High reliability power inductor LanTu Micro SMS252010 R68MT with ultra low AC losses and thin design
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Product Description
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS252010 Series is an ultra-high current SMD power inductor featuring a thin design with low DC resistance and ultra-high current capabilities. Its magnetic shielding provides strong anti-electromagnetic interference, making it suitable for high-density installations. The T-core molding structure ensures high reliability and excellent vibration resistance. With extremely low DCR and ultra-low AC losses, these inductors are ideal for high switching frequencies. They are compliant with RoHS, Halogen Free, and REACH standards.
Applications include DC/DC converters for notebook PC CPUs, mobile phones, tablets, HDDs, DVCs, PDAs, 5G modules, servers, base stations, and various DC-DC conversion power modules.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Series: SMS252010 Series
- Type: Common Mode Choke, Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by company name and location)
Technical Specifications
| Part No. | Inductance (H) | Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical | Dimensions (LWH mm) | Operating Temperature (C) |
|---|---|---|---|---|---|---|---|---|
| SMS252010-R22M | 0.22 | 20% | 12.0 | 17.0 | 8.60 | 6.80 | 2.52.01.0 | -40 to +125 |
| SMS252010-R24M | 0.24 | 20% | 12.0 | 17.5 | 8.50 | 6.70 | 2.52.01.0 | -40 to +125 |
| SMS252010-R33M | 0.33 | 20% | 13.0 | 19.0 | 7.60 | 6.50 | 2.52.01.0 | -40 to +125 |
| SMS252010-R47M | 0.47 | 20% | 15.0 | 22.0 | 6.90 | 6.10 | 2.52.01.0 | -40 to +125 |
| SMS252010-R68M | 0.68 | 20% | 23.0 | 27.0 | 5.90 | 5.60 | 2.52.01.0 | -40 to +125 |
| SMS252010-1R0M | 1.0 | 20% | 25.0 | 30.0 | 5.40 | 4.70 | 2.52.01.0 | -40 to +125 |
| SMS252010-1R5M | 1.5 | 20% | 45.0 | 55.0 | 4.30 | 3.40 | 2.52.01.0 | -40 to +125 |
| SMS252010-2R2M | 2.2 | 20% | 62.0 | 70.0 | 3.30 | 2.40 | 2.52.01.0 | -40 to +125 |
| SMS252010-3R3M | 3.3 | 20% | 86.0 | 100.0 | 2.80 | 2.50 | 2.52.01.0 | -40 to +125 |
| SMS252010-4R7M | 4.7 | 20% | 160.0 | 180.0 | 2.60 | 2.00 | 2.52.01.0 | -40 to +125 |
| SMS252010-6R8M | 6.8 | 20% | 270.0 | 320.0 | 2.40 | 1.60 | 2.52.01.0 | -40 to +125 |
| SMS252010-100M | 10 | 20% | 500.0 | 560.0 | 1.55 | 1.05 | 2.52.01.0 | -40 to +125 |
| SMS252010-220M | 22 | 20% | 1100.0 | 1300.0 | 1.10 | 0.85 | 2.52.01.0 | -40 to +125 |
| Product Identification | Component | Description |
|---|---|---|
| SMS 252010 R47 M T | SMS | Molding SMD Power Inductor |
| SMS 252010 R47 M T | 252010 | External Dimensions (LWH) (mm): 2.52.01.0 |
| SMS 252010 R47 M T | R47 | Inductance: 0.47 uH |
| SMS 252010 R47 M T | M | Inductance Tolerance: 20% (Other tolerances: J:5%, K: 10%, L: 15%, P: 25%, N: 30%) |
| SMS 252010 R47 M T | T | Packing: Tape & Reel (Other packing: B: Bulk Package) |
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Defined by sectional area of terminal and applied force/time | Reference documents: GB/T 2423.60-2008 |
| Terminal Strength (DIP) | Defined by terminal diameter and applied force/time | Reference documents: GB/T 2423.60-2008 |
| Resistance to Flexure | No visible mechanical damage. Flexure: 2mm. | JIS C 5321:1997 |
| Dropping | No case deformation or change in appearance. No short and no open. | GB/T 2423.7-2018. Drop from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | GB/T 2423.28-2005. Solder temperature: 2402, Duration: 3 sec. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019. Total amplitude of 1.5mm, frequency 10 to 55 Hz and return, 2 hours in each 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na. 100 cycles of temperature transition from (85~125) to (-55~40). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab. Temperature: -55~-402, Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb. Temperature: 125~852, Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.3-2016. Temperature: 602, Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30%. DCR/DCR10%. | GJB 360B-2009. Peak temperature: 260+0/-5, twice reflow. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993. Dip into IPA solvent for 50.5Min, drying 5Min, brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. The characteristic is normal after test. | JIS C5311-6.13. Apply twice rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. The characteristic is normal after test. | MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min. |
| Tape and Reel Specifications | Dimension W (mm) | Dimension P (mm) | Dimension W1 (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|
| SMS252010 | 8.0 | 4.0 | 3.5 | 3000 | 30,000 | 120,000 |
Recommended reflow soldering curve
The recommended reflow conditions are set according to the soldering equipment. Users should adjust and confirm according to their specific environment/equipment.
Reminders for Using These Products
- Storage: Within 12 months. Conditions: temperature 5~40C, humidity 35~65% RH or less.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid touching electrodes directly with bare hands. Handle carefully to prevent damage.
- Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact SXN if cleaning is necessary.
- Magnetism: Do not expose to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform after mounting within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Self-Heating: Devices generate heat when powered on; ensure sufficient thermal design margin.
- Non-Magnetic Shield Type: Careful coil layout is required to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina