Ultra high current thin design SMD power inductor LanTu Micro SMS1050-1R5MT with magnetic shielding and low impedance
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Product Description
Product Overview
The SMS1050 Series from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are ultra-high current, thin design SMD power inductors featuring magnetic shielding for strong anti-electromagnetic interference, making them suitable for high-density installations. These high-reliability inductors utilize an integral construction for excellent vibration resistance and a composite structure for ultra-low buzz noise. They are manufactured using low-loss alloy powder die-casting, resulting in low impedance, small parasitic capacitance, high efficiency, and reduced winding DC resistance and core eddy-current loss. Operating at frequencies up to 3MHz with a maximum insulation voltage of 30VDC, these inductors comply with RoHS, Halogen Free, and REACH standards. They are ideal for applications such as PDA, notebook, desktop, and server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Series: SMS1050
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
- Construction: Integral construction, Composite structure, Magnetic shielding
- Manufacturing Process: Die-casting by low loss alloy powder
Technical Specifications
| Product Model | Inductance (H) | Tolerance | DCR (m) Typical | Saturation Current (A) Typical | Heat Rating Current (A) Typical |
|---|---|---|---|---|---|
| SMS1050-R82M | 0.82 | 20% | 2.5 | 39.00 | 22.00 |
| SMS1050-1R0M | 1.0 | 20% | 2.8 | 30.00 | 20.30 |
| SMS1050-1R2M | 1.2 | 20% | 2.8 | 28.00 | 18.00 |
| SMS1050-1R5M | 1.5 | 20% | 3.9 | 25.00 | 16.00 |
| SMS1050-2R2M | 2.2 | 20% | 6.5 | 20.00 | 13.00 |
| SMS1050-3R3M | 3.3 | 20% | 9.2 | 18.00 | 10.00 |
| SMS1050-4R7M | 4.7 | 20% | 12.4 | 14.00 | 9.50 |
| SMS1050-5R6M | 5.6 | 20% | 18.9 | 13.00 | 8.50 |
| SMS1050-6R8M | 6.8 | 20% | 20.6 | 12.00 | 8.00 |
| SMS1050-8R2M | 8.2 | 20% | 27.4 | 10.00 | 7.00 |
| SMS1050-100M | 10 | 20% | 30.2 | 8.50 | 5.50 |
| SMS1050-150M | 15 | 20% | 48.0 | 7.00 | 4.50 |
| SMS1050-220M | 22 | 20% | 60.0 | 5.50 | 4.00 |
| SMS1050-330M | 33 | 20% | 89.0 | 5.50 | 3.50 |
| SMS1050-470M | 47 | 20% | 110.0 | 4.50 | 3.00 |
| SMS1050-680M | 68 | 20% | 190.0 | 3.00 | 2.00 |
| Part No | Inductance (H) | Inductance Tolerance | DCR (m) Max | Saturation Current (A) Max | Heat Rating Current (A) Max |
|---|---|---|---|---|---|
| SMS1050-R82M | 0.82 | 20% | 3.2 | 22.00 | 39.00 |
| SMS1050-1R0M | 1.0 | 20% | 3.5 | 20.30 | 30.00 |
| SMS1050-1R2M | 1.2 | 20% | 3.5 | 18.00 | 28.00 |
| SMS1050-1R5M | 1.5 | 20% | 4.8 | 16.00 | 25.00 |
| SMS1050-2R2M | 2.2 | 20% | 8.2 | 13.00 | 20.00 |
| SMS1050-3R3M | 3.3 | 20% | 12.0 | 10.00 | 18.00 |
| SMS1050-4R7M | 4.7 | 20% | 18.0 | 9.50 | 14.00 |
| SMS1050-5R6M | 5.6 | 20% | 25.0 | 8.50 | 13.00 |
| SMS1050-6R8M | 6.8 | 20% | 28.0 | 8.00 | 12.00 |
| SMS1050-8R2M | 8.2 | 20% | 35.0 | 7.00 | 10.00 |
| SMS1050-100M | 10 | 20% | 40.0 | 5.50 | 8.50 |
| SMS1050-150M | 15 | 20% | 55.0 | 4.50 | 7.00 |
| SMS1050-220M | 22 | 20% | 72.0 | 4.00 | 5.50 |
| SMS1050-330M | 33 | 20% | 105.0 | 3.50 | 5.50 |
| SMS1050-470M | 47 | 20% | 130.0 | 3.00 | 4.50 |
| SMS1050-680M | 68 | 20% | 210.0 | 2.00 | 3.00 |
| Part No | External Dimensions (LWH) (mm) | Inductance Tolerance Options | Packing Options |
|---|---|---|---|
| SMS1050 | 11.510.05.0 | J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | Bulk Package (B), Tape & Reel (T) |
| Parameter | Value | Notes |
|---|---|---|
| Operating Temperature | -55 to +125 | Including coils self-temperature rise |
| Frequency | Up to 3MHz | |
| Absolute Maximum Voltage | 30VDC | |
| Saturation Current Definition | Inductance drops 30% from its value without current | |
| Heat Rating Current Definition | DC current at which temperature rise is T 40 (Ta=25) | |
| Rated DC Current | The lesser value of Isat or Irms | |
| Test Equipment - Inductance (L) | WK3260B LCR meter or equivalent | |
| Test Equipment - Current (Isat & Irms) | WK3260B+WK3265B or equivalent | |
| Test Equipment - DCR | Chroma 16502 or equivalent |
| Dimensions | A (Max) | B (0.30) | C (Max) | D (Typ) | E (Typ) | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SMS1050 (mm) | 11.50 | 10.00 | 5.00 | 3.00 | 2.00 | 5.40 | 13.60 | 4.10 |
Packaging Specifications (Tape & Reel)
| Part No | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | Reel Quantity (PCS) | Inside Box Quantity (PCS) | Outside Carton Quantity (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS1050 | 24.0 | 16.0 | 11.5 | 24.4 | 100 | 13 | 330 | 500 | 1000 | 4000 |
Cover Tape Peel Off Condition
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing
| Test Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal | Pulling test (force depends on terminal area), Solder paste thickness: 0.12mm |
| Terminal Strength (DIP) | Meet requirements without any loose terminal | Pulling test (force depends on terminal diameter) |
| Resistance to Flexure | No visible mechanical damage | Flexure: 2mm, Pressurizing Speed: 0.5mm/sec, Keep time: 30 sec |
| Dropping | No case deformation or change in appearance, No short and no open | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction |
| Solderability | Wetting shall exceed 75% coverage, Terminals must have 95% minimum solder coverage | Solder temperature: 2402, Duration: 3 sec |
| Vibration | No visible mechanical damage, Inductance change: Within 10%, Q factor change: Within 20% | Frequency: 10 to 55 Hz, Total amplitude: 1.5mm, Duration: 2 hours in each 3 mutually perpendicular directions |
| Thermal Shock | No visible mechanical damage, Inductance change: Within 10% (Mn-Zn: Within 30%), Q factor change: Within 20% | 100 cycles of temperature cycling between (85~125) and (-55~40) |
| Low temperature Storage | No visible mechanical damage, Inductance change: Within 10% (Mn-Zn: Within 30%), Q factor change: Within 20% | Temperature: -55~-402, Duration: 962 hours |
| High temperature Storage | No visible mechanical damage, Inductance change: Within 10% (Mn-Zn: Within 30%), Q factor change: Within 20% | Temperature: 125~852, Duration: 962 hours |
| Damp Heat (Steady States) | No visible mechanical damage, Inductance change: Within 10% (Mn-Zn: Within 30%), Q factor change: Within 20% | Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours |
| Heat endurance of Reflow soldering | No significant defects in appearance, L/L10% (Mn-Zn: L/L30%), Q/Q30% (SMD series only), DCR/DCR10% | Peak temperature: 260+0/-5, Reflow twice |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking | Dip into IPA solvent for 50.5Min, dry for 5Min, brush 10 times |
| Overload test | During the test no smoke, no peculiar smell, no fire; Characteristic is normal after test | Apply twice rated current for 5 minutes |
| Voltage resistance test | During the test no breakdown; Characteristic is normal after test | DC1000V, Current: 1mA, Time: 1Min (For parts with two coils) |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm according to their specific environment/equipment.
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Solderability may deteriorate beyond this period.
- Environment: Do not use or store in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is on; ensure sufficient thermal design margin.
- Layout (Non-magnetic shield type): Carefully lay out coils to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina