.
  • Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance degradation, or lifespan reduction.
  • Ensure sufficient thermal design margin due to self-heating when power is on.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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