Unshielded DIP Power Inductors - SPK Series

Product Overview
The SPK Series Unshielded DIP Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for spike suppression and general power applications. These inductors offer a low-cost solution with high power handling, high saturation, and low resistance. Their unshielded construction, combined with a core encapsulated in UL heat shrink tubing, provides excellent mechanical and environmental protection. Available in various package sizes and a wide inductance range, they are suitable for automated insertion processes and meet RoHS, Halogen Free, and REACH compliance. Ideal for use in consumer electronics, telecommunication devices, and power conversion circuits.

Product Attributes

• Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Series: SPK Series
• Type: Unshielded Power Inductor, Radial Leaded Fixed Inductors
• Certifications: RoHS, Halogen Free, REACH Compliance
• Packaging Options: Tape packaging for auto-insertion, Bulk Package

Technical Specifications

Applications

• TVs and Audio equipment
• Telecommunication devices
• Noise filters
• Chargers, fast charge
• DC/DC converters

Test Equipment

• Inductance: HP4284A, HP4285A LCR meter or equivalent
• Saturation & RMS Current: HP4284+42841A or equivalent
• Self-Resonant Frequency (SRF): HM 9461 or equivalent
• Quality Factor (Q): HP4285A or equivalent
• DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification Example

SPK 0608 503 K TF

• SPK: Series
• 0608: External Dimensions (LH) (mm)
• 503: Inductance (50 mH)
• K: Inductance Tolerance (10%)
• TF: Packaging (Tape)

Packaging

Reminders for Using These Products

• Storage period: within 12 months. Conditions: temperature 5~40C, humidity 35~65% RH or less.
• Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
• Do not touch electrodes directly with bare hands to avoid reduced solderability.
• Handle products carefully to prevent damage from dropping or improper removal.
• Do not bend terminals with excessive stress to prevent wire fracture.
• Do not rinse coils; contact the manufacturer if cleaning is necessary.
• Keep products away from magnets or magnetic fields.
• Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
• Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance degradation, or reduced lifespan.
• Consider self-heating when designing for thermal management.
• For non-magnetic shield types, careful coil layout is needed to prevent malfunctions due to magnetic interference.