High Accuracy LanTu Micro SDRI129-221MT Shielded SMD Power Inductors with Closed Magnetic Circuit Design

Product Overview

The SDRI129 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power supply applications. Featuring a closed magnetic circuit for reduced leakage, high saturation current, and low DCR, these inductors offer high accuracy dimensions suitable for automatic mounting. They are available in various package sizes and inductance ranges, complying with RoHS, Halogen Free, and REACH standards. Ideal for use in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.

Product Attributes

• Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Product Series: SDRI129 Series
• Type: Shielded SMD Power Inductors
• Magnetic Circuit Design: Closed magnetic circuit
• Certifications: RoHS, Halogen Free, REACH Compliance
• Mounting Type: SMD (Surface Mount Device)
• Packaging Options: Bulk Package (B), Tape & Reel (T)

Technical Specifications

Environmental Data:

• Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment:

• Inductance (L): HP4284A, HP4285A LCR meter or equivalent
• Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284A+42841A or equivalent
• DC Resistance (DCR): Chroma 16502 or equivalent

Definitions:

• Saturation Current: DC current at which inductance drops 25% from its value without current.
• Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
• Rated DC Current: The lesser value of Isat or Irms.

Note: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

Packaging Information

Cover tape peel off condition:

• Cover tape peel force: 10 to 120g
• Noodle strip peeling angle: 165 to 180

Reliability Testing

Recommended Reflow Soldering Curve

The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.

Reminders for Using These Products

• Storage: Within 12 months under conditions of 5~40C and 35~65% RH. Soldering of terminal electrodes may deteriorate if storage period elapses.
• Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
• Handling: Avoid direct contact with terminals by bare hands due to oil secretions that inhibit soldering. Handle products carefully to prevent damage.
• Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
• Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
• Magnetic Fields: Do not expose products to magnets or magnetic fields.
• Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
• Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance deterioration, or lifespan reduction.
• Thermal Design: Allow sufficient margin for thermal design as self-heating occurs when power is on.
• Layout (Non-magnetic Shield Type): Carefully lay out coils on the PCB to prevent malfunctions due to magnetic interference.