RoHS Halogen Free Shielded SMD Power Inductors LanTu Micro SDRI74-221MT with High Saturation Current
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Product Description
Shielded SMD Power Inductors - SDRI74 Series
Product Overview
The SDRI74 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power supply applications. Featuring a closed magnetic circuit design to minimize leakage flux, these inductors offer high saturation current and low DC resistance. Their high-precision dimensions ensure suitability for automatic mounting, and they are available in various package sizes and inductance ranges. These inductors comply with RoHS, Halogen Free, and REACH standards, making them ideal for demanding electronic applications.
Product Attributes
- Brand: LANTU MICRO
- Origin: SHENZHEN, CHINA
- Series: SDRI74
- Certifications: RoHS, Halogen Free, REACH Compliance
- Design: Shielded SMD Power Inductors, Closed Magnetic Circuit
Technical Specifications
General Specifications:
| Item | Specification |
|---|---|
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) |
| Test Equipment (Inductance) | HP4284A, HP4285A or equivalent |
| Test Equipment (Current) | HP4284+42841A or equivalent |
| Test Equipment (Q Factor) | HP4285A or equivalent |
| Test Equipment (DCR) | Chroma 16502 or equivalent |
Product Identification:
| Component | Description |
|---|---|
| SDRI | Shielded SMD Power Inductors (Closed Magnetic Circuit) |
| 74 | External Dimensions (LWH): 7.57.54.5 mm |
| Inductance Value | e.g., 470 (47 H) |
| Inductance Tolerance | J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% |
| Packing | T: Tape & Reel, B: Bulk Package |
Electrical Characteristics:
| Part No. | Inductance (H) @ 0A | Tolerance | Test Freq (100KHz) | Q Factor Min @ 1MHz | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|---|
| SDRI74-2R2N | 2.2 | 30% | 100KHz | 30 | 0.0147 | 5.20 | 5.00 |
| SDRI74-3R3N | 3.3 | 30% | 100KHz | 30 | 0.0214 | 4.60 | 4.00 |
| SDRI74-4R7N | 4.7 | 30% | 100KHz | 30 | 0.0310 | 3.80 | 3.40 |
| SDRI74-6R8N | 6.8 | 30% | 100KHz | 30 | 0.035 | 3.20 | 2.30 |
| SDRI74-8R2N | 8.2 | 30% | 100KHz | 30 | 0.042 | 3.00 | 2.10 |
| SDRI74-100N | 10 | 30% | 100KHz | 35 | 0.049 | 2.95 | 1.84 |
| SDRI74-120M | 12 | 20% | 100KHz | 35 | 0.058 | 2.85 | 1.71 |
| SDRI74-150M | 15 | 20% | 100KHz | 35 | 0.081 | 2.80 | 1.47 |
| SDRI74-180M | 18 | 20% | 100KHz | 35 | 0.091 | 2.50 | 1.31 |
| SDRI74-220M | 22 | 20% | 100KHz | 35 | 0.110 | 2.10 | 1.23 |
| SDRI74-270M | 27 | 20% | 100KHz | 35 | 0.150 | 1.90 | 1.12 |
| SDRI74-330M | 33 | 20% | 100KHz | 35 | 0.170 | 1.80 | 0.96 |
| SDRI74-390M | 39 | 20% | 100KHz | 35 | 0.230 | 1.70 | 0.91 |
| SDRI74-470M | 47 | 20% | 100KHz | 35 | 0.260 | 1.50 | 0.88 |
| SDRI74-560M | 56 | 20% | 100KHz | 35 | 0.350 | 1.32 | 0.75 |
| SDRI74-680M | 68 | 20% | 100KHz | 35 | 0.380 | 1.08 | 0.69 |
| SDRI74-820M | 82 | 20% | 100KHz | 35 | 0.430 | 1.05 | 0.61 |
| SDRI74-101M | 100 | 20% | 100KHz | 40 | 0.610 | 1.02 | 0.60 |
| SDRI74-121M | 120 | 20% | 100KHz | 40 | 0.660 | 0.98 | 0.52 |
| SDRI74-151M | 150 | 20% | 100KHz | 40 | 0.880 | 0.95 | 0.46 |
| SDRI74-181M | 180 | 20% | 100KHz | 40 | 0.980 | 0.74 | 0.42 |
| SDRI74-221M | 220 | 20% | 100KHz | 40 | 1.170 | 0.70 | 0.36 |
| SDRI74-271M | 270 | 20% | 100KHz | 40 | 1.640 | 0.57 | 0.34 |
| SDRI74-331M | 330 | 20% | 100KHz | 40 | 1.860 | 0.56 | 0.32 |
| SDRI74-391M | 390 | 20% | 100KHz | 40 | 2.850 | 0.45 | 0.29 |
| SDRI74-471M | 470 | 20% | 100KHz | 40 | 3.010 | 0.45 | 0.26 |
| SDRI74-561M | 560 | 20% | 100KHz | 40 | 3.620 | 0.43 | 0.23 |
| SDRI74-681M | 680 | 20% | 100KHz | 40 | 4.630 | 0.37 | 0.22 |
| SDRI74-821M | 820 | 20% | 100KHz | 40 | 5.200 | 0.35 | 0.20 |
| SDRI74-102M | 1000 | 20% | 100KHz | 40 | 6.000 | 0.33 | 0.18 |
Definitions:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat and Irms.
Dimensions (mm):
| Part No. | A (Max) | B (Max) | C (Max) | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SDRI74 | 7.5 | 7.5 | 4.5 | 1.8 | 5.0 | 1.6 | 4.8 | 2.2 |
Applications:
- Power supply for VTRs
- LCD televisions
- Notebook PCs
- Portable communication equipment
- DC/DC converters
Packaging:
| Part No. | Tape Dimension W | P | H | Reel Dimensions A | B | C | D | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRI74 | 16 | 12 | 11.5 | 16.5 | 100 | 13 | 330 | 1000 | 3000 | 12,000 |
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet specified pull force requirements without loose terminals. | Pulling test (GB/T 2423.60-2008), Solder paste thickness: 0.12mm. |
| Terminal Strength (DIP) | Meet specified pull force requirements without loose terminals. | Pulling test (GB/T 2423.60-2008) based on terminal diameter. |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997, Flexure: 2mm, Speed: 0.5mm/sec, Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance, no short and no open. | GB/T 2423.7-2018, Drop from 1m height in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage, Terminals must have 95% minimum solder coverage. | GB/T 2423.28-2005, Solder temp: 2402, Duration: 3 sec. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019, Simple harmonic motion, 10 to 55 Hz, 2 hours in each 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na, 100 cycles (85~125 to -55~40). |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab, Temperature: -55~-402, Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb, Temperature: 125~852, Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.3-2016, Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | GJB 360B-2009, Peak temperature: 260+0/-5, twice reflow. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993, Dip into IPA solvent for 50.5Min, dry for 5Min, brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristics normal after test. | JIS C5311-6.13, Apply twice rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. Characteristics normal after test. | MIL-STD-202G Method 301, DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve:
Refer to the provided graph for recommended reflow conditions. Adjustments may be necessary based on user's environment and equipment.
Reminders for Using These Products:
- Storage Period: Within 12 months. Conditions: 5~40C, 35~65% RH.
- Avoid use or storage in corrosive gas environments (salt, acid, alkali, etc.).
- Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals excessively to avoid wire fracture.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid overheating.
- Allow sufficient thermal design margin for self-heating when power is ON.
- For non-magnetic shield types, carefully lay out coils on the PCB to prevent malfunction due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina