LanTu Micro SMS0650 100MT molding SMD power inductor for high density installation and low impedance
Product Overview
The SMS0650 Series Ultra-high current SMD power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-density installation applications requiring low DC resistance and ultra-high current capabilities. Featuring a thin, magnetically shielded design for strong anti-electromagnetic interference, these inductors offer high reliability with an integral construction for excellent vibration resistance. Their composite structure minimizes buzz noise, while the use of low-loss alloy powder in die-casting ensures low impedance and small parasitic capacitance, contributing to high efficiency and reduced core eddy-current loss. These inductors support frequencies up to 3MHz and have an absolute maximum voltage of 30VDC, complying with RoHS, Halogen Free, and REACH standards. Ideal for PDA, notebook, desktop, server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS0650
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by company name and location)
Technical Specifications
| Part No. | Inductance (L(H) @0A) | Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical | Dimensions (LWH) (mm) | Frequency (MHz) | Max Voltage (VDC) | Operating Temperature (C) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS0650-R22M | 0.22 | 20% | 1.1 | 1.3 | 40.00 | 30.00 | 7.16.65.0 | Up to 3 | 30 | -55 to +125 (incl. self-temp. rise) |
| SMS0650-R47M | 0.47 | 20% | 3.2 | 3.8 | 24.00 | 20.00 | ||||
| SMS0650-R56M | 0.56 | 20% | 3.4 | 3.9 | 20.00 | 18.00 | ||||
| SMS0650-R68M | 0.68 | 20% | 3.9 | 4.2 | 17.00 | 17.50 | ||||
| SMS0650-R82M | 0.82 | 20% | 4.6 | 4.9 | 17.00 | 17.00 | ||||
| SMS0650-1R0M | 1.00 | 20% | 6.5 | 8.5 | 16.50 | 13.00 | ||||
| SMS0650-1R5M | 1.50 | 20% | 7.0 | 10.0 | 12.70 | 12.00 | ||||
| SMS0650-2R2M | 2.20 | 20% | 11.2 | 13.6 | 12.50 | 11.00 | ||||
| SMS0650-3R3M | 3.30 | 20% | 20.0 | 22.0 | 9.00 | 8.50 | ||||
| SMS0650-4R7M | 4.70 | 20% | 26.0 | 30.0 | 8.00 | 6.70 | ||||
| SMS0650-5R6M | 5.60 | 20% | 31.0 | 36.0 | 7.60 | 5.80 | ||||
| SMS0650-6R8M | 6.80 | 20% | 36.5 | 41.0 | 7.30 | 5.50 | ||||
| SMS0650-100M | 10.00 | 20% | 48.0 | 55.0 | 5.50 | 4.70 | ||||
| SMS0650-150M | 15.00 | 20% | 77.0 | 85.0 | 5.00 | 4.00 | ||||
| SMS0650-220M | 22.00 | 20% | 125.0 | 140.0 | 4.00 | 3.20 | ||||
| SMS0650-330M | 33.00 | 20% | 150.0 | 200.0 | 3.30 | 2.80 | 7.16.65.0 | |||
| SMS0650-470M | 47.00 | 20% | 260.0 | 300.0 | 2.80 | 2.20 | ||||
| SMS0650-680M | 68.00 | 20% | 340.0 | 442.0 | 2.20 | 1.80 | ||||
| SMS0650-101M | 100.00 | 20% | 595.0 | 720.0 | 2.00 | 1.50 | 7.16.65.0 | Up to 3 | 30 | -55 to +125 (incl. self-temp. rise) |
Shape and Dimensions (mm):
| Part No. | A | B | C (Max) | D (Typ) | E (Typ) | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SMS0650 | 7.100.30 | 6.600.20 | 5.00 | 3.00 | 1.60 | 3.70 | 8.40 | 3.50 |
Inductance Tolerance Codes: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packing Codes: B: Bulk Package, T: Tape & Reel
Current Definitions:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat or Irms.
Note on Part Temperature: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on terminal area (A8mm, 8mm |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force based on terminal diameter (d). Keep time: 10 sec. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | Inductance change: Within 10%. Q factor change: Within 20%. | Frequency: 10 to 55 Hz and return. Duration: 2 hours in each 3 mutually perpendicular directions. |
| Thermal Shock | Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | 100 cycles. Start at (85~125) for T time, rush to (-55~40) for T time. Transforming interval: Max. 20 sec. |
| Low temperature Storage | Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | L/L10% (Mn-Zn: 30%). Q/Q30% (SMD series only). DCR/DCR10%. | Peak temperature: 260+0/-5. Performed twice. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip into IPA solvent for 50.5Min, dry for 5Min, then brush 10 times. |
| Overload test | No smoke, no peculiar smell, no fire during test. Characteristics are normal after test. | Apply twice the rated current for 5 minutes. |
| Voltage resistance test | No breakdown during test. Characteristics are normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve: Conditions should be adjusted and confirmed according to user's environment/equipment.
Reminders for Using These Products:
- Storage: Within 12 months, under conditions (temperature: 5~40C, humidity: 35~65% RH or less). Soldering of terminal electrodes may deteriorate if storage period elapses.
- Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions. Handle products carefully to prevent damage.
- Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact the company if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Self Heating: Allow sufficient margin for thermal design as self-heating occurs when power is ON.
- Non-magnetic Shield Type: Carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.
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