Molding SMD Power Inductors - SMS1050 Series
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS1050 Series Ultra-high current SMD power inductors are designed for high-density installation applications requiring low DC resistance and ultra-high current capabilities in a thin profile. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors offer high reliability through an integral construction that provides excellent vibration resistance. Their composite structure minimizes buzz noise, while the use of low-loss alloy powder in die-casting ensures low impedance and small parasitic capacitance, leading to high efficiency and reduced core eddy-current loss. These inductors support frequencies up to 3MHz and have an absolute maximum voltage of 30VDC, complying with RoHS, Halogen Free, and REACH standards. They are ideal for applications such as PDA, notebooks, desktop and server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Type: Molding SMD Power Inductor
- Series: SMS1050
- Compliance: RoHS, Halogen Free, REACH
Technical Specifications
General Specifications
| Parameter | Value |
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) |
| Maximum Voltage | 30VDC |
| Frequency Support | Up to 3MHz |
Electrical Characteristics (Electrical specifications at 25)
| Part No. | Inductance (H) @ 100KHz, 1.0V | Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical |
| SMS1050-R82M | 0.82 | 20% | 2.5 | 3.2 | 39.00 | 22.00 |
| SMS1050-1R0M | 1.0 | 20% | 2.8 | 3.5 | 30.00 | 20.30 |
| SMS1050-1R2M | 1.2 | 20% | 2.8 | 3.5 | 28.00 | 18.00 |
| SMS1050-1R5M | 1.5 | 20% | 3.9 | 4.8 | 25.00 | 16.00 |
| SMS1050-2R2M | 2.2 | 20% | 6.5 | 8.2 | 20.00 | 13.00 |
| SMS1050-3R3M | 3.3 | 20% | 9.2 | 12.0 | 18.00 | 10.00 |
| SMS1050-4R7M | 4.7 | 20% | 12.4 | 18.0 | 14.00 | 9.50 |
| SMS1050-5R6M | 5.6 | 20% | 18.9 | 25.0 | 13.00 | 8.50 |
| SMS1050-6R8M | 6.8 | 20% | 20.6 | 28.0 | 12.00 | 8.00 |
| SMS1050-8R2M | 8.2 | 20% | 27.4 | 35.0 | 10.00 | 7.00 |
| SMS1050-100M | 10 | 20% | 30.2 | 40.0 | 8.50 | 5.50 |
| SMS1050-150M | 15 | 20% | 48.0 | 55.0 | 7.00 | 4.50 |
| SMS1050-220M | 22 | 20% | 60.0 | 72.0 | 5.50 | 4.00 |
| SMS1050-330M | 33 | 20% | 89.0 | 105.0 | 5.50 | 3.50 |
| SMS1050-470M | 47 | 20% | 110.0 | 130.0 | 4.50 | 3.00 |
| SMS1050-680M | 68 | 20% | 190.0 | 210.0 | 3.00 | 2.00 |
Inductance Tolerance Codes
| Code | Tolerance |
| J | 5% |
| K | 10% |
| L | 15% |
| M | 20% |
| P | 25% |
| N | 30% |
Packing Codes
| Code | Packing Type |
| B | Bulk Package |
| T | Tape & Reel |
Shape and Dimensions
| Part No. | A (Max) | B (0.30) | C (Max) | D (Typ) | E (Typ) | F | G | H |
| SMS1050 | 11.50 | 10.00 | 5.00 | 3.00 | 2.00 | 5.40 | 13.60 | 4.10 |
Test Equipment
| Measurement | Equipment |
| Inductance (L) | WK3260B LCR meter or equivalent |
| Current (Isat & Irms) | WK3260B+WK3265B or equivalent |
| DC Resistance (DCR) | Chroma 16502 or equivalent |
Definitions
| Term | Definition |
| Saturation Current | DC current at which inductance drops 30% from its value without current. |
| Heat Rating Current | The actual value of DC current when the temperature rise is T 40 (Ta=25). |
| Rated DC Current | The lesser value of Isat or Irms. |
Reminders for Using These Products
- Storage period is within 12 months. Storage conditions: temperature 5~40C, humidity 35~65% RH or less.
- Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Avoid direct contact with terminals by bare hands due to potential soldering inhibition from oil secretions.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals excessively to avoid wire fracture.
- Do not rinse coils; contact for cleaning if necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip temperature should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance degradation, or lifespan reduction due to overheating.
- Sufficient thermal design margin is required due to self-heating when power is on.
- For non-magnetic shield types, careful coil layout is needed on the circuit board to prevent malfunctions due to magnetic interference.
