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SMD power inductor LanTu Micro SMS1770 3R3MT designed for DC DC converters and distributed power systems

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Product Description

Product Overview

The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS1770 Series Ultra-high current SMD power inductors are designed for high-density installations requiring strong anti-electromagnetic interference. These thin-profile inductors feature low DC resistance and ultra-high current capabilities, achieved through an integral construction for high reliability and vibration resistance. Their composite structure minimizes buzz noise, while the low-loss alloy powder die-casting ensures low impedance and small parasitic capacitance. With high efficiency and frequencies up to 3MHz, these inductors are suitable for PDA, notebook, desktop, server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SMS1770
  • Type: Molding SMD Power Inductor
  • Certifications: RoHS, Halogen Free and REACH Compliance
  • Origin: Shenzhen, China (Implied by company name and location)

Technical Specifications

General Specifications

Parameter Value Unit
Operating Temperature -55 to +125 (Including coils self-temperature rise)
Frequency Up to 3 MHz
Absolute Maximum Voltage 30 VDC

Product Identification

SMS 1770 100 M T

  • Series: SMS
  • Model Number: 1770
  • Inductance: 100 (e.g., 10 uH)
  • Tolerance: M (20%)
  • Type: T (Implied Molding SMD Power Inductor)

External Dimensions

Part No. L W H A B C D E F G H
SMS1770 17.50 0.50 17.15 0.30 7.50 Max 17.5 0.50 17.15 0.30 7.50 Max 12.0 Typ 2.50 Typ 12.4 19.5 12.5

Dimensions are in mm.

Electrical Characteristics

Part No. Inductance (H) @ 0A Tol. L (100KHz, 1.0V) Typical DCR (m) Typical Saturation Current (A) Typical Heat Rating Current (A) Typical
SMS1770-R22M 0.22 20% 0.63 0.75 75.00 57.00
SMS1770-R47M 0.47 20% 0.90 1.03 72.00 55.00
SMS1770-1R0M 1.0 20% 1.60 2.30 55.00 32.00
SMS1770-1R5M 1.5 20% 1.78 2.50 48.00 31.00
SMS1770-2R2M 2.2 20% 2.40 2.70 34.00 29.00
SMS1770-3R3M 3.3 20% 3.68 4.20 30.00 24.00
SMS1770-4R7M 4.7 20% 4.84 5.50 24.00 21.00
SMS1770-5R6M 5.6 20% 6.68 7.60 23.00 20.00
SMS1770-6R8M 6.8 20% 8.40 9.20 22.00 17.00
SMS1770-8R2M 8.2 20% 10.10 11.60 20.00 13.00
SMS1770-100M 10 20% 11.60 13.00 19.00 12.00
SMS1770-150M 15 20% 18.80 20.50 14.50 11.00
SMS1770-220M 22 20% 25.10 26.50 11.50 8.50
SMS1770-330M 33 20% 38.00 44.00 10.00 8.00
SMS1770-470M 47 20% 48.00 55.00 7.50 6.00
SMS1770-560M 56 20% 54.00 62.00 7.00 5.50
SMS1770-680M 68 20% 68.00 80.00 6.50 5.20
SMS1770-101M 100 20% 110.00 118.00 5.00 3.70

Definitions:

  • Saturation Current: DC current at which inductance drops 30% from its value without current.
  • Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
  • Rated DC Current: The lesser value of Isat or Irms.

Inductance Tolerance Options

Code Tolerance
J 5%
K 10%
L 15%
M 20%
P 25%
N 30%

Packaging Options

Code Package Type
B Bulk Package
TF Tape & Reel

Recommended Land Pattern

Part No. A B C D E F G H
SMS1770 17.50.50 17.150.30 7.50 Max 12.0 Typ 2.50 Typ 12.4 19.5 12.5

Dimensions are in mm.

Tape and Reel Specifications

Part No. Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
SMS1770 32.0 24.0 14.2 32.4 100 13 330 300 600 2400

Cover Tape Peel Off Condition

  • Cover tape peel force: 10 to 120g
  • Noodle strip peeling angle: 165 to 180

Reliability Testing

Item Requirements Test Methods and Remarks
Terminal Strength (SMT) Meet requirements without any loose terminal. Pulling test based on terminal sectional area (e.g., A8mm, force5N, time:30sec). Solder paste thickness: 0.12mm. Force applied gradually, maintained for 101s at 1.0mm/s speed.
Terminal Strength (DIP) Meet requirements without any loose terminal. Pull Force based on terminal diameter (e.g., 0.35d0.50mm, Applied force:5N, Duration:10sec). Force applied gradually, maintained for 10 seconds.
Resistance to Flexure No visible mechanical damage. Solder inductor to test jig. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec.
Dropping No case deformation or change in appearance. No short and no open. Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction.
Solderability Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol.
Vibration No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Subjected to simple harmonic motion (10 to 55 Hz). Applied for 2 hours in each of 3 mutually perpendicular directions.
Thermal Shock No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. 100 cycles of temperature shock between (85~125) and (-55~40). Transforming interval: Max. 20 sec.
Low temperature Storage No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Temperature: -55~-402. Duration: 962 hours.
High temperature Storage No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Temperature: 125~852. Duration: 962 hours.
Damp Heat (Steady States) No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours.
Heat endurance of Reflow soldering No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. Dip parts into IPA solvent for 50.5Min, dry for 5Min, brushing 10 times.
Overload test During test no smoke, no peculiar smell, no fire. Characteristics normal after test. Apply twice the rated current for 5 minutes.
Voltage resistance test During test no breakdown. Characteristics normal after test. DC1000V, Current: 1mA, Time: 1Min.

Recommended Reflow Soldering Curve

The recommended reflow conditions are set according to soldering equipment. Users should adjust and confirm according to their specific environment/equipment.

Reminders for Using These Products

  • Storage: Within 12 months, at 5~40C and 35~65% RH. Soldering of terminal electrodes may deteriorate if storage period elapses.
  • Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
  • Handling: Avoid direct contact with terminals by bare hands due to oil secretions. Handle products carefully to prevent damage from dropping or inappropriate removal.
  • Bending: Do not bend terminals with excessive stress to prevent wire fracture.
  • Cleaning: Do not rinse coils. Contact SXN if cleaning is necessary.
  • Magnetic Fields: Do not expose products to magnets or magnetic fields.
  • Preheating: Preheat components before soldering. Temperature difference between solder and chip temperature should not exceed 150C.
  • Soldering Corrections: Corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or lifespan reduction.
  • Thermal Design: Allow sufficient margin for self-heating (temperature increase) when power is ON.
  • Layout (Non-magnetic Shield Type): Carefully lay out coils to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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