Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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Molding SMD Power Inductors LanTu Micro SMS1360-100MT with Ultra High Current and Low DC Resistance

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Product Description

Molding SMD Power Inductors - SMS1360 Series

Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS1360 Series offers ultra-high current SMD power inductors designed for high-density installation. These inductors feature a thin profile with low DC resistance and ultra-high current capability. Their magnetic shielding provides strong anti-electromagnetic interference, while the integral construction ensures high reliability and excellent vibration resistance. The composite structure contributes to ultra-low buzz noise and low loss, achieved through die-casting with low-loss alloy powder, resulting in low impedance and small parasitic capacitance. These inductors are highly efficient, reducing winding DC resistance and core eddy-current loss, and operate at frequencies up to 3MHz with an absolute maximum voltage of 30VDC. They are compliant with RoHS, Halogen Free, and REACH standards.

Applications
Suitable for PDA, notebook, desktop, and server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Product Type: Molding SMD Power Inductor
  • Series: SMS1360
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Construction: Integral, Magnetic Shielding

Technical Specifications

General Specifications

Parameter Value Notes
Operating Temperature -55 to +125 (Including coils self-temperature rise)
Absolute Maximum Voltage 30VDC
Frequency Up to 3MHz
Test Equipment (Inductance) WK3260B LCR meter or equivalent
Test Equipment (Current) WK3260B+WK3265B or equivalent
Test Equipment (DCR) Chroma 16502 or equivalent

Electrical Characteristics (at 25)

Part No. Inductance (H) Tolerance DCR (m) Typical Saturation Current (A) Typical Heat Rating Current (A) Typical
SMS1360-R68M 0.68 20% 1.4 1.6 55.00
SMS1360-1R0M 1.0 20% 1.7 2.0 35.00
SMS1360-2R2M 2.2 20% 3.5 4.2 25.00
SMS1360-3R3M 3.3 20% 5.5 6.8 22.00
SMS1360-4R7M 4.7 20% 8.0 9.0 18.00
SMS1360-6R8M 6.8 20% 10.0 14.0 15.00
SMS1360-8R2M 8.2 20% 13.5 16.0 14.00
SMS1360-100M 10 20% 18.0 21.0 12.50
SMS1360-220M 22 20% 34.0 38.0 8.00
SMS1360-270M 27 20% 45.0 56.0 7.00
SMS1360-330M 33 20% 56.0 70.0 6.50
SMS1360-470M 47 20% 70.0 90.0 6.00
SMS1360-680M 68 20% 105.0 125.0 5.00
SMS1360-820M 82 20% 115.0 140.0 4.00
SMS1360-101M 100 20% 130.0 200.0 3.00

Inductance Tolerance Codes

Code Tolerance
J 5%
K 10%
L 15%
M 20%
P 25%
N 30%

Packaging Codes

Code Description
B Bulk Package
T Tape & Reel

Dimensions (mm)

Part No. A (L) B (W) C (H) D (Typ) E (Typ) F G H
SMS1360 13.800.50 12.600.20 7.00Max 3.70 2.50 8.00 14.60 5.00

Definitions

Saturation Current: DC current at which inductance drops 30% from its value without current.
Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
Rated DC Current: The lesser of Isat or Irms.
Note: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

Packaging Quantity

Part No. Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
SMS1360 24.0 16.0 11.5 24.4 100 13 330 500 1000 4000

Recommended Reflow Soldering Curve

The recommended reflow conditions are set according to our soldering equipment. Please adjust and confirm according to user's environment/equipment.

Reminders for Using These Products

  • Storage period is within 12 months. Storage conditions: 5~40C, 35~65% RH.
  • Do not use or store in environments with gas corrosion (salt, acid, alkali, etc.).
  • Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability.
  • Handle products carefully to prevent damage from dropping or improper removal.
  • Do not bend terminals with excessive stress to avoid wire fracture.
  • Do not rinse coils. Contact SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. if cleaning is necessary.
  • Do not expose products to magnets or magnetic fields.
  • Preheat components before soldering. The temperature difference between solder and chip should not exceed 150C.
  • Soldering corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or lifespan reduction.
  • Allow for sufficient thermal design margin due to self-heating when power is on.
  • For non-magnetic shielded types, careful layout is required to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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