Axial fixed inductors LanTu Micro AL0510-470K designed for televisions computers radios and chargers
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Product Description
Axial Fixed Inductors - AL0510 Series
Product Overview
The AL0510 Series Axial Fixed Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance RF chokes. These compact, lightweight inductors feature epoxy resin coating for humidity resistance and long life. They offer a wide inductance range, high Q factors, and self-resonant frequencies, making them suitable for automated insertion processes. Compliant with RoHS, Halogen Free, and REACH standards, this series is ideal for various electronic applications including televisions, personal computers, radios, telephones, and chargers.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: AL0510 Series
- Type: Axial Fixed Inductors
- Coating: Epoxy resin
- Certifications: RoHS, Halogen Free, REACH Compliance
- Packaging Options: Tape packaging for auto-insertion, Bulk Package
Technical Specifications
General Specifications:
| Attribute | Value |
|---|---|
| Operating Temperature | -25 to +85 (Including coils self-temperature rise) |
| External Dimensions (L x H) | 5.0 x 11.0 mm (for AL0510 series) |
| Lead Diameter | 0.600.1 mm |
Electrical Characteristics (Electrical specifications at 25):
| Part No | Inductance (uH) | Tolerance | Q Min @ Test Freq. (MHz) | SRF Min (MHz) | DCR Max () | Rated Current (mA) Max |
|---|---|---|---|---|---|---|
| AL0510-3R3M | 3.3 | 20% | 20 @ 7.96MHz | - | 0.18 | 1100 |
| AL0510-4R7M | 4.7 | 20% | 20 @ 7.96MHz | - | 0.20 | 1000 |
| AL0510-6R8M | 6.8 | 20% | 20 @ 7.96MHz | - | 0.25 | 790 |
| AL0510-100K | 10 | 10% | 15 @ 7.96MHz | - | 0.45 | 750 |
| AL0510-150K | 15 | 10% | 15 @ 7.96MHz | - | 0.50 | 650 |
| AL0510-220K | 22 | 10% | 30 @ 2.52MHz | - | 0.65 | 500 |
| AL0510-330K | 33 | 10% | 30 @ 2.52MHz | - | 0.75 | 400 |
| AL0510-470K | 47 | 10% | 30 @ 2.52MHz | - | 0.8 | 370 |
| AL0510-680K | 68 | 10% | 30 @ 2.52MHz | - | 0.8 | 350 |
| AL0510-820K | 82 | 10% | 20 @ 2.52MHz | - | 0.82 | 330 |
| AL0510-101K | 100 | 10% | 20 @ 2.52MHz | - | 0.90 | 300 |
| AL0510-121K | 120 | 10% | 20 @ 0.796MHz | - | 1.20 | 250 |
| AL0510-151K | 150 | 10% | 20 @ 0.796MHz | - | 1.80 | 225 |
| AL0510-181K | 180 | 10% | 20 @ 0.796MHz | - | 2.00 | 200 |
| AL0510-221K | 220 | 10% | 30 @ 0.796MHz | - | 2.10 | 180 |
| AL0510-271K | 270 | 10% | 30 @ 0.796MHz | - | 2.50 | 170 |
| AL0510-331K | 330 | 10% | 30 @ 0.796MHz | - | 3.00 | 160 |
| AL0510-391K | 390 | 10% | 30 @ 0.796MHz | - | 3.50 | 150 |
| AL0510-471K | 470 | 10% | 30 @ 0.796MHz | - | 4.00 | 140 |
| AL0510-561K | 560 | 10% | 30 @ 0.796MHz | - | 5.40 | 130 |
| AL0510-681K | 680 | 10% | 40 @ 0.796MHz | - | 6.00 | 120 |
| AL0510-821K | 820 | 10% | 50 @ 0.796MHz | - | 7.50 | 110 |
| AL0510-102K | 1000 | 10% | 50 @ 0.252MHz | - | 8.00 | 100 |
| AL0510-122K | 1200 | 10% | 60 @ 0.252MHz | - | 14.50 | 95 |
| AL0510-152K | 1500 | 10% | 60 @ 0.252MHz | - | 16.50 | 90 |
| AL0510-182K | 1800 | 10% | 60 @ 0.252MHz | - | 19.00 | 85 |
| AL0510-222K | 2200 | 10% | 60 @ 0.252MHz | - | 27.50 | 80 |
| AL0510-272K | 2700 | 10% | 60 @ 0.252MHz | - | 40.00 | 75 |
| AL0510-332K | 3300 | 10% | 50 @ 0.252MHz | - | 50.00 | 62 |
| AL0510-392K | 3900 | 10% | 50 @ 0.252MHz | - | 53.00 | 59 |
| AL0510-472K | 4700 | 10% | 50 @ 0.252MHz | - | 60.00 | 55 |
| AL0510-562K | 5600 | 10% | 50 @ 0.252MHz | - | 64.00 | 40 |
| AL0510-682K | 6800 | 10% | 50 @ 0.252MHz | - | 73.00 | 35 |
| AL0510-822K | 8200 | 10% | 30 @ 0.252MHz | - | 80.00 | 30 |
| AL0510-103K | 10000 | 10% | 25 @ 79.6KHz | - | 132.00 | 25 |
| AL0510-123K | 12000 | 10% | 25 @ 79.6KHz | - | 143.00 | 20 |
| AL0510-153K | 15000 | 10% | 25 @ 79.6KHz | - | 166.00 | 18 |
| AL0510-183K | 18000 | 10% | 25 @ 79.6KHz | - | 185.00 | 15 |
| AL0510-223K | 22000 | 10% | 20 @ 79.6KHz | - | 330.00 | 12 |
| AL0510-273K | 27000 | 10% | 20 @ 79.6KHz | - | 370.00 | 10 |
| AL0510-333K | 33000 | 10% | 40 @ 79.6KHz | - | 240.00 | 10 |
Current Definitions:
- Saturation Current (Isat): The current at which inductance drops by 10% from its initial value (Ta=25).
- Temperature Rise Current (Irms): The DC current that causes a temperature rise of T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat and Irms.
Applications:
- Televisions, personal computers
- Radios, telephones
- Chargers, fast charge
- Other various electronic products
Test Equipment:
- Inductance (L): HP4284A, HP4285A LCR meter or equivalent
- Current (Isat & Irms): HP4284+42841A
- Self-Resonant Frequency (SRF): HM 9461
- Quality Factor (Q): HP4285A
- DC Resistance (DCR): Chroma 16502 or equivalent
Product Identification:
Format: AL 0510 [Inductance Value] [Tolerance] [Packing]
- Inductance Value: e.g., 100 for 10 uH
- Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
- Packing: B for Bulk Package, TF for Tape
Packaging:
| Series Type | Packaging | Quantity (pcs) | Carton Size (mm) (L x W x H) | Parts/Box | Parts/Reel | Parts/Carton |
|---|---|---|---|---|---|---|
| T5A | Tape and reel | 1000 | 440 x 275 x 392 | - | - | 24,000 |
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT/DIP) | Meet specified force and duration requirements without loose terminals. | Reference documents: GB/T 2423.60-2008. Specific forces and durations vary based on terminal size. |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997. Flexure: 2mm, Speed: 0.5mm/s, Keep time: 30s. |
| Dropping | No case deformation or change in appearance; no short and no open. | GB/T 2423.7-2018. Packaged products dropped from 1m high. |
| Solderability | Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage. | GB/T 2423.28-2005. Solder temperature: 2402, Duration: 3s. |
| Vibration | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | GB/T 2423.10-2019. Frequency 10-55 Hz, Amplitude 1.5mm, 2 hours per direction. |
| Thermal Shock | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na. 100 cycles between (85~125) and (-55~40). |
| Low temperature Storage | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab. Temperature: -55~-402, Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb. Temperature: 125~852, Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | GB/T 2423.3-2016. Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance; L/L10%; Q/Q30% (SMD series only); DCR/DCR10%. | GJB 360B-2009. Peak temperature: 260+0/-5. Tested twice. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | IAL 68-2-45:1993. Dip in IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristics normal after test. | JIS C5311-6.13. Apply twice the rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. Characteristics normal after test. | MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min. |
Reminders for Using These Products:
- Storage: Within 12 months, under 5~40C and 35~65% RH. Deterioration of solderability may occur if storage period elapses.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid touching terminals directly with bare hands due to oil secretions. Handle products carefully to prevent damage.
- Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact SXN if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Correction: Post-mounting soldering corrections must be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Self-Heating: Account for self-heating (temperature increase) when power is on; ensure sufficient thermal design margin.
- Non-Magnetic Shield Type: Carefully lay out coils on the PCB design to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina